JPH01174941U - - Google Patents

Info

Publication number
JPH01174941U
JPH01174941U JP1988071864U JP7186488U JPH01174941U JP H01174941 U JPH01174941 U JP H01174941U JP 1988071864 U JP1988071864 U JP 1988071864U JP 7186488 U JP7186488 U JP 7186488U JP H01174941 U JPH01174941 U JP H01174941U
Authority
JP
Japan
Prior art keywords
power mosfet
power
drain
temperature fuse
osfet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988071864U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988071864U priority Critical patent/JPH01174941U/ja
Publication of JPH01174941U publication Critical patent/JPH01174941U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/759—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent discrete passive device

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Fuses (AREA)

Description

【図面の簡単な説明】
第１図は本考案の平面断面図、第２図は、第１
図の等価回路図、第３図は他の実施例の図、第４
図は従来の平面断面図、第５図は第４図の等価回
路図である。 １……ゲート端子、２……ドレイン端子、３，
４……ソース端子、５……温度ヒユーズ、６……
放熱板、７ａ，７ｂ，７ｃ，７ｄ……ボンデイン
グ線、８……外装樹脂、９……取付穴、１０……
チツプ、１１……発光ダイオード、１２……トラ
ンジスタ、１３……抵抗。

Claims (1)

    【実用新案登録請求の範囲】
  1. 高速スイツチング用パワーＭＯＳＦＥＴのドレ
    イン−ソース間短絡による外装樹脂発煙、発火保
    護として、パワーＭＯＳＦＥＴに温度ヒユーズを
    内蔵した構造を有することを特徴とするパワーＭ
    ＯＳＦＥＴ。
JP1988071864U 1988-05-30 1988-05-30 Pending JPH01174941U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988071864U JPH01174941U (ja) 1988-05-30 1988-05-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988071864U JPH01174941U (ja) 1988-05-30 1988-05-30

Publications (1)

Publication Number Publication Date
JPH01174941U true JPH01174941U (ja) 1989-12-13

Family

ID=31297052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988071864U Pending JPH01174941U (ja) 1988-05-30 1988-05-30

Country Status (1)

Country Link
JP (1) JPH01174941U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010257858A (ja) * 2009-04-28 2010-11-11 Nippon Inter Electronics Corp ヒューズ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010257858A (ja) * 2009-04-28 2010-11-11 Nippon Inter Electronics Corp ヒューズ装置

Similar Documents

Publication Publication Date Title
JPH0258345U (ja)
JPS63102265U (ja)
JPH01171055U (ja)
JPH01143137U (ja)
JPH01153738U (ja)
JPS62204365U (ja)
JPS62107469U (ja)
JPH0226257U (ja)
JPH02125531U (ja)
JPH0316737U (ja)
JPH01120359U (ja)
JPS63197358U (ja)
JPS63174460U (ja)
JPH02138455U (ja)
JPS63195754U (ja)
JPS6371546U (ja)
JPH01120367U (ja)
JPH01100392U (ja)
JPH02138435U (ja)
JPH0281062U (ja)
JPS61190141U (ja)
JPH03106749U (ja)
JPH0338648U (ja)
JPH0254242U (ja)
JPH0242455U (ja)