JPH0270447U - - Google Patents

Info

Publication number
JPH0270447U
JPH0270447U JP1988150469U JP15046988U JPH0270447U JP H0270447 U JPH0270447 U JP H0270447U JP 1988150469 U JP1988150469 U JP 1988150469U JP 15046988 U JP15046988 U JP 15046988U JP H0270447 U JPH0270447 U JP H0270447U
Authority
JP
Japan
Prior art keywords
circuit board
recess
placement
utility
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988150469U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988150469U priority Critical patent/JPH0270447U/ja
Publication of JPH0270447U publication Critical patent/JPH0270447U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案のＩＣ実装の回路基板構造の一
実施例を示す主要断面図。第２図は従来のＩＣ実
装の回路基板構造を示す断面図。 １……回路基板基材、２……配線導体、３……
レジスト、４……回路基板、５……凹部、６……
ＩＣチツプ、７……接着剤、８……金線、９……
ＩＣ封止樹脂、１０……貫通穴。

Claims (1)

    【実用新案登録請求の範囲】
  1. 回路基板にＩＣを実装する構造において、前記
    回路基板のＩＣ配置部にＩＣ配置用の凹部を有し
    さらに、前記凹部に回路基板の両側、両間に貫通
    する穴を少なくとも１つ以上設けたことを特徴と
    する回路基板構造。
JP1988150469U 1988-11-18 1988-11-18 Pending JPH0270447U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988150469U JPH0270447U (ja) 1988-11-18 1988-11-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988150469U JPH0270447U (ja) 1988-11-18 1988-11-18

Publications (1)

Publication Number Publication Date
JPH0270447U true JPH0270447U (ja) 1990-05-29

Family

ID=31423644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988150469U Pending JPH0270447U (ja) 1988-11-18 1988-11-18

Country Status (1)

Country Link
JP (1) JPH0270447U (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0845968A (ja) * 1994-08-04 1996-02-16 Nec Corp 半導体パッケージ
JPH08167678A (ja) * 1994-12-09 1996-06-25 Sony Corp 半導体装置
JP2818975B2 (ja) * 1992-06-23 1998-10-30 ミンテック コーポレーション 界面活性剤を含有する中空繊維膜とその製造法
JP2010171082A (ja) * 2009-01-20 2010-08-05 Panasonic Corp 回路モジュール及び電子機器

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2818975B2 (ja) * 1992-06-23 1998-10-30 ミンテック コーポレーション 界面活性剤を含有する中空繊維膜とその製造法
JPH0845968A (ja) * 1994-08-04 1996-02-16 Nec Corp 半導体パッケージ
JPH08167678A (ja) * 1994-12-09 1996-06-25 Sony Corp 半導体装置
JP2010171082A (ja) * 2009-01-20 2010-08-05 Panasonic Corp 回路モジュール及び電子機器

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