JPH01100444U - - Google Patents

Info

Publication number
JPH01100444U
JPH01100444U JP1987195653U JP19565387U JPH01100444U JP H01100444 U JPH01100444 U JP H01100444U JP 1987195653 U JP1987195653 U JP 1987195653U JP 19565387 U JP19565387 U JP 19565387U JP H01100444 U JPH01100444 U JP H01100444U
Authority
JP
Japan
Prior art keywords
film carrier
electronic component
film
coated
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987195653U
Other languages
English (en)
Other versions
JPH0525241Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987195653U priority Critical patent/JPH0525241Y2/ja
Publication of JPH01100444U publication Critical patent/JPH01100444U/ja
Application granted granted Critical
Publication of JPH0525241Y2 publication Critical patent/JPH0525241Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係るフイルムキヤリアの一実
施例を示す平面図、第２図はこのフイルムキヤリ
アにＩＣチツプを実装し、エポキシ系樹脂でコー
テイングした状態を示す模式的平面図、第３図は
第２図のＡ―Ａ線断面図、第４図はその他の実施
例を示す平面図、第５図は従来のフイルムキヤリ
アを示す平面図、第６図はこのフイルムキヤリア
にＩＣチツプを実装し、エポキシ系樹脂でコーテ
イングした状態を示す模式的平面図、第７図は第
６図のＢ―Ｂ線断面図である。 １０……フイルムキヤリア、１１……デバイス
ホール、１３……スリツト、１３１……金属箔、
２０……ＩＣチツプ、３０……エポキシ系樹脂（
樹脂）。

Claims (1)

    【実用新案登録請求の範囲】
  1. 予め形成されたリードに電子部品を実装し、当
    該電子部品を樹脂でコーテイングするフイルムキ
    ヤリアにおいて、フイルムの隣接するデバイスホ
    ール間に開設されたスリツトの少なくとも一部を
    覆う金属箔が形成されていることを特徴とするフ
    イルムキヤリア。
JP1987195653U 1987-12-23 1987-12-23 Expired - Lifetime JPH0525241Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987195653U JPH0525241Y2 (ja) 1987-12-23 1987-12-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987195653U JPH0525241Y2 (ja) 1987-12-23 1987-12-23

Publications (2)

Publication Number Publication Date
JPH01100444U true JPH01100444U (ja) 1989-07-05
JPH0525241Y2 JPH0525241Y2 (ja) 1993-06-25

Family

ID=31486322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987195653U Expired - Lifetime JPH0525241Y2 (ja) 1987-12-23 1987-12-23

Country Status (1)

Country Link
JP (1) JPH0525241Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156560A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Semiconductor device and its production
JPS58197758A (ja) * 1982-05-12 1983-11-17 Sharp Corp テ−プキヤリア装置及びその実装方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156560A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Semiconductor device and its production
JPS58197758A (ja) * 1982-05-12 1983-11-17 Sharp Corp テ−プキヤリア装置及びその実装方法

Also Published As

Publication number Publication date
JPH0525241Y2 (ja) 1993-06-25

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