ES2078390T3 - Agente y metodo de eliminacion de fundentes de soldadura a base de colofonia. - Google Patents
Agente y metodo de eliminacion de fundentes de soldadura a base de colofonia.Info
- Publication number
- ES2078390T3 ES2078390T3 ES91110600T ES91110600T ES2078390T3 ES 2078390 T3 ES2078390 T3 ES 2078390T3 ES 91110600 T ES91110600 T ES 91110600T ES 91110600 T ES91110600 T ES 91110600T ES 2078390 T3 ES2078390 T3 ES 2078390T3
- Authority
- ES
- Spain
- Prior art keywords
- elevated
- tin
- colophony
- elimination
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract 3
- 230000008030 elimination Effects 0.000 title 1
- 238000003379 elimination reaction Methods 0.000 title 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 2
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 abstract 2
- 239000012459 cleaning agent Substances 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- -1 METHYL GROUP Chemical group 0.000 abstract 1
- 229910019142 PO4 Inorganic materials 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 abstract 1
- 239000002736 nonionic surfactant Substances 0.000 abstract 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 abstract 1
- 239000010452 phosphate Substances 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/83—Mixtures of non-ionic with anionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/34—Derivatives of acids of phosphorus
- C11D1/345—Phosphates or phosphites
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/24—Cleaning or pickling metallic material with solutions or molten salts with neutral solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Detergent Compositions (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
ESTA INVENCION SUMINISTRA UN AGENTE LIMPIADOR PARA QUITAR FUNDENTE DE ESTAÑOSOLDAR DE BASE DE RESINA. EL AGENTE LIMPIADOR CONSTA DE UNA MEZCLA DE: (A) AL MENOS UN COMPUESTO DE ETER GLICOL DE FORMULA (1) DONDE R ELEVADO 1 ES UN ATOMO DE HIDROGENO O UN GRUPO ALQUILO CON DE 1 A 5 ATOMOS DE CARBONO; R ELEVADO 2 ES UN GRUPO ALQUILO CON DE 1 A 5 ATOMOS DE CARBONO; R ELEVADO 3 ES UN ATOMO DE HIDROGENO O UN GRUPO METILO, Y K ES UN NUMERO DE 2 A 4. (B) ES AL MENOS UN SURFACTANTE NO-IONICO, Y (C) ES AL MENOS UN SURFACTANTE ANIONICO DE FOSFATO. TAMBIEN SE SUMINISTRA UN METODO PARA LIMPIAR EL FUNDENTE DE ESTAÑOSOLDAR DE BASE DE RESINA, METODO QUE COMPRENDE LA MEZCLA DEL COMPONENTE ANTERIORMENTE DESCRITO CON EL FUNDENTE DE ESTAÑOSOLDAR DE BASE DE RESINA.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2170657A JPH0457899A (ja) | 1990-06-27 | 1990-06-27 | ロジン系ハンダフラックスの洗浄剤および該洗浄剤を用いてなるロジン系ハンダフラックスの洗浄方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2078390T3 true ES2078390T3 (es) | 1995-12-16 |
Family
ID=15908948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES91110600T Expired - Lifetime ES2078390T3 (es) | 1990-06-27 | 1991-06-26 | Agente y metodo de eliminacion de fundentes de soldadura a base de colofonia. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5256209A (es) |
| EP (1) | EP0464652B1 (es) |
| JP (1) | JPH0457899A (es) |
| KR (1) | KR100241565B1 (es) |
| DE (1) | DE69113139T2 (es) |
| ES (1) | ES2078390T3 (es) |
| PT (1) | PT98099A (es) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2610552B2 (ja) * | 1991-10-04 | 1997-05-14 | 花王株式会社 | 洗浄方法 |
| JPH0625878A (ja) * | 1992-03-27 | 1994-02-01 | Sanyo Chem Ind Ltd | 金属表面用洗浄剤組成物 |
| JP2652298B2 (ja) * | 1992-04-30 | 1997-09-10 | 花王株式会社 | 精密部品又は治工具類用洗浄剤組成物 |
| JP2893497B2 (ja) * | 1992-04-30 | 1999-05-24 | 花王株式会社 | 精密部品又は治工具類用洗浄剤組成物 |
| US5547601A (en) * | 1992-09-09 | 1996-08-20 | Jnj Industries, Inc. | CFC-free solvent for solvating solder flux |
| KR970007329B1 (ko) * | 1993-09-17 | 1997-05-07 | 마쯔시다덴기산교 가부시기가이샤 | 납땜플럭스제거용 세정제조성물 |
| DE4411677C1 (de) * | 1994-04-05 | 1995-10-26 | Mtu Muenchen Gmbh | Verfahren zum Entfernen organischer Materialien von Triebwerkskomponenten |
