JP2000204332A - 熱剥離性接着剤組成物および接着構造体 - Google Patents

熱剥離性接着剤組成物および接着構造体

Info

Publication number
JP2000204332A
JP2000204332A JP11002770A JP277099A JP2000204332A JP 2000204332 A JP2000204332 A JP 2000204332A JP 11002770 A JP11002770 A JP 11002770A JP 277099 A JP277099 A JP 277099A JP 2000204332 A JP2000204332 A JP 2000204332A
Authority
JP
Japan
Prior art keywords
adhesive
heat
temperature
adhesive composition
expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11002770A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000204332A5 (2
Inventor
Koichiro Kawate
恒一郎 川手
Tetsuo Kamiyoshi
徹郎 神吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Priority to JP11002770A priority Critical patent/JP2000204332A/ja
Priority to DE69908417T priority patent/DE69908417T2/de
Priority to AU18273/00A priority patent/AU1827300A/en
Priority to PCT/US1999/027696 priority patent/WO2000040648A1/en
Priority to EP99961757A priority patent/EP1141104B1/en
Publication of JP2000204332A publication Critical patent/JP2000204332A/ja
Publication of JP2000204332A5 publication Critical patent/JP2000204332A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP11002770A 1999-01-08 1999-01-08 熱剥離性接着剤組成物および接着構造体 Pending JP2000204332A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP11002770A JP2000204332A (ja) 1999-01-08 1999-01-08 熱剥離性接着剤組成物および接着構造体
DE69908417T DE69908417T2 (de) 1999-01-08 1999-11-22 Wärme entklebbare klebstoffzusammensetzung und klebestruktur
AU18273/00A AU1827300A (en) 1999-01-08 1999-11-22 Heat debondable adhesive composition and adhesion structure
PCT/US1999/027696 WO2000040648A1 (en) 1999-01-08 1999-11-22 Heat debondable adhesive composition and adhesion structure
EP99961757A EP1141104B1 (en) 1999-01-08 1999-11-22 Heat debondable adhesive composition and adhesion structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11002770A JP2000204332A (ja) 1999-01-08 1999-01-08 熱剥離性接着剤組成物および接着構造体

Publications (2)

Publication Number Publication Date
JP2000204332A true JP2000204332A (ja) 2000-07-25
JP2000204332A5 JP2000204332A5 (2) 2006-02-16

Family

ID=11538583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11002770A Pending JP2000204332A (ja) 1999-01-08 1999-01-08 熱剥離性接着剤組成物および接着構造体

Country Status (5)

Country Link
EP (1) EP1141104B1 (2)
JP (1) JP2000204332A (2)
AU (1) AU1827300A (2)
DE (1) DE69908417T2 (2)
WO (1) WO2000040648A1 (2)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002317544A (ja) * 2001-04-23 2002-10-31 Tajima Inc 床タイルの施工方法
JP2003171648A (ja) * 2001-09-28 2003-06-20 Kaken Tec Kk 熱剥離型接着剤組成物
JP2008056843A (ja) * 2006-09-01 2008-03-13 Asics Corp 熱膨張性接着剤、シューズ、シューズの解体方法、及びシューズ解体用マイクロ波照射装置
JP2009007526A (ja) * 2007-06-29 2009-01-15 Kobe Steel Ltd 剥離用塗料組成物およびその塗膜を有する塗工基材
WO2014018312A1 (en) * 2012-07-26 2014-01-30 3M Innovative Properties Company Heat de-bondable adhesive articles
KR20160010683A (ko) * 2014-07-17 2016-01-28 한국생산기술연구원 경화성 플럭스 조성물 및 이를 포함하는 솔더 페이스트
US9827739B2 (en) 2012-07-26 2017-11-28 3M Innovative Properties Company Heat de-bondable optical articles
JP2019147874A (ja) * 2018-02-26 2019-09-05 国立大学法人大阪大学 解体性接着剤組成物、及び被着体の解体方法
JPWO2023054052A1 (2) * 2021-09-30 2023-04-06
JP2023062995A (ja) * 2021-10-22 2023-05-09 トヨタ自動車株式会社 ロータの製造方法及びロータ
WO2023176800A1 (ja) * 2022-03-14 2023-09-21 日東電工株式会社 易解体接着シート、積層体、接合体、接合体の製造方法、及び接合体の解体方法
WO2024106077A1 (ja) * 2022-11-16 2024-05-23 信越化学工業株式会社 接合部材の解体方法及び易解体性の液状シリコーン系接着剤

