JPH01123361U - - Google Patents

Info

Publication number
JPH01123361U
JPH01123361U JP1988020492U JP2049288U JPH01123361U JP H01123361 U JPH01123361 U JP H01123361U JP 1988020492 U JP1988020492 U JP 1988020492U JP 2049288 U JP2049288 U JP 2049288U JP H01123361 U JPH01123361 U JP H01123361U
Authority
JP
Japan
Prior art keywords
semiconductor device
tiers
bumps
wiring
stacking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988020492U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988020492U priority Critical patent/JPH01123361U/ja
Publication of JPH01123361U publication Critical patent/JPH01123361U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を説明するための半
導体装置の断面図、第２図は従来の一例を説明す
るための半導体装置の斜視図である。 １…フレキシブル配線基板、２…ＩＣベアチツ
プ、３…半田バンプ、４，４′…配線端部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 厚さ０．２mm以下のＩＣベアチツプをフエイス
    ダウンで搭載しバンプ接続したフレキシブルな有
    機材からなる配線基板を二段以上に積み重ね、且
    つ各基板間の必要な配線を電気的に接続したこと
    を特徴とする半導体装置。
JP1988020492U 1988-02-17 1988-02-17 Pending JPH01123361U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988020492U JPH01123361U (ja) 1988-02-17 1988-02-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988020492U JPH01123361U (ja) 1988-02-17 1988-02-17

Publications (1)

Publication Number Publication Date
JPH01123361U true JPH01123361U (ja) 1989-08-22

Family

ID=31236906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988020492U Pending JPH01123361U (ja) 1988-02-17 1988-02-17

Country Status (1)

Country Link
JP (1) JPH01123361U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006028155A1 (ja) * 2004-09-08 2006-03-16 Nec Corporation モジュール型電子部品及び電子機器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133258A (ja) * 1984-07-25 1986-02-17 Matsushita Electric Ind Co Ltd 噴霧装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133258A (ja) * 1984-07-25 1986-02-17 Matsushita Electric Ind Co Ltd 噴霧装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006028155A1 (ja) * 2004-09-08 2006-03-16 Nec Corporation モジュール型電子部品及び電子機器

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