JPH02187422A - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物

Info

Publication number: JPH02187422A
Authority: JP; Japan
Prior art keywords: epoxy resin; formulas; phenolic; phenolic resin; resins
Prior art date: 1989-01-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP596689A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0575776B2 (fr

Inventor

Naoki Mogi

直樹茂木

Wataru Kosaka

弥小坂

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Sumitomo Bakelite Co Ltd

Original Assignee

Sumitomo Bakelite Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-01-17

Filing date

1989-01-17

Publication date

1990-07-23

1989-01-17 Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd

1989-01-17 Priority to JP596689A priority Critical patent/JPH02187422A/ja

1990-07-23 Publication of JPH02187422A publication Critical patent/JPH02187422A/ja

1993-10-21 Publication of JPH0575776B2 publication Critical patent/JPH0575776B2/ja

Status Granted legal-status Critical Current

Links

239000003822 epoxy resin Substances 0.000 title claims abstract description 23
239000000203 mixture Substances 0.000 title claims abstract description 23
229920000647 polyepoxide Polymers 0.000 title claims abstract description 23
239000005011 phenolic resin Substances 0.000 claims abstract description 20
229920001568 phenolic resin Polymers 0.000 claims abstract description 19
KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 12
239000004065 semiconductor Substances 0.000 claims abstract description 9
239000003795 chemical substances by application Substances 0.000 claims abstract description 8
239000000126 substance Substances 0.000 claims description 6
238000005538 encapsulation Methods 0.000 claims description 4
239000000945 filler Substances 0.000 claims description 3
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 16
230000035939 shock Effects 0.000 abstract description 9
229920005989 resin Polymers 0.000 abstract description 8
239000011347 resin Substances 0.000 abstract description 8
238000002156 mixing Methods 0.000 abstract description 6
238000007789 sealing Methods 0.000 abstract description 6
239000005350 fused silica glass Substances 0.000 abstract description 3
239000011256 inorganic filler Substances 0.000 abstract description 3
229910003475 inorganic filler Inorganic materials 0.000 abstract description 3
WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 abstract 1
238000012360 testing method Methods 0.000 description 18
229910000679 solder Inorganic materials 0.000 description 14
239000012778 molding material Substances 0.000 description 9
239000000377 silicon dioxide Substances 0.000 description 6
229920003986 novolac Polymers 0.000 description 5
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
239000000654 additive Substances 0.000 description 4
229920001296 polysiloxane Polymers 0.000 description 3
LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
239000006229 carbon black Substances 0.000 description 2
238000006243 chemical reaction Methods 0.000 description 2
238000007796 conventional method Methods 0.000 description 2
230000007423 decrease Effects 0.000 description 2
XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
230000000694 effects Effects 0.000 description 2
125000003700 epoxy group Chemical group 0.000 description 2
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
238000007654 immersion Methods 0.000 description 2
238000000034 method Methods 0.000 description 2
238000000465 moulding Methods 0.000 description 2
QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
239000000843 powder Substances 0.000 description 2
RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
239000001993 wax Substances 0.000 description 2
QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
229930185605 Bisphenol Natural products 0.000 description 1
229920000049 Carbon (fiber) Polymers 0.000 description 1
239000006087 Silane Coupling Agent Substances 0.000 description 1
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
150000008064 anhydrides Chemical class 0.000 description 1
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
229910000019 calcium carbonate Inorganic materials 0.000 description 1
239000004917 carbon fiber Substances 0.000 description 1
235000013869 carnauba wax Nutrition 0.000 description 1
239000004203 carnauba wax Substances 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
239000003086 colorant Substances 0.000 description 1
230000000052 comparative effect Effects 0.000 description 1
150000001875 compounds Chemical class 0.000 description 1
229930003836 cresol Natural products 0.000 description 1
229910002026 crystalline silica Inorganic materials 0.000 description 1
230000002542 deteriorative effect Effects 0.000 description 1
229920001971 elastomer Polymers 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
238000009413 insulation Methods 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
239000000463 material Substances 0.000 description 1
VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
239000004843 novolac epoxy resin Substances 0.000 description 1
238000004806 packaging method and process Methods 0.000 description 1
-1 phenol novolac resin Chemical compound 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
239000011819 refractory material Substances 0.000 description 1
239000011342 resin composition Substances 0.000 description 1
239000003566 sealing material Substances 0.000 description 1
235000012239 silicon dioxide Nutrition 0.000 description 1
238000005476 soldering Methods 0.000 description 1
229920001169 thermoplastic Polymers 0.000 description 1
239000004416 thermosoftening plastic Substances 0.000 description 1
AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
238000001721 transfer moulding Methods 0.000 description 1
150000003918 triazines Chemical class 0.000 description 1

