JPH01278585A - 紫外線硬化性レジストインキ - Google Patents

紫外線硬化性レジストインキ

Info

Publication number
JPH01278585A
JPH01278585A JP63108503A JP10850388A JPH01278585A JP H01278585 A JPH01278585 A JP H01278585A JP 63108503 A JP63108503 A JP 63108503A JP 10850388 A JP10850388 A JP 10850388A JP H01278585 A JPH01278585 A JP H01278585A
Authority
JP
Japan
Prior art keywords
weight
parts
meth
acrylate
resist ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63108503A
Other languages
English (en)
Japanese (ja)
Inventor
Osamu Ogitani
荻谷　修
Takashi Shimizu
敬 清水
Ryuichi Fujii
隆一 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Somar Corp
Original Assignee
Somar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Somar Corp filed Critical Somar Corp
Priority to JP63108503A priority Critical patent/JPH01278585A/ja
Priority to GB8923304A priority patent/GB2237887A/en
Priority to BE8901152A priority patent/BE1003337A3/fr
Publication of JPH01278585A publication Critical patent/JPH01278585A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP63108503A 1988-04-30 1988-04-30 紫外線硬化性レジストインキ Pending JPH01278585A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP63108503A JPH01278585A (ja) 1988-04-30 1988-04-30 紫外線硬化性レジストインキ
GB8923304A GB2237887A (en) 1988-04-30 1989-10-16 Photocurable composition
BE8901152A BE1003337A3 (fr) 1988-04-30 1989-10-26 Encre de reserve photodurcissable.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63108503A JPH01278585A (ja) 1988-04-30 1988-04-30 紫外線硬化性レジストインキ
BE8901152A BE1003337A3 (fr) 1988-04-30 1989-10-26 Encre de reserve photodurcissable.

Publications (1)

Publication Number Publication Date
JPH01278585A true JPH01278585A (ja) 1989-11-08

Family

ID=25662482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63108503A Pending JPH01278585A (ja) 1988-04-30 1988-04-30 紫外線硬化性レジストインキ

Country Status (3)

Country Link
JP (1) JPH01278585A (fr)
BE (1) BE1003337A3 (fr)
GB (1) GB2237887A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0436927A (ja) * 1990-05-31 1992-02-06 Fuji Yakuhin Kogyo Kk 光粘着化感光性組成物
BE1003994A4 (fr) * 1988-11-16 1992-09-08 Somar Corp Composition de resine durcissable par irradiation par des rayons de haute energie.
US5216071A (en) * 1991-11-22 1993-06-01 Westvaco Corporation Hydroxyacrylic modified inks

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258263A (en) * 1991-09-10 1993-11-02 Polaroid Corporation Printing plate and methods of making and use same
DE4416660A1 (de) * 1993-05-14 1994-11-17 Du Pont Verfahren zum Abscheiden eines Metalls auf einem Substrat aus einem Galvanisierbad
GB0221892D0 (en) 2002-09-20 2002-10-30 Avecia Ltd Process
WO2020138034A1 (fr) * 2018-12-27 2020-07-02 株式会社カネカ Composition de résine utilisée pour former un motif de réserve, et procédé de fabrication d'un produit semi-conducteur

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3754920A (en) * 1971-04-30 1973-08-28 Du Pont Photopolymerizable elements of low optical density containing thickeners with discrete orderly orientation
US4148654A (en) * 1976-07-22 1979-04-10 Oddi Michael J Positive acting photoresist comprising diazide ester, novolak resin and rosin
JPS5713444A (en) * 1980-06-27 1982-01-23 Tamura Kaken Kk Photosensitive composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1003994A4 (fr) * 1988-11-16 1992-09-08 Somar Corp Composition de resine durcissable par irradiation par des rayons de haute energie.
JPH0436927A (ja) * 1990-05-31 1992-02-06 Fuji Yakuhin Kogyo Kk 光粘着化感光性組成物
US5216071A (en) * 1991-11-22 1993-06-01 Westvaco Corporation Hydroxyacrylic modified inks

Also Published As

Publication number Publication date
BE1003337A3 (fr) 1992-03-03
GB2237887A (en) 1991-05-15
GB8923304D0 (en) 1989-12-06

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