JPH01116457U - - Google Patents
Info
- Publication number
- JPH01116457U JPH01116457U JP1988011436U JP1143688U JPH01116457U JP H01116457 U JPH01116457 U JP H01116457U JP 1988011436 U JP1988011436 U JP 1988011436U JP 1143688 U JP1143688 U JP 1143688U JP H01116457 U JPH01116457 U JP H01116457U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- external lead
- semiconductor device
- sealing
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例に係る半導体装置の
部分平面図、第２図は第１図のＡ―Ａ線断面図、
第３図は本考案の他の実施例に係る第１図のＡ―
Ａ線断面図、第４図は従来の半導体装置の部分平
面図、第５図は第４図のＡ―Ａ線断面図である。 １……外部引出しリード線、２……アイランド
領域、３……半導体素子、４……金属細線、５…
…封止樹脂。
部分平面図、第２図は第１図のＡ―Ａ線断面図、
第３図は本考案の他の実施例に係る第１図のＡ―
Ａ線断面図、第４図は従来の半導体装置の部分平
面図、第５図は第４図のＡ―Ａ線断面図である。 １……外部引出しリード線、２……アイランド
領域、３……半導体素子、４……金属細線、５…
…封止樹脂。
Claims (1)
- 半導体素子を搭載するアイランド領域と、該半
導体素子の電極に金属細線を介して接続され該半
導体素子を樹脂封止する容器の外部に導出された
少なくとも２本の外部引出しリード線を有する半
導体装置に於いて、前記外部引出しリード線の封
止樹脂内部に含まれる先端部を曲げたことを特徴
とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988011436U JPH01116457U (ja) | 1988-01-29 | 1988-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988011436U JPH01116457U (ja) | 1988-01-29 | 1988-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01116457U true JPH01116457U (ja) | 1989-08-07 |
Family
ID=31219988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988011436U Pending JPH01116457U (ja) | 1988-01-29 | 1988-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01116457U (ja) |
-
1988
- 1988-01-29 JP JP1988011436U patent/JPH01116457U/ja active Pending