JPH0141277B2 - - Google Patents

Info

Publication number
JPH0141277B2
JPH0141277B2 JP60207696A JP20769685A JPH0141277B2 JP H0141277 B2 JPH0141277 B2 JP H0141277B2 JP 60207696 A JP60207696 A JP 60207696A JP 20769685 A JP20769685 A JP 20769685A JP H0141277 B2 JPH0141277 B2 JP H0141277B2
Authority
JP
Japan
Prior art keywords
adhesive layer
hole
circuit board
copper foil
cover film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60207696A
Other languages
English (en)
Other versions
JPS62111498A (ja
Inventor
Kooberu Horusuto
Torogitsushu Gyuntaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Freudenberg KG
Original Assignee
Carl Freudenberg KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Freudenberg KG filed Critical Carl Freudenberg KG
Publication of JPS62111498A publication Critical patent/JPS62111498A/ja
Publication of JPH0141277B2 publication Critical patent/JPH0141277B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Socks And Pantyhose (AREA)
  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)

Description

【発明の詳細な説明】 本発明は、大きな曲げ応力に適応するスルーホ
ール導通可撓性プリント回路板の製造法に関す
る。
電子工学においては、例えばデイスクメモリお
よび印字機の如き大きな動的曲げ応力を受ける場
合に、平担で非常に整つた表面を持つ必要のある
可撓性回路板を使用して、該回路板外部の部品に
よつて生ずる電気機械的な機能故障を防止するよ
うにしている。
その為、屈曲部の外側にスルーホール導通部を
設けた２つの回路部を有し大きな曲げ応力に耐え
る可撓性プリント回路板は、通常、片面の可撓性
回路板に製作されて同等厚さの支持フイルム及び
カバーフイルムを備えている（対称配置構造）。
ベース材としては、例えばポリイミドを含む両面
銅接合箔が使用される。この場合、銅箔は接着層
を介して支持フイルムの両面に接合される。スル
ーホール導通部とプリント回路パターンとは、通
常の方法によるサブトラクテイブ法（エツチン
グ）で形成される。この際、屈曲部では回路は片
面だけに形成され、他の面は完全にエツチングさ
れる。次に回路には、支持フイルムと同等厚さの
カバーフイルムが設けられる。
この一見対称的な構造にも拘らず回路は曲げ応
力に対して中立的に挙動する積層板の断面部分に
は位置しない。即ち、引張り又は圧縮のいずれか
の力にさらされる（“中立筋”）。即ち、上記構成
にも拘らず、エツチングされた支持フイルムの接
着層が非対称性を生じ、中立筋は他の断面領域に
移る。更に、プリント回路板は露出した接着剤に
よつてゴミが付着し易く、また、摩滅し易い。
ベース材の支持フイルムを回路側のカバーフイ
ルムの半分の厚さに構成することも試みられた。
支持フイルムのエツチングした側に、該支持フ
イルムと同等厚さのカバーフイルムを設けること
も追加提案された。
この構造では露出した接着層は存在しないが、
この場合には支持フイルム上に２つの接着層が存
在するため、屈曲部に於ける厳密な対称性は得ら
れない。更に、屈曲部に於ける構造の全体厚さ
は、片面プリント回路板に於ける程には薄くな
く、従つてこれと同じような可撓性を示さない。
本発明の課題は、第一に大きな曲げ応力に耐え
るスルーホール導通可撓性プリント回路板であつ
て、屈曲部に厳密な対称性の層構造を有する回路
の製造法を提供することにある。回路はこの領域
では前記中立筋の内方に位置し、また、露出した
接着層を具備しないように構成されている。
上記課題は、特許請求の範囲の特徴を示す部分
に提案した方法によつて解決される。以下に記載
した本発明による方法を説明するため、第１図な
いし第３図を使用する 本発明による製造法は、第１工程で好ましくは
銅の如き金属箔７、接着層６、並びに支持フイル
ム５より成る片面金属被覆可撓性ベース材３に位
置決め用孔４を設ける。
次に、このベース材３の支持フイルム５の上に
接着層２、例えば接着フイルム又は流動しないプ
リプレグ等を屈曲部ａを除いて重ねる。ベース材
３の上の接着領域のこの空白部９は、位置決め孔
４によつて確定される。その後、上部接着層２上
に上部銅箔１が配置される。ここで、第１図に示
すようなこの構造を積層して可撓性の積層体に形
成する。
この積層体の加工は、次のように行われる。屈
曲部ａの外部に設ける必要のあるスルーホール導
通孔１０の位置と屈曲部ａの内部で接着層２の空
白部９の上に正確に存在すべき回路の位置とは、
位置決め用孔４で正確に設定できる。
次に、屈曲部ａに積層された銅箔１は、回路形
成と同時にエツチングされてベース材３の支持フ
イルム５が露出する。
最後に、回路部１と７との表面にそれぞれの接
着層１２と１３によつて上部カバーフイルム８及
び下部カバーフイルム１１を被着する。この際、
接着層１２を含めた上部カバーフイルム８は接着
層６を含めた支持フイルム５と同じ厚さを示す。
第３図で明らかなように、この製造工程によつ
て、動的な応力を受ける屈曲部ａは中立筋の内方
に配置され、即ち、曲げた際に現われる力に関し
て中立の領域に位置し、また、プリント回路板の
表面は、カバーフイルム８ないしは支持フイルム
５によつて接着層はそれぞれ露出しない構造とな
る。プリント回路板の断面は、屈曲部ａの領域で
厳密に対称的に形成されている。
本発明方法を使用することにより、屈曲性、特
に動的応力に於いて公知の片面プリント回路板に
劣ることのないスルーホール導通可撓性プリント
回路板を経済的に製造できる。従つて、課題の設
定で掲げた要件は、完全に満足される。
【図面の簡単な説明】
第１図は、本発明方法に従つて製造した可撓性
積層体のスルーホール導通部と回路とを形成する
前の断面構造図、第２図は、第１図の積層体の平
面図、そして、第３図は、本発明によつて製造し
た課題の提示に対応するプリント回路板の概念的
断面図である。 ａ：動的応力を受ける屈曲部、１：上部銅箔、
２：上部接着層、３：片面銅被着可撓性ベース
材、４：位置決め用孔、５：支持フイルム、６：
下部接着層、７：下部銅箔、８：上部カバーフイ
ルム、９：接着層２の空白部、１０：スルーホー
ル導通部、１１：下部カバーフイルム、１２：カ
バーフイルム８の接着層、１３：カバーフイルム
１１の接着層。