| JP2813862B2 (ja) * | 1994-07-05 | 1998-10-22 | 荒川化学工業株式会社 | 洗浄剤組成物 |
| EP1147067A4 (en) * | 1998-11-25 | 2002-10-09 | Petroferm Inc | AQUEOUS CLEANING COMPOSITION |
| US7238653B2 (en) * | 2003-03-10 | 2007-07-03 | Hynix Semiconductor Inc. | Cleaning solution for photoresist and method for forming pattern using the same |
| JP5428859B2 (ja) | 2007-08-08 | 2014-02-26 | 荒川化学工業株式会社 | 鉛フリーハンダフラックス除去用洗浄剤組成物、および鉛フリーハンダフラックスの除去方法 |
| US8211845B2 (en) | 2008-08-27 | 2012-07-03 | Arakawa Chemical Industries, Ltd. | Cleaning composition for removing lead-free solder flux and system for removing lead-free solder flux |
| JP5857740B2 (ja) | 2009-09-03 | 2016-02-10 | 荒川化学工業株式会社 | 鉛フリーハンダ水溶性フラックス除去用洗浄剤、除去方法及び洗浄方法 |
| US8070046B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Amine flux composition and method of soldering |
| US8070045B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable amine flux composition and method of soldering |
| JP5696981B2 (ja) * | 2011-09-02 | 2015-04-08 | 荒川化学工業株式会社 | はんだ付けフラックス用洗浄剤組成物 |
| US9051507B2 (en) * | 2012-03-23 | 2015-06-09 | Intevep, S.A. | Completion fluid |
| US9277638B2 (en) * | 2013-03-14 | 2016-03-01 | Raytheon Company | Gum rosin protective coating and methods of use |
| CN104294297A (zh) * | 2014-09-30 | 2015-01-21 | 苏州长盛机电有限公司 | 一种水基金属清洗剂及其制备方法 |
| JP6822440B2 (ja) | 2017-05-26 | 2021-01-27 | 荒川化学工業株式会社 | 鉛フリーはんだフラックス用洗浄剤組成物、鉛フリーはんだフラックスの洗浄方法 |
| WO2020116534A1 (ja) * | 2018-12-05 | 2020-06-11 | 花王株式会社 | フラックス残渣の洗浄 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE858485C (de) * | 1943-03-18 | 1952-12-08 | American Chem Paint Co | Reinigungsmittel fuer Metalloberflaechen |
| EP0037161B1 (en) * | 1980-02-05 | 1983-11-23 | Kao Corporation | Creamy cleansing compositions |
| US4493782A (en) * | 1983-07-07 | 1985-01-15 | Amchem Products, Inc. | Cleansing compositions comprising ethoxylated alcohol monoesters of phosphoric acid |
| US4640719A (en) * | 1985-07-01 | 1987-02-03 | Petroleum Fermentations N.V. | Method for printed circuit board and/or printed wiring board cleaning |
| DE3541535A1 (de) * | 1985-11-25 | 1987-05-27 | Henkel Kgaa | Verwendung von polyglykoldialkylethern als viskositaetsregler fuer waessrige aniontensidloesungen |
| EP0294574A3 (de) * | 1987-06-06 | 1989-04-26 | Degussa Aktiengesellschaft | Wässrige stabile Suspension wasserunlöslicher zum Binden von Calciumionen befähigter Silikate und deren Verwendung zur Herstellung von Wasch- und Reinigungsmitteln |
| US4983224A (en) * | 1988-10-28 | 1991-01-08 | Rd Chemical Company | Cleaning compositions and methods for removing soldering flux |
| DE69003350T2 (de) * | 1989-11-08 | 1994-01-13 | Arakawa Chem Ind | Zusammensetzung und Verfahren zur Entfernung von Lotflussmittel auf Kolophoniumbasis. |
-
1990
- 1990-06-27 JP JP2170657A patent/JPH0457899A/ja not_active Expired - Lifetime
-
1991
- 1991-06-24 US US07/720,148 patent/US5256209A/en not_active Expired - Lifetime
- 1991-06-26 PT PT98099A patent/PT98099A/pt not_active Application Discontinuation
- 1991-06-26 ES ES91110600T patent/ES2078390T3/es not_active Expired - Lifetime
- 1991-06-26 EP EP91110600A patent/EP0464652B1/en not_active Expired - Lifetime
- 1991-06-26 DE DE69113139T patent/DE69113139T2/de not_active Expired - Fee Related
- 1991-06-27 KR KR1019910010821A patent/KR100241565B1/ko not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| PT98099A (pt) | 1992-05-29 |
| US5256209A (en) | 1993-10-26 |
| JPH0457899A (ja) | 1992-02-25 |
| EP0464652B1 (en) | 1995-09-20 |
| DE69113139D1 (de) | 1995-10-26 |
| EP0464652A1 (en) | 1992-01-08 |
| KR920000973A (ko) | 1992-01-29 |
| KR100241565B1 (ko) | 2000-03-02 |
| DE69113139T2 (de) | 1996-05-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG2A | Definitive protection |
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