JPH0226250U - - Google Patents

Info

Publication number
JPH0226250U
JPH0226250U JP1988105198U JP10519888U JPH0226250U JP H0226250 U JPH0226250 U JP H0226250U JP 1988105198 U JP1988105198 U JP 1988105198U JP 10519888 U JP10519888 U JP 10519888U JP H0226250 U JPH0226250 U JP H0226250U
Authority
JP
Japan
Prior art keywords
chip
bonding pad
chip element
fixing
pad surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988105198U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988105198U priority Critical patent/JPH0226250U/ja
Publication of JPH0226250U publication Critical patent/JPH0226250U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Description

【図面の簡単な説明】
第１図は、この考案の好適な実施例の斜視図で
ある。第２図は、第１図に示すものにバツフアコ
ート樹脂を注入硬化し、基板に載置したものの断
面図である。第３図は、従来技術を示す垂直断面
図である。 １……チツプ素子、２……チツプ台、３……ボ
ンデイングワイヤ、４……端子、５……枠体、６
……バツフアコート樹脂、７……基板、４１……
ボンデイングパツド面、５１……突起部、７１…
…位置決め穴。

Claims (1)

    【実用新案登録請求の範囲】
  1. チツプ素子を固着する導電性のチツプ台と、前
    記チツプ素子を接続するボンデイングパツド面を
    形成した端子と、前記チツプ台の固着面及び前記
    端子のボンデイングパツド面を露出状態でインサ
    ート成形した有底箱状の枠体とで構成したことを
    特徴とするチツプ素子収納ケース。
JP1988105198U 1988-08-09 1988-08-09 Pending JPH0226250U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988105198U JPH0226250U (ja) 1988-08-09 1988-08-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988105198U JPH0226250U (ja) 1988-08-09 1988-08-09

Publications (1)

Publication Number Publication Date
JPH0226250U true JPH0226250U (ja) 1990-02-21

Family

ID=31337595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988105198U Pending JPH0226250U (ja) 1988-08-09 1988-08-09

Country Status (1)

Country Link
JP (1) JPH0226250U (ja)

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