FR2449334A1 - Procede d'integration monolithique de circuits logiques, de commande et d'interface a hautes performances - Google Patents

Procede d'integration monolithique de circuits logiques, de commande et d'interface a hautes performances

Info

Publication number
FR2449334A1
FR2449334A1 FR8003357A FR8003357A FR2449334A1 FR 2449334 A1 FR2449334 A1 FR 2449334A1 FR 8003357 A FR8003357 A FR 8003357A FR 8003357 A FR8003357 A FR 8003357A FR 2449334 A1 FR2449334 A1 FR 2449334A1
Authority
FR
France
Prior art keywords
control
interface circuits
monolithic integration
performance logic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8003357A
Other languages
English (en)
French (fr)
Other versions
FR2449334B1 (2
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of FR2449334A1 publication Critical patent/FR2449334A1/fr
Application granted granted Critical
Publication of FR2449334B1 publication Critical patent/FR2449334B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0175—Coupling arrangements; Interface arrangements
    • H03K19/018—Coupling arrangements; Interface arrangements using bipolar transistors only
    • H03K19/01825—Coupling arrangements, impedance matching circuits
    • H03K19/01831—Coupling arrangements, impedance matching circuits with at least one differential stage
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
    • G05F3/00—Non-retroactive systems for regulating electric variables by using an uncontrolled element, or an uncontrolled combination of elements, such element or such combination having self-regulating properties
    • G05F3/02—Regulating voltage or current
    • G05F3/08—Regulating voltage or current wherein the variable is DC
    • G05F3/10—Regulating voltage or current wherein the variable is DC using uncontrolled devices with non-linear characteristics
    • G05F3/16—Regulating voltage or current wherein the variable is DC using uncontrolled devices with non-linear characteristics being semiconductor devices
    • G05F3/20—Regulating voltage or current wherein the variable is DC using uncontrolled devices with non-linear characteristics being semiconductor devices using diode- transistor combinations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0107—Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0107—Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs
    • H10D84/0109—Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs the at least one component covered by H10D12/00 or H10D30/00 being a MOS device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
    • H10D84/401—Combinations of FETs or IGBTs with BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85—Complementary IGFETs, e.g. CMOS
    • H10D84/856—Complementary IGFETs, e.g. CMOS the complementary IGFETs having different architectures than each other, e.g. high-voltage and low-voltage CMOS
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/031—Manufacture or treatment of isolation regions comprising PN junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/30—Isolation regions comprising PN junctions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Automation & Control Theory (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Logic Circuits (AREA)
FR8003357A 1979-02-15 1980-02-15 Procede d'integration monolithique de circuits logiques, de commande et d'interface a hautes performances Granted FR2449334A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/012,267 US4325180A (en) 1979-02-15 1979-02-15 Process for monolithic integration of logic, control, and high voltage interface circuitry

Publications (2)

Publication Number Publication Date
FR2449334A1 true FR2449334A1 (fr) 1980-09-12
FR2449334B1 FR2449334B1 (2) 1984-12-14

Family

ID=21754142

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8003357A Granted FR2449334A1 (fr) 1979-02-15 1980-02-15 Procede d'integration monolithique de circuits logiques, de commande et d'interface a hautes performances

Country Status (4)

Country Link
US (1) US4325180A (2)
JP (1) JPS55146944A (2)
FR (1) FR2449334A1 (2)
NL (1) NL189633C (2)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2571178A1 (fr) * 1984-09-28 1986-04-04 Thomson Csf Structure de circuit integre comportant des transistors cmos a tenue en tension elevee, et son procede de fabrication
FR2606212A1 (fr) * 1986-11-04 1988-05-06 Samsung Semiconductor Tele Procede de fabrication d'un composant bicmos
EP0279943A1 (en) * 1982-07-12 1988-08-31 Hitachi, Ltd. Gate circuit of combined field-effect and bipolar transistors
US5239212A (en) * 1982-07-12 1993-08-24 Hitachi, Ltd. Gate circuit of combined field-effect and bipolar transistors with an improved discharge arrangement