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19961940A1 (de) * 1999-12-22 2001-08-02 Henkel Kgaa Lösbare Klebeverindungen
KR20000018019A (ko) * 2000-01-04 2000-04-06 전효철 합성수지와 질석 및 제오라이트(열팽창광물질)등을혼합하여 합성수지 혼합물의 제조방법
FR2837114A1 (fr) * 2002-03-13 2003-09-19 Rescoll Soc Procede de separation commandee des assemblages et revetements colles et produits associes
US6882058B2 (en) * 2002-11-05 2005-04-19 Henkel Corporation Organic acid containing compositions and methods for use thereof
US20040249042A1 (en) * 2003-06-09 2004-12-09 Motorola, Inc. Microwave removable coating
JP2006024751A (ja) * 2004-07-08 2006-01-26 Three M Innovative Properties Co 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品
DE102008036713A1 (de) 2008-08-07 2010-02-11 Technische Universität Carolo-Wilhelmina Zu Braunschweig Verfahren zum Trennen zweier über zumindest eine Klebschicht miteinander verklebter Objekte
FR2943352B1 (fr) * 2009-03-17 2011-05-20 Astrium Sas Procede de collage demontable adapte aux materiaux poreux
DE102009019483A1 (de) 2009-05-04 2010-11-11 Eads Deutschland Gmbh Klebstoff-Zusammensetzung für lösbare Klebeverbindungen und Modifikation der Verkapselungsmaterialien für gezielte Energieeinbringung
DE102009019484B4 (de) 2009-05-04 2015-12-17 Airbus Defence and Space GmbH Kombination der Effekte von Expansionsstoffen und chemischen Abbaureagenzien für lösbare Klebeverbindungen
DE102009055091A1 (de) * 2009-12-21 2011-06-22 tesa SE, 20253 Induktiv erwärmbares Klebeband mit differentiellem Löseverhalten
EP2434528A1 (en) 2010-09-28 2012-03-28 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO An active carrier for carrying a wafer and method for release
TW201235402A (en) * 2011-01-07 2012-09-01 Ajinomoto Kk Resin composition for release film
US9821529B2 (en) 2011-07-19 2017-11-21 3M Innovative Properties Company Debondable adhesive article and methods of making and using the same
KR101930128B1 (ko) 2013-07-03 2018-12-17 헨켈 아이피 앤드 홀딩 게엠베하 고온 탈결합가능한 접착제
KR102102955B1 (ko) 2013-08-12 2020-04-23 삼성디스플레이 주식회사 표시 장치의 제조 방법
JP6479862B2 (ja) 2014-06-24 2019-03-06 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 一成分型のｕｖおよび熱硬化高温剥離可能な接着剤
EP3056225A1 (en) 2015-02-16 2016-08-17 Nitto Denko Corporation Debondable adhesive system
TWI738684B (zh) 2015-12-09 2021-09-11 德商漢高智慧財產控股公司 可脫黏組合物
GB2568105A (en) * 2017-11-07 2019-05-08 Rolls Royce Plc A joined article, a method of de-bonding an article and a method of curing a binder
CN114008092B (zh) 2019-06-13 2024-02-02 3M创新有限公司 交联剂和包含交联剂的可固化组合物
DE102019220633A1 (de) * 2019-12-30 2021-07-01 Edag Engineering Gmbh Strukturverbindungsanordnung, Verwendung eines Gemisches aus einem Klebstoff und thermisch expandierenden Partikeln und Verfahren zur Verwertung einer Strukturverbindungsanordnung
JP7464005B2 (ja) * 2021-05-31 2024-04-09 信越化学工業株式会社 接合部材の解体方法及び接合部材並びに易解体性の液状シリコーン系接着剤
EP4276155A1 (en) * 2022-05-11 2023-11-15 tesa SE Multilayered tape and process for debonding the multilayered tape
LU506809B1 (en) 2024-04-05 2025-10-06 Luxembourg Inst Science & Tech List Non-intumescent thermoset polymer compositions for dismantlable composites

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60252681A (ja) * 1984-05-30 1985-12-13 F S K Kk 熱剥離性粘着シ−ト
JPS6178887A (ja) * 1984-09-27 1986-04-22 Shinko Kagaku Kogyo Kk 熱剥離性を有する粘着シ−ト
JPS6222874A (ja) * 1985-07-22 1987-01-31 Mitsui Toatsu Chem Inc 熱時再剥離型粘着剤
JPH03152942A (ja) * 1989-11-09 1991-06-28 Nitto Denko Corp ダイシング・ダイボンドフィルム
JPH05247418A (ja) * 1992-03-04 1993-09-24 Nitto Denko Corp 発泡性接着シート及びその製造方法
JPH0657140A (ja) * 1990-04-25 1994-03-01 Carl Zeiss:Fa 耐燃性ポリオルガノシロキサン組成物
JPH06117544A (ja) * 1992-10-02 1994-04-26 Hitachi Chem Co Ltd 膨張黒鉛−金属ガスケット材料
JPH06211596A (ja) * 1992-11-30 1994-08-02 Fujitsu Ltd 高温超伝導薄膜等の薄膜の堆積方法および堆積用基板の保持方法
JPH07145357A (ja) * 1993-11-24 1995-06-06 Nitto Denko Corp 加熱剥離シート及び剥離方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2970963B2 (ja) * 1991-08-14 1999-11-02 日東電工株式会社 剥離性感圧接着剤及びその粘着部材
JP2898480B2 (ja) * 1992-09-14 1999-06-02 日東電工株式会社 加熱剥離性接着剤及び粘着部材
JP3308672B2 (ja) * 1993-02-26 2002-07-29 日東電工株式会社 接着シート

