HRP20090045T3 - Postupak postavljanja nekog elektroničkog sklopa na supstrat i uređaj za montažu takvog sklopa - Google Patents

Postupak postavljanja nekog elektroničkog sklopa na supstrat i uređaj za montažu takvog sklopa

Info

Publication number
HRP20090045T3
HRP20090045T3 HR20090045T HRP20090045T HRP20090045T3 HR P20090045 T3 HRP20090045 T3 HR P20090045T3 HR 20090045 T HR20090045 T HR 20090045T HR P20090045 T HRP20090045 T HR P20090045T HR P20090045 T3 HRP20090045 T3 HR P20090045T3
Authority
HR
Croatia
Prior art keywords
substrate
applying
segment
assembly
electronic assembly
Prior art date
Application number
HR20090045T
Other languages
English (en)
Inventor
Droz Franois
Original Assignee
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP05100694A external-priority patent/EP1686512A1/fr
Application filed by Nagraid Sa filed Critical Nagraid Sa
Publication of HRP20090045T3 publication Critical patent/HRP20090045T3/hr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

Postupak raspoređivanja na podlozi (7) najmanje jednog elektroničkog sklopa koji sadrži čip (4) i koji sadrži najmanje jedan električni kontakt (5, 5') na jednoj od svojih strana i najmanje jedan segment (3, 3') vodljive staze spojen na najmanje jedan navedeni električni kontakt (5, 5'), naznačen time da sadrži sljedeće korake: - formiranje najmanje jednog navedenog segmenta (3, 3') vodljive staze koji ima prethodno utvrđeni oblik ; - uzimanje najmanje jednog navedenog segmenta (3, 3') staze pomoću uređaja za montažu (6), - uzimanje čipa (4) pomoću uređaja za montažu (6) koji nosi segment staze (3, 3') tako da se jedan kraj navedenog segmenta (3, 3') stavi nasuprot kontakta (5, 5') čipa (4)ili se stavi na navedeni kontakt (5, 5'); - postavljanje navedenog elektroničkog sklopa, kojeg u položaju određenom u odnosu na navedenu podlogu (7),održava navedeni uređaj za montažu (6) - utiskivanje navedenog elektroničkog sklopa u navedenu podlogu (7). Patent sadrži još 37 patentnih zahtjeva.
HR20090045T 2005-02-01 2006-02-01 Postupak postavljanja nekog elektroničkog sklopa na supstrat i uređaj za montažu takvog sklopa HRP20090045T3 (hr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP05100694A EP1686512A1 (fr) 2005-02-01 2005-02-01 Procédé de placement d'un ensemble électronique sur un substrat et dispositif de placement d'un tel ensemble
EP05109094 2005-09-30
PCT/EP2006/050585 WO2006082199A2 (fr) 2005-02-01 2006-02-01 Procédé de placement d'un ensemble électronique sur un substrat et dispositif de placement d'un tel ensemble

Publications (1)

Publication Number Publication Date
HRP20090045T3 true HRP20090045T3 (hr) 2009-02-28

Family

ID=36645615

Family Applications (1)

Application Number Title Priority Date Filing Date
HR20090045T HRP20090045T3 (hr) 2005-02-01 2006-02-01 Postupak postavljanja nekog elektroničkog sklopa na supstrat i uređaj za montažu takvog sklopa

Country Status (27)

Country Link
US (2) US7785932B2 (hr)
EP (1) EP1846874B1 (hr)
JP (1) JP4838813B2 (hr)
KR (1) KR101145535B1 (hr)
CN (1) CN101111855B (hr)
AP (1) AP2226A (hr)
AT (1) ATE413666T1 (hr)
AU (1) AU2006210245B2 (hr)
BR (1) BRPI0606562A8 (hr)
CA (1) CA2595796C (hr)
CY (1) CY1108717T1 (hr)
DE (1) DE602006003528D1 (hr)
DK (1) DK1846874T3 (hr)
EG (1) EG25336A (hr)
ES (1) ES2318724T3 (hr)
HR (1) HRP20090045T3 (hr)
MA (1) MA29242B1 (hr)
ME (1) ME01052B (hr)
MX (1) MX2007009166A (hr)
PL (1) PL1846874T3 (hr)
PT (1) PT1846874E (hr)
RS (1) RS50718B (hr)
RU (1) RU2398280C2 (hr)
SI (1) SI1846874T1 (hr)
TN (1) TNSN07302A1 (hr)
WO (1) WO2006082199A2 (hr)
ZA (1) ZA200707271B (hr)