Landscapes

Compositions Of Macromolecular Compounds (AREA)
Epoxy Resins (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Organic Insulating Materials (AREA)

JP596689A 1989-01-17 1989-01-17 エポキシ樹脂組成物 Granted JPH02187422A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP596689A JPH02187422A (ja)	1989-01-17	1989-01-17	エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP596689A JPH02187422A (ja)	1989-01-17	1989-01-17	エポキシ樹脂組成物

Publications (2)

Publication Number	Publication Date
JPH02187422A true JPH02187422A (ja)	1990-07-23
JPH0575776B2 JPH0575776B2 (fr)	1993-10-21

Family

ID=11625616

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP596689A Granted JPH02187422A (ja)	1989-01-17	1989-01-17	エポキシ樹脂組成物

Country Status (1)

Country	Link
JP (1)	JPH02187422A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN106783165A (zh) *	2016-12-07	2017-05-31	江苏聚冠新材料科技有限公司	一种薄膜电容器密封蜡及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS57210647A (en) *	1982-05-08	1982-12-24	Nitto Electric Ind Co Ltd	Semiconductor device
US4394497A (en) *	1982-03-29	1983-07-19	The Dow Chemical Company	Solid materials prepared from epoxy resins and phenolic hydroxyl-containing materials
JPS6399224A (ja) *	1986-10-16	1988-04-30	Sanyo Kokusaku Pulp Co Ltd	フエノ−ル樹脂の製造法

1989
- 1989-01-17 JP JP596689A patent/JPH02187422A/ja active Granted

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4394497A (en) *	1982-03-29	1983-07-19	The Dow Chemical Company	Solid materials prepared from epoxy resins and phenolic hydroxyl-containing materials
JPS57210647A (en) *	1982-05-08	1982-12-24	Nitto Electric Ind Co Ltd	Semiconductor device
JPS6399224A (ja) *	1986-10-16	1988-04-30	Sanyo Kokusaku Pulp Co Ltd	フエノ−ル樹脂の製造法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN106783165A (zh) *	2016-12-07	2017-05-31	江苏聚冠新材料科技有限公司	一种薄膜电容器密封蜡及其制备方法
CN106783165B (zh) *	2016-12-07	2019-02-22	江苏聚冠新材料科技有限公司	一种薄膜电容器密封蜡及其制备方法

Also Published As

Publication number	Publication date
JPH0575776B2 (fr)	1993-10-21

Publication	Publication Date	Title
JPH01105562A (ja)	1989-04-24	樹脂封止型半導体装置
JP2963260B2 (ja)	1999-10-18	エポキシ樹脂組成物
JPH02187422A (ja)	1990-07-23	エポキシ樹脂組成物
JP2991849B2 (ja)	1999-12-20	エポキシ樹脂組成物
JP2675108B2 (ja)	1997-11-12	エポキシ樹脂組成物
JPH01152151A (ja)	1989-06-14	エポキシ樹脂組成物
JPH0275620A (ja)	1990-03-15	半導体封止用エポキシ樹脂組成物
JP3008981B2 (ja)	2000-02-14	エポキシ樹脂組成物
JP2823633B2 (ja)	1998-11-11	エポキシ樹脂組成物
JP3011807B2 (ja)	2000-02-21	エポキシ樹脂組成物
JPH02219814A (ja)	1990-09-03	エポキシ樹脂組成物
JP2680389B2 (ja)	1997-11-19	エポキシ樹脂組成物
JP3093051B2 (ja)	2000-10-03	エポキシ樹脂組成物
JP2690992B2 (ja)	1997-12-17	エポキシ樹脂組成物
JPH0232115A (ja)	1990-02-01	半導体封止用エポキシ樹脂組成物
JPH01275620A (ja)	1989-11-06	半導体封止用エポキシ樹脂組成物
JPH05175373A (ja)	1993-07-13	エポキシ樹脂組成物
JPH03195722A (ja)	1991-08-27	エポキシ樹脂組成物
JP3568654B2 (ja)	2004-09-22	エポキシ樹脂組成物
JPH0275619A (ja)	1990-03-15	半導体封止用エポキシ樹脂組成物
JPH02219816A (ja)	1990-09-03	エポキシ樹脂組成物
JPH03128920A (ja)	1991-05-31	エポキシ樹脂組成物
JPH09316176A (ja)	1997-12-09	半導体封止用エポキシ樹脂組成物
JPH01268713A (ja)	1989-10-26	半導体封止用エポキシ樹脂組成物
JPH02173033A (ja)	1990-07-04	半導体封止用エポキシ樹脂組成物