JPH0211017B2 - - Google Patents

Info

Publication number
JPH0211017B2
JPH0211017B2 JP58187984A JP18798483A JPH0211017B2 JP H0211017 B2 JPH0211017 B2 JP H0211017B2 JP 58187984 A JP58187984 A JP 58187984A JP 18798483 A JP18798483 A JP 18798483A JP H0211017 B2 JPH0211017 B2 JP H0211017B2
Authority
JP
Japan
Prior art keywords
layer
winding
wire
winding part
wound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58187984A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6080263A (ja
Inventor
Naoyuki Hosoda
Tamotsu Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP58187984A priority Critical patent/JPS6080263A/ja
Publication of JPS6080263A publication Critical patent/JPS6080263A/ja
Publication of JPH0211017B2 publication Critical patent/JPH0211017B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H55/00—Wound packages of filamentary material
    • B65H55/04—Wound packages of filamentary material characterised by method of winding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)
JP58187984A 1983-10-07 1983-10-07 半導体素子のボンデイングワイヤ Granted JPS6080263A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58187984A JPS6080263A (ja) 1983-10-07 1983-10-07 半導体素子のボンデイングワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58187984A JPS6080263A (ja) 1983-10-07 1983-10-07 半導体素子のボンデイングワイヤ

Publications (2)

Publication Number Publication Date
JPS6080263A JPS6080263A (ja) 1985-05-08
JPH0211017B2 true JPH0211017B2 (2) 1990-03-12

Family

ID=16215578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58187984A Granted JPS6080263A (ja) 1983-10-07 1983-10-07 半導体素子のボンデイングワイヤ

Country Status (1)

Country Link
JP (1) JPS6080263A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH053114U (ja) * 1991-06-27 1993-01-19 本州製紙株式会社 食品用テ−パ付き折畳みトレ−

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH053114U (ja) * 1991-06-27 1993-01-19 本州製紙株式会社 食品用テ−パ付き折畳みトレ−

Also Published As

Publication number Publication date
JPS6080263A (ja) 1985-05-08

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