JPH0160552U - - Google Patents
Info
- Publication number
- JPH0160552U JPH0160552U JP15640487U JP15640487U JPH0160552U JP H0160552 U JPH0160552 U JP H0160552U JP 15640487 U JP15640487 U JP 15640487U JP 15640487 U JP15640487 U JP 15640487U JP H0160552 U JPH0160552 U JP H0160552U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- memorizes
- inputting
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図および第２図はそれぞれ本考案の一実施
例を示すモールド樹脂封止型半導体装置の斜視図
および内部接続を示す一部切開図である。
１…ＩＣパツケージ、２…端子リード、３…ボ
ンデイング線、４…ボンデイングパツト、５…ス
テツチ、６…ＩＣチツプ、７…ＩＣケース。
1 and 2 are a perspective view and a partially cutaway view showing internal connections of a molded resin-sealed semiconductor device showing one embodiment of the present invention, respectively. 1...IC package, 2...terminal lead, 3...bonding wire, 4...bonding pad, 5...stitch, 6...IC chip, 7...IC case.
Claims (1)
ド線が所定の温度で所定の形状を記憶する形状記
憶合金で形成されることを特徴とする半導体装置
。 A semiconductor device characterized in that lead wires for inputting and outputting signals between an internal circuit and the outside are formed of a shape memory alloy that memorizes a predetermined shape at a predetermined temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15640487U JPH0160552U (en) | 1987-10-12 | 1987-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15640487U JPH0160552U (en) | 1987-10-12 | 1987-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0160552U true JPH0160552U (en) | 1989-04-17 |
Family
ID=31434913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15640487U Pending JPH0160552U (en) | 1987-10-12 | 1987-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0160552U (en) |
-
1987
- 1987-10-12 JP JP15640487U patent/JPH0160552U/ja active Pending
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