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60252681A (ja) * 1984-05-30 1985-12-13 F S K Kk 熱剥離性粘着シ−ト
JPS6178887A (ja) * 1984-09-27 1986-04-22 Shinko Kagaku Kogyo Kk 熱剥離性を有する粘着シ−ト
JPS6222874A (ja) * 1985-07-22 1987-01-31 Mitsui Toatsu Chem Inc 熱時再剥離型粘着剤
JPH03152942A (ja) * 1989-11-09 1991-06-28 Nitto Denko Corp ダイシング・ダイボンドフィルム
JPH0657140A (ja) * 1990-04-25 1994-03-01 Carl Zeiss:Fa 耐燃性ポリオルガノシロキサン組成物
JPH05247418A (ja) * 1992-03-04 1993-09-24 Nitto Denko Corp 発泡性接着シート及びその製造方法
JPH06117544A (ja) * 1992-10-02 1994-04-26 Hitachi Chem Co Ltd 膨張黒鉛−金属ガスケット材料
JPH06211596A (ja) * 1992-11-30 1994-08-02 Fujitsu Ltd 高温超伝導薄膜等の薄膜の堆積方法および堆積用基板の保持方法
JPH07145357A (ja) * 1993-11-24 1995-06-06 Nitto Denko Corp 加熱剥離シート及び剥離方法

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002317544A (ja) * 2001-04-23 2002-10-31 Tajima Inc 床タイルの施工方法
JP2003171648A (ja) * 2001-09-28 2003-06-20 Kaken Tec Kk 熱剥離型接着剤組成物
JP2008056843A (ja) * 2006-09-01 2008-03-13 Asics Corp 熱膨張性接着剤、シューズ、シューズの解体方法、及びシューズ解体用マイクロ波照射装置
JP2009007526A (ja) * 2007-06-29 2009-01-15 Kobe Steel Ltd 剥離用塗料組成物およびその塗膜を有する塗工基材
WO2014018312A1 (en) * 2012-07-26 2014-01-30 3M Innovative Properties Company Heat de-bondable adhesive articles
US9827739B2 (en) 2012-07-26 2017-11-28 3M Innovative Properties Company Heat de-bondable optical articles
KR20160010683A (ko) * 2014-07-17 2016-01-28 한국생산기술연구원 경화성 플럭스 조성물 및 이를 포함하는 솔더 페이스트
KR101606360B1 (ko) 2014-07-17 2016-03-28 한국생산기술연구원 경화성 플럭스 조성물 및 이를 포함하는 솔더 페이스트
JP2019147874A (ja) * 2018-02-26 2019-09-05 国立大学法人大阪大学 解体性接着剤組成物、及び被着体の解体方法
JP7181571B2 (ja) 2018-02-26 2022-12-01 国立大学法人大阪大学 解体性接着剤組成物、及び被着体の解体方法
JPWO2023054052A1 (2) * 2021-09-30 2023-04-06
WO2023054052A1 (ja) * 2021-09-30 2023-04-06 信越化学工業株式会社 接合部材の解体方法及び接合部材並びに易解体性の液状シリコーン系接着剤
JP7772079B2 (ja) 2021-09-30 2025-11-18 信越化学工業株式会社 接合部材の解体方法及び接合部材並びに易解体性の液状シリコーン系接着剤
JP2023062995A (ja) * 2021-10-22 2023-05-09 トヨタ自動車株式会社 ロータの製造方法及びロータ
JP7647494B2 (ja) 2021-10-22 2025-03-18 トヨタ自動車株式会社 ロータの製造方法及びロータ
WO2023176800A1 (ja) * 2022-03-14 2023-09-21 日東電工株式会社 易解体接着シート、積層体、接合体、接合体の製造方法、及び接合体の解体方法
WO2024106077A1 (ja) * 2022-11-16 2024-05-23 信越化学工業株式会社 接合部材の解体方法及び易解体性の液状シリコーン系接着剤

Also Published As

Publication number Publication date
EP1141104A1 (en) 2001-10-10
AU1827300A (en) 2000-07-24
EP1141104B1 (en) 2003-05-28
DE69908417D1 (de) 2003-07-03
DE69908417T2 (de) 2004-05-06
WO2000040648A1 (en) 2000-07-13

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