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WO2008082616A1 (en) 2006-12-29 2008-07-10 Solicore, Inc. Card configured to receive separate battery
US8181879B2 (en) 2006-12-29 2012-05-22 Solicore, Inc. Mailing apparatus for powered cards
WO2009001621A1 (ja) * 2007-06-26 2008-12-31 Murata Manufacturing Co., Ltd. 部品内蔵基板の製造方法
FR2951866B1 (fr) * 2009-10-27 2011-11-25 Arjowiggins Security Procede de fabrication d'un support integrant un dispositif electronique
DE102010011517A1 (de) * 2010-03-15 2011-09-15 Smartrac Ip B.V. Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung
US8963313B2 (en) 2011-12-22 2015-02-24 Raytheon Company Heterogeneous chip integration with low loss interconnection through adaptive patterning
EP2736001A1 (fr) * 2012-11-27 2014-05-28 Gemalto SA Module électronique à interface de communication tridimensionnelle
EP2767935A1 (fr) 2013-02-18 2014-08-20 NagraID S.A. Couche plastique pour carte électronique
MX2017010502A (es) * 2015-02-20 2018-03-14 Nid Sa Proceso de fabricacion de un dispositivo que incluye al menos un elemento electronico asociado a un substrato y a una antena.
DE102015220855B4 (de) * 2015-10-26 2026-04-30 Robert Bosch Gmbh Sensorvorrichtung zur Erfassung mindestens einer Strömungseigenschaft eines fluiden Mediums
EP3423993B1 (en) * 2016-03-01 2020-07-01 Cardlab ApS A circuit layer for an integrated circuit card
US10580745B1 (en) * 2018-08-31 2020-03-03 Globalfoundries Inc. Wafer level packaging with integrated antenna structures

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Also Published As

Publication number Publication date
US20060172458A1 (en) 2006-08-03
CA2595796A1 (en) 2006-08-10
ATE413666T1 (de) 2008-11-15
SI1846874T1 (sl) 2009-04-30
CN101111855A (zh) 2008-01-23
KR20070103745A (ko) 2007-10-24
US7785932B2 (en) 2010-08-31
WO2006082199A3 (fr) 2006-11-23
JP2008529292A (ja) 2008-07-31
ME01052B (me) 2012-10-20
EG25336A (en) 2011-12-14
TNSN07302A1 (fr) 2008-12-31
EP1846874B1 (fr) 2008-11-05
DE602006003528D1 (de) 2008-12-18
RU2007128621A (ru) 2009-03-10
PL1846874T3 (pl) 2009-04-30
ZA200707271B (en) 2009-05-27
MX2007009166A (es) 2007-09-12
PT1846874E (pt) 2009-01-29
AU2006210245B2 (en) 2011-04-14
US20100328914A1 (en) 2010-12-30
CN101111855B (zh) 2012-04-18
BRPI0606562A8 (pt) 2016-08-02
DK1846874T3 (da) 2009-03-09
US8218332B2 (en) 2012-07-10
AP2226A (en) 2011-03-29
AP2007004088A0 (en) 2007-08-31
RS50718B (sr) 2010-06-30
KR101145535B1 (ko) 2012-05-15
EP1846874A2 (fr) 2007-10-24
ES2318724T3 (es) 2009-05-01
RU2398280C2 (ru) 2010-08-27
WO2006082199A2 (fr) 2006-08-10
BRPI0606562A2 (pt) 2010-07-06
AU2006210245A1 (en) 2006-08-10
CA2595796C (en) 2013-04-02
JP4838813B2 (ja) 2011-12-14
CY1108717T1 (el) 2014-04-09
MA29242B1 (fr) 2008-02-01

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