JPH0167737U - - Google Patents
Info
- Publication number
- JPH0167737U JPH0167737U JP1987162367U JP16236787U JPH0167737U JP H0167737 U JPH0167737 U JP H0167737U JP 1987162367 U JP1987162367 U JP 1987162367U JP 16236787 U JP16236787 U JP 16236787U JP H0167737 U JPH0167737 U JP H0167737U
- Authority
- JP
- Japan
- Prior art keywords
- etched
- reaction chamber
- showing
- exciting
- surround
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Description
第１図は一実施例を示す概略断面図、第２図は
同実施例においてウエハが設置される部分を示す
部分平面図、第３図はウエハ内の測定位置を示す
平面図、第４図は同実施例と従来例とにおけるエ
ツチング速度分布を示す図、第５図は従来のプラ
ズマエツチング装置の一例を示す概略断面図であ
る。
２……反応室、４……下部電極、６……上部電
極、８ａ……ウエハ設置台、１０……被エツチン
グ物、２０……永久磁石。
Fig. 1 is a schematic cross-sectional view showing one embodiment, Fig. 2 is a partial plan view showing the part where the wafer is installed in the same embodiment, Fig. 3 is a plan view showing the measurement position within the wafer, and Fig. 4 5 is a diagram showing the etching rate distribution in the same embodiment and the conventional example, and FIG. 5 is a schematic sectional view showing an example of a conventional plasma etching apparatus. 2...Reaction chamber, 4...Lower electrode, 6...Upper electrode, 8a...Wafer installation stand, 10...Object to be etched, 20...Permanent magnet.
Claims (1)
反応ガスを励起して前記被エツチング物をエツチ
ングするドライエツチング装置において、前記被
エツチング物が設置される部分の側方周辺を取り
囲んで永久磁石を配置したことを特徴とするドラ
イエツチング装置。 For the object to be etched installed in the reaction chamber,
1. A dry etching apparatus for etching the object to be etched by exciting a reactive gas, characterized in that permanent magnets are arranged to surround the lateral periphery of a portion where the object to be etched is installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162367U JPH0167737U (en) | 1987-10-22 | 1987-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162367U JPH0167737U (en) | 1987-10-22 | 1987-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167737U true JPH0167737U (en) | 1989-05-01 |
Family
ID=31446126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987162367U Pending JPH0167737U (en) | 1987-10-22 | 1987-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167737U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58911A (en) * | 1981-06-18 | 1983-01-06 | ロレアル | Dyeing composition and oxidation prevention |
| JPS58151028A (en) * | 1982-01-26 | 1983-09-08 | マテリアルズ・リサ−チ・コ−ポレ−シヨン | Magnetically strengthened plasma treating method and device |
| JPS63186429A (en) * | 1987-01-29 | 1988-08-02 | Oki Electric Ind Co Ltd | Drying processor |
-
1987
- 1987-10-22 JP JP1987162367U patent/JPH0167737U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58911A (en) * | 1981-06-18 | 1983-01-06 | ロレアル | Dyeing composition and oxidation prevention |
| JPS58151028A (en) * | 1982-01-26 | 1983-09-08 | マテリアルズ・リサ−チ・コ−ポレ−シヨン | Magnetically strengthened plasma treating method and device |
| JPS63186429A (en) * | 1987-01-29 | 1988-08-02 | Oki Electric Ind Co Ltd | Drying processor |