JPH01113334U - - Google Patents

Info

Publication number
JPH01113334U
JPH01113334U JP809388U JP809388U JPH01113334U JP H01113334 U JPH01113334 U JP H01113334U JP 809388 U JP809388 U JP 809388U JP 809388 U JP809388 U JP 809388U JP H01113334 U JPH01113334 U JP H01113334U
Authority
JP
Japan
Prior art keywords
resin
substrate
heater block
substrate side
copper clad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP809388U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP809388U priority Critical patent/JPH01113334U/ja
Publication of JPH01113334U publication Critical patent/JPH01113334U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案における樹脂銅張板の１例であ
つて、ａはその平面図、ｂは平面図におけるｌ―
ｌ線での断面図である。第２〜５図は本考案にお
ける樹脂銅張板に適合するワイヤボンデイング装
置の構造および機能を説明するための断面図であ
る。 Ａ……樹脂銅張板、１……基板、１ｂ……切欠
き穴、２……銅層、２ｃ……ワイヤボンデイング
部、Ｂ……半導体チツプ、３……第１ヒータブロ
ツク、４……カバー、５……ガス供給管、６……
第２ヒータブロツク、７……第３ヒータブロツク
、８……銅線、９……クーリングブロツク。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 合成樹脂基板上に金属銅層からなる配線回
    路を設けた銅張板において、該配線回路のワイヤ
    ボンデイングを行なう部位の樹脂基板が除去され
    ていることを特徴とする樹脂銅張板。 (2) 請求項１の樹脂銅張板を基板側から加熱で
    きる第１ヒータブロツクと基板側から冷却できる
    クーリングブロツクとを備え、これらの中間位置
    に該基板の除去部分に進入して銅層のワイヤボン
    デイング部位を加熱できる第２ヒータブロツクと
    該基板のチツプマウント部位を基板側から加熱で
    きる第３ヒータブロツクとを設けてなり、これら
    のブロツクをそれぞれ別個に温度制御できるよう
    構成されたことを特徴とする樹脂銅張板用ワイヤ
    ボンデイング装置。
JP809388U 1988-01-27 1988-01-27 Pending JPH01113334U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP809388U JPH01113334U (ja) 1988-01-27 1988-01-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP809388U JPH01113334U (ja) 1988-01-27 1988-01-27

Publications (1)

Publication Number Publication Date
JPH01113334U true JPH01113334U (ja) 1989-07-31

Family

ID=31213663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP809388U Pending JPH01113334U (ja) 1988-01-27 1988-01-27

Country Status (1)

Country Link
JP (1) JPH01113334U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03181143A (ja) * 1989-12-11 1991-08-07 Ibiden Co Ltd 電子部品搭載用基板
CN111816614A (zh) * 2020-02-28 2020-10-23 浙江集迈科微电子有限公司 一种芯片贴装方式

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03181143A (ja) * 1989-12-11 1991-08-07 Ibiden Co Ltd 電子部品搭載用基板
CN111816614A (zh) * 2020-02-28 2020-10-23 浙江集迈科微电子有限公司 一种芯片贴装方式

Similar Documents

Publication Publication Date Title
US5339217A (en) Composite printed circuit board and manufacturing method thereof
JPS60260192A (ja) 混成集積回路の製造方法
JPH01113334U (ja)
JPS5930551Y2 (ja) 配線補修用ラインを持った配線板
JPS5853854A (ja) 高密度ｌｓｉパツケ−ジ
JP2626785B2 (ja) 電子部品搭載用基板
JPS5847718Y2 (ja) 放熱型プリント基板
JPH0442930Y2 (ja)
JPS6057139U (ja) 集積回路チツプ冷却装置
JPS59111308U (ja) 混成超小形電力増幅器
JPS62140796U (ja)
JPS63182570U (ja)
JPS6286848A (ja) チツプキヤリア
JPS6221289A (ja) 実装基板
JPS59191736U (ja) 半導体素子放熱装置
JPS5881996U (ja) 電子機器の冷却装置
JPS63149544U (ja)
JPH0227759U (ja)
JPS5939993U (ja) プリント回路基板の放熱構造
JPS5881997U (ja) 電子機器の冷却装置
JPS5936297U (ja) 電子機器の冷却構造
JPS63182572U (ja)
JPS62140751U (ja)
JPH01104027U (ja)
JPS6310596U (ja)