JP2000507750A - Ｓｍｄ部品を装着したプリント配線板をリフローはんだ付けするための方法 - Google Patents

Ｓｍｄ部品を装着したプリント配線板をリフローはんだ付けするための方法

Info

Publication number
JP2000507750A
JP2000507750A JP10526067A JP52606798A JP2000507750A JP 2000507750 A JP2000507750 A JP 2000507750A JP 10526067 A JP10526067 A JP 10526067A JP 52606798 A JP52606798 A JP 52606798A JP 2000507750 A JP2000507750 A JP 2000507750A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
smd
soldering
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10526067A
Other languages
English (en)
Japanese (ja)
Inventor
ノイテル アンドレアス
シュミット ヨアヒム
ザボトケ イェンス
ハウシルト フランク―ディーター
グレーン アンスガー
バラン カローラ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JP2000507750A publication Critical patent/JP2000507750A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP10526067A 1996-12-13 1997-09-09 Ｓｍｄ部品を装着したプリント配線板をリフローはんだ付けするための方法 Pending JP2000507750A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19651862A DE19651862A1 (de) 1996-12-13 1996-12-13 Verfahren zum Reflowlöten von mit SMD-Bauelementen bestückten Leiterplatten
DE19651862.8 1996-12-13
PCT/DE1997/001997 WO1998026638A1 (de) 1996-12-13 1997-09-09 Verfahren zum reflowlöten von mit smd-bauelementen bestückten leiterplatten

Publications (1)

Publication Number Publication Date
JP2000507750A true JP2000507750A (ja) 2000-06-20

Family

ID=7814582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10526067A Pending JP2000507750A (ja) 1996-12-13 1997-09-09 Ｓｍｄ部品を装着したプリント配線板をリフローはんだ付けするための方法

Country Status (8)

Country Link
EP (1) EP0903061A1 (de)
JP (1) JP2000507750A (de)
KR (1) KR19990082161A (de)
CN (1) CN1209942A (de)
CZ (1) CZ251398A3 (de)
DE (1) DE19651862A1 (de)
TW (1) TW383535B (de)
WO (1) WO1998026638A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8508711B2 (en) 2008-08-22 2013-08-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19828653A1 (de) * 1998-06-26 2000-01-05 Siemens Ag Chipmodul zum Einbau in einen Chipkartenträger sowie Verfahren zu dessen Herstellung
DE19925961A1 (de) * 1999-05-31 2000-12-21 Siemens Ag Verfahren zum Aushärten von thermisch aushärtbarem Unterfüllmaterial
CN100455167C (zh) * 2005-02-04 2009-01-21 厦门顶尖电子有限公司 打印头电磁铁固定方法及其装置
US8104661B2 (en) * 2005-03-23 2012-01-31 Tamura Corporation Heating device, reflow device, heating method, and bump forming method
CN101827501B (zh) * 2010-03-31 2012-01-04 伟创力电子科技（上海）有限公司 通孔回流焊接工艺,以及对应的模板和制具
DE102013002597B3 (de) * 2013-02-14 2014-07-31 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Verfahren zur beidseitigen Bestückung einer Leiterplatte
AT515446B1 (de) * 2014-03-07 2019-12-15 Zkw Group Gmbh Strukturierung der Lötstoppmaske von Leiterplatten zur Verbesserung der Lötergebnisse
DE102018110752A1 (de) * 2018-05-04 2019-11-07 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Verfahren zum Herstellen eines Anschlusskontaktes

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1951125A (en) * 1933-02-18 1934-03-13 Carnation Co Solder flux applying device
US4573105A (en) * 1983-02-16 1986-02-25 Rca Corporation Printed circuit board assembly and method for the manufacture thereof
FR2613898A1 (fr) * 1987-04-13 1988-10-14 Siame Electronique Sa Procede de soudage de composants pour montage en surface (cms) sur circuit imprime
DE3843984A1 (de) * 1988-12-27 1990-07-05 Asea Brown Boveri Verfahren zum loeten eines drahtlosen bauelementes sowie leiterplatte mit angeloetetem, drahtlosem bauelement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8508711B2 (en) 2008-08-22 2013-08-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
CN1209942A (zh) 1999-03-03
KR19990082161A (ko) 1999-11-25
EP0903061A1 (de) 1999-03-24
WO1998026638A1 (de) 1998-06-18
CZ251398A3 (cs) 1999-02-17
DE19651862A1 (de) 1998-06-18
TW383535B (en) 2000-03-01

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