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4403395A (en) * 1979-02-15 1983-09-13 Texas Instruments Incorporated Monolithic integration of logic, control and high voltage interface circuitry
JPS55156366A (en) * 1979-05-24 1980-12-05 Toshiba Corp Semiconductor device
US4455566A (en) * 1979-06-18 1984-06-19 Fujitsu Limited Highly integrated semiconductor memory device
JPS567463A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Semiconductor device and its manufacture
US4409725A (en) * 1980-10-16 1983-10-18 Nippon Gakki Seizo Kabushiki Kaisha Method of making semiconductor integrated circuit
EP0054303B1 (en) * 1980-12-17 1986-06-11 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit
NL8104862A (nl) * 1981-10-28 1983-05-16 Philips Nv Halfgeleiderinrichting, en werkwijze ter vervaardiging daarvan.
US4454648A (en) * 1982-03-08 1984-06-19 Mcdonnell Douglas Corporation Method of making integrated MNOS and CMOS devices in a bulk silicon wafer
DE3272436D1 (en) * 1982-05-06 1986-09-11 Itt Ind Gmbh Deutsche Method of making a monolithic integrated circuit with at least one isolated gate field effect transistor and one bipolar transistor
JPS5931052A (ja) * 1982-08-13 1984-02-18 Hitachi Ltd 半導体集積回路装置の製造方法
US4673965A (en) * 1983-02-22 1987-06-16 General Motors Corporation Uses for buried contacts in integrated circuits
US4553318A (en) * 1983-05-02 1985-11-19 Rca Corporation Method of making integrated PNP and NPN bipolar transistors and junction field effect transistor
JPS6058657A (ja) * 1983-09-12 1985-04-04 Hitachi Ltd 半導体集積回路装置
JPS6080267A (ja) * 1983-10-07 1985-05-08 Toshiba Corp 半導体集積回路装置の製造方法
US5610089A (en) * 1983-12-26 1997-03-11 Hitachi, Ltd. Method of fabrication of semiconductor integrated circuit device
US5276346A (en) * 1983-12-26 1994-01-04 Hitachi, Ltd. Semiconductor integrated circuit device having protective/output elements and internal circuits
JPH0695563B2 (ja) * 1985-02-01 1994-11-24 株式会社日立製作所 半導体装置
EP0151347B1 (en) * 1984-01-16 1988-10-26 Texas Instruments Incorporated Integrated circuit having bipolar and field effect devices and method of fabrication
US5298462A (en) * 1984-11-30 1994-03-29 Robert Bosch Gmbh Method of making metallization for semiconductor device
JPH0652792B2 (ja) * 1985-02-26 1994-07-06 日産自動車株式会社 半導体装置
US5324982A (en) * 1985-09-25 1994-06-28 Hitachi, Ltd. Semiconductor memory device having bipolar transistor and structure to avoid soft error
IT1188609B (it) * 1986-01-30 1988-01-20 Sgs Microelettronica Spa Procedimento per la fabbricazione di dispositivi monolitici a semiconduttore contenenti transistori bipolari a giunzione,transistori cmos e dmos complementari e diodi a bassa perdita
US4717678A (en) * 1986-03-07 1988-01-05 International Business Machines Corporation Method of forming self-aligned P contact
IT1188465B (it) * 1986-03-27 1988-01-14 Sgs Microelettronica Spa Rpocedimento per la fabbricazione di circuiti integrati a semiconduttore includenti dispositiv cmos e dispositivi elettronici ad alta tensione
US4956700A (en) * 1987-08-17 1990-09-11 Siliconix Incorporated Integrated circuit with high power, vertical output transistor capability
US4914051A (en) * 1988-12-09 1990-04-03 Sprague Electric Company Method for making a vertical power DMOS transistor with small signal bipolar transistors
JPH0316123A (ja) * 1989-03-29 1991-01-24 Mitsubishi Electric Corp イオン注入方法およびそれにより製造される半導体装置
US5429959A (en) * 1990-11-23 1995-07-04 Texas Instruments Incorporated Process for simultaneously fabricating a bipolar transistor and a field-effect transistor
US5321283A (en) * 1991-07-30 1994-06-14 Microwave Technology, Inc. High frequency JFET
US5296409A (en) * 1992-05-08 1994-03-22 National Semiconductor Corporation Method of making n-channel and p-channel junction field-effect transistors and CMOS transistors using a CMOS or bipolar/CMOS process
US5374569A (en) * 1992-09-21 1994-12-20 Siliconix Incorporated Method for forming a BiCDMOS
US5618688A (en) * 1994-02-22 1997-04-08 Motorola, Inc. Method of forming a monolithic semiconductor integrated circuit having an N-channel JFET
JP3402400B2 (ja) * 1994-04-22 2003-05-06 株式会社半導体エネルギー研究所 半導体集積回路の作製方法
JPH08172139A (ja) * 1994-12-19 1996-07-02 Sony Corp 半導体装置製造方法
US5985708A (en) * 1996-03-13 1999-11-16 Kabushiki Kaisha Toshiba Method of manufacturing vertical power device
JPH1032274A (ja) * 1996-04-12 1998-02-03 Texas Instr Inc <Ti> Ｃｍｏｓプロセスによるバイポーラートランジスタ作製方法
US5849613A (en) * 1997-10-23 1998-12-15 Chartered Semiconductor Manufacturing Ltd. Method and mask structure for self-aligning ion implanting to form various device structures
US5907168A (en) * 1998-01-23 1999-05-25 Tlc Precision Wafer Technology, Inc. Low noise Ge-JFETs
EP0936674B1 (en) * 1998-02-10 2006-04-26 STMicroelectronics S.r.l. Integrated circuit comprising a VDMOS transistor protected against overvoltages between source and gate
US6117718A (en) * 1999-08-31 2000-09-12 United Microelectronics Corp. Method for forming BJT via formulation of high voltage device in ULSI
JP2002043557A (ja) * 2000-07-21 2002-02-08 Mitsubishi Electric Corp 固体撮像素子を有する半導体装置およびその製造方法
US6818494B1 (en) 2001-03-26 2004-11-16 Hewlett-Packard Development Company, L.P. LDMOS and CMOS integrated circuit and method of making
US6710424B2 (en) 2001-09-21 2004-03-23 Airip RF chipset architecture
US20050250272A1 (en) * 2004-05-03 2005-11-10 Holm-Kennedy James W Biosensor performance enhancement features and designs
US7781843B1 (en) 2007-01-11 2010-08-24 Hewlett-Packard Development Company, L.P. Integrating high-voltage CMOS devices with low-voltage CMOS
KR102138385B1 (ko) 2014-03-06 2020-07-28 매그나칩 반도체 유한회사 저 비용의 반도체 소자 제조방법
FR3045937A1 (fr) * 2015-12-21 2017-06-23 St Microelectronics Crolles 2 Sas Procede de fabrication d'un transistor jfet au sein d'un circuit integre et circuit integre correspondant.
CN107785305A (zh) * 2016-08-31 2018-03-09 无锡华润上华科技有限公司 集成耗尽型结型场效应晶体管的器件

