JPH0215743U - - Google Patents
Info
- Publication number
- JPH0215743U JPH0215743U JP9419088U JP9419088U JPH0215743U JP H0215743 U JPH0215743 U JP H0215743U JP 9419088 U JP9419088 U JP 9419088U JP 9419088 U JP9419088 U JP 9419088U JP H0215743 U JPH0215743 U JP H0215743U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- seat
- positioning
- elastic member
- positioning block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 4
- 230000000452 restraining effect Effects 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Bending Of Plates, Rods, And Pipes (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の位置決め装置の要部を示す斜
視図、第２図及び第３図は位置決めブロツクによ
る半導体基板の位置決め状況を示す断面図、第４
図は半導体基板の位置決めから外部リードの曲げ
加工までの工程を示す断面図、第５図は加工後の
製品形状を示す正面図、第６図はパイロツト孔を
開けたリードフレームを示す平面図、第７図ａは
半導体基板とリードフレームとのずれを示す平面
図、第７図ｂは外部リードの曲げ不良を示すもの
である。
１：受座、２：上型、２ａ：チヤンバ、２ｂ：
圧縮コイルスプリング、３：位置決めブロツク、
３ａ，３ｂ：拘束面、４：パンチ、５ａ，５ｂ：
成形ブロツク、６ａ：カーリング成形ブロツク、
６ｂ：圧下カム、７ａ，７ｂ：曲げ成形ブロツク
、８ａ：成形ブロツク、８ｂ：圧下カム。
FIG. 1 is a perspective view showing the main parts of the positioning device of the present invention, FIGS. 2 and 3 are sectional views showing how the semiconductor substrate is positioned by the positioning block, and FIG.
The figure is a cross-sectional view showing the process from positioning the semiconductor substrate to bending the external leads, Figure 5 is a front view showing the shape of the product after processing, Figure 6 is a plan view showing the lead frame with a pilot hole. FIG. 7a is a plan view showing misalignment between the semiconductor substrate and the lead frame, and FIG. 7b is a plan view showing a bending defect in the external lead. 1: catch seat, 2: upper mold, 2a: chamber, 2b:
Compression coil spring, 3: Positioning block,
3a, 3b: restraint surface, 4: punch, 5a, 5b:
Forming block, 6a: Curling forming block,
6b: Reduction cam, 7a, 7b: Bending forming block, 8a: Forming block, 8b: Reduction cam.
Claims (1)
半導体基板に一体化したリードフレームの外部リ
ードを曲げ加工する金型装置用の位置決め装置で
あつて、前記金型の受座に載せた前記半導体基板
のコーナ部を指向する位置決めブロツクを前記受
座の上方に位置する上型に設け、該位置決めブロ
ツクは前記受座方向に弾性部材によつて付勢され
、更に位置決めブロツクの下端部に前記半導体基
板のコーナ部及びその近傍の隣接２辺を拘束する
拘束面を形成し、該拘束面を下端側が開くテーパ
面としたことを特徴とする半導体基板の位置決め
装置。 ２ 位置決めブロツクを半導体基板の４個のコー
ナ部に対応して上型に４個設け、これらの位置決
めブロツクは前記弾性部材による付勢力に応じて
前記受座方向へ独立して進退可能としたことを特
徴とする請求項１記載の半導体基板の位置決め装
置。[Claims for Utility Model Registration] 1. A positioning device for a mold device for bending external leads of a lead frame integrated with a rectangular ceramic semiconductor substrate, which A positioning block oriented toward the corner of the semiconductor substrate placed on the seat is provided on the upper mold located above the seat, the positioning block is biased toward the seat by an elastic member, and the positioning block is biased toward the seat by an elastic member. A positioning device for a semiconductor substrate, characterized in that a restraining surface is formed at a lower end portion of the semiconductor substrate for restraining a corner portion of the semiconductor substrate and two adjacent sides thereof, and the restraining surface is a tapered surface that opens at the lower end side. 2. Four positioning blocks are provided on the upper mold corresponding to the four corners of the semiconductor substrate, and these positioning blocks are capable of independently moving forward and backward in the direction of the receiving seat according to the urging force of the elastic member. The semiconductor substrate positioning device according to claim 1, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9419088U JPH073643Y2 (en) | 1988-07-15 | 1988-07-15 | Positioning device for semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9419088U JPH073643Y2 (en) | 1988-07-15 | 1988-07-15 | Positioning device for semiconductor substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0215743U true JPH0215743U (en) | 1990-01-31 |
| JPH073643Y2 JPH073643Y2 (en) | 1995-01-30 |
Family
ID=31318691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9419088U Expired - Lifetime JPH073643Y2 (en) | 1988-07-15 | 1988-07-15 | Positioning device for semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073643Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012134202A (en) * | 2010-12-20 | 2012-07-12 | Mitsubishi Electric Corp | Semiconductor device manufacturing method |
-
1988
- 1988-07-15 JP JP9419088U patent/JPH073643Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012134202A (en) * | 2010-12-20 | 2012-07-12 | Mitsubishi Electric Corp | Semiconductor device manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH073643Y2 (en) | 1995-01-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH073643Y2 (en) | Positioning device for semiconductor substrate | |
| JPH021596U (en) | ||
| JPH0416602U (en) | ||
| JP2740314B2 (en) | Manufacturing apparatus for metal leads having bumps | |
| JPS6367239U (en) | ||
| JPS59194344U (en) | floating press mold | |
| JPH0317644U (en) | ||
| JPH0425300U (en) | ||
| JPH0158948U (en) | ||
| JPS62114451U (en) | ||
| JPH0313743U (en) | ||
| JPH0249127U (en) | ||
| JPH0310536U (en) | ||
| JPH0482840U (en) | ||
| JPS59171824U (en) | Protrusion forming device | |
| JPH02131354U (en) | ||
| JPH0282039U (en) | ||
| JPS63196317U (en) | ||
| JPS6424837U (en) | ||
| JPH0272558U (en) | ||
| JPH0339841U (en) | ||
| JPS62120352U (en) | ||
| JPH0222212U (en) | ||
| JPH04423U (en) | ||
| JPH0178045U (en) |