Claims (1)

    【特許請求の範囲】
  1. １ 層の順に厳密な対称的断層を屈曲部に有する
    と共に、露出接着層を有しない大きな曲げ応力に
    耐えるスルーホール導通可撓性プリント回路板の
    製造法に於いて、片面銅被着可撓性ベース材３に
    位置決め用孔４を設け、位置決め用孔４に従つて
    屈曲部ａを除いて、ベース材３の支持フイルム５
    上に接着層２を配置し、接着層２上に銅箔１を配
    置し、上記各層を積層し、位置決め用孔４及びマ
    スクに従つてスルーホール導通孔１０と回路パタ
    ーンとを位置決めしてスルーホール導通孔１０を
    屈曲部ａの外部に配置すると共に屈曲部ａの内方
    に位置する回路部を正確に接着層２の空白部９内
    に配置し、回路間の部分及び銅箔１を同時にエツ
    チングして屈曲部ａの銅箔部分を完全に除去し、
    接着層１２ないしは１３を使用して回路部１及び
    ７とを上部カバーフイルム８及び下部カバーフイ
    ルム１１で各別に被覆し、この接着層１２を含め
    たカバーフイルム８の厚さを接着層６を含めた支
    持フイルム５の厚さと同等にすることを特徴とす
    る高屈曲性スルーホール導通可撓性プリント回路
    板の製造法。
JP60207696A 1984-09-21 1985-09-19 高屈曲性スル−ホ−ル導通可撓性プリント回路板の製造法 Granted JPS62111498A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3434672A DE3434672C2 (de) 1984-09-21 1984-09-21 Verfahren zur Herstellung von flexiblen Leiterplatten für hohe Biegebeanspruchung
DE3434672.4 1984-09-21

Publications (2)

Publication Number Publication Date
JPS62111498A JPS62111498A (ja) 1987-05-22
JPH0141277B2 true JPH0141277B2 (ja) 1989-09-04

Family

ID=6245970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60207696A Granted JPS62111498A (ja) 1984-09-21 1985-09-19 高屈曲性スル−ホ−ル導通可撓性プリント回路板の製造法

Country Status (7)

Country Link
US (1) US4626462A (ja)
EP (1) EP0175045B1 (ja)
JP (1) JPS62111498A (ja)
AT (1) ATE59756T1 (ja)
DE (2) DE3434672C2 (ja)
ES (1) ES8607673A1 (ja)
NO (1) NO163390C (ja)

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JPS62111498A (ja) 1987-05-22
DE3434672C2 (de) 1986-09-11
ES541404A0 (es) 1986-05-16
ES8607673A1 (es) 1986-05-16
EP0175045B1 (de) 1991-01-02
NO850930L (no) 1986-03-24
DE3434672A1 (de) 1986-03-27
US4626462A (en) 1986-12-02
EP0175045A2 (de) 1986-03-26
EP0175045A3 (en) 1988-01-07
ATE59756T1 (de) 1991-01-15
DE3581027D1 (de) 1991-02-07
NO163390B (no) 1990-02-05
NO163390C (no) 1990-05-16

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