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GB1400574A (en) * 1971-08-26 1975-07-16 Sony Corp Field effect transistors
US3898107A (en) * 1973-12-03 1975-08-05 Rca Corp Method of making a junction-isolated semiconductor integrated circuit device
US4120707A (en) * 1977-03-30 1978-10-17 Harris Corporation Process of fabricating junction isolated IGFET and bipolar transistor integrated circuit by diffusion

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US3863330A (en) * 1973-08-02 1975-02-04 Motorola Inc Self-aligned double-diffused MOS devices
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US4047217A (en) * 1976-04-12 1977-09-06 Fairchild Camera And Instrument Corporation High-gain, high-voltage transistor for linear integrated circuits
US4068254A (en) * 1976-12-13 1978-01-10 Precision Monolithics, Inc. Integrated FET circuit with input current cancellation
US4225877A (en) * 1978-09-05 1980-09-30 Sprague Electric Company Integrated circuit with C-Mos logic, and a bipolar driver with polysilicon resistors

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Publication number Priority date Publication date Assignee Title
GB1400574A (en) * 1971-08-26 1975-07-16 Sony Corp Field effect transistors
US3898107A (en) * 1973-12-03 1975-08-05 Rca Corp Method of making a junction-isolated semiconductor integrated circuit device
US4120707A (en) * 1977-03-30 1978-10-17 Harris Corporation Process of fabricating junction isolated IGFET and bipolar transistor integrated circuit by diffusion

Non-Patent Citations (2)

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Title
INTERNATIONAL ELECTRON DEVICES MEETING, Technical Digest 1977, décembre 1977 (WASHINGTON, US) K. MURAKAMI et al. "Double ion implanted DSAMOS-bipolar devices", pages 186-189 *
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, volume 121, no. 8, août 1974 (PRINCETON, US) M. DARWISH et al. "C-MOS and complementary isolated bipolar transistor monolithic integration process", pages 1119-1122 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0279943A1 (en) * 1982-07-12 1988-08-31 Hitachi, Ltd. Gate circuit of combined field-effect and bipolar transistors
EP0543426A1 (en) * 1982-07-12 1993-05-26 Hitachi, Ltd. Gate circuit of combined field-effect and bipolar transistors
US5239212A (en) * 1982-07-12 1993-08-24 Hitachi, Ltd. Gate circuit of combined field-effect and bipolar transistors with an improved discharge arrangement
FR2571178A1 (fr) * 1984-09-28 1986-04-04 Thomson Csf Structure de circuit integre comportant des transistors cmos a tenue en tension elevee, et son procede de fabrication
EP0179693A1 (fr) * 1984-09-28 1986-04-30 Thomson-Csf Structure de circuit intégré comportant des transistors CMOS à tenue en tension élevée, et son procédé de fabrication
FR2606212A1 (fr) * 1986-11-04 1988-05-06 Samsung Semiconductor Tele Procede de fabrication d'un composant bicmos

Also Published As

Publication number Publication date
US4325180A (en) 1982-04-20
FR2449334B1 (2) 1984-12-14
NL189633C (nl) 1993-06-01
JPS55146944A (en) 1980-11-15
NL189633B (nl) 1993-01-04
NL8000665A (nl) 1980-08-19

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