JPH01140834U - - Google Patents

Info

Publication number
JPH01140834U
JPH01140834U JP1988036481U JP3648188U JPH01140834U JP H01140834 U JPH01140834 U JP H01140834U JP 1988036481 U JP1988036481 U JP 1988036481U JP 3648188 U JP3648188 U JP 3648188U JP H01140834 U JPH01140834 U JP H01140834U
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
protective film
insulating protective
polycrystalline silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988036481U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988036481U priority Critical patent/JPH01140834U/ja
Publication of JPH01140834U publication Critical patent/JPH01140834U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general

Landscapes

  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の半導体集積回路の
断面図、第２図は別の実施例の半導体集積回路の
断面図、第３図は従来の半導体集積回路の断面図
である。 １…シリコン基板、２，２′…内部配線、３…
電極パツド、４…保護絶縁膜、５ａ〜５ｄ…多結
晶シリコン配線。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁保護膜で表面の大部分をおおわれている半
    導体集積回路チツプにおいて、前記絶縁保護膜か
    ら露出している電極パツド等の金属部分または、
    およびチツプ周縁部と、集積回路の内部領域との
    間に多結晶シリコン配線をめぐらしていることを
    特徴とする半導体集積回路。
JP1988036481U 1988-03-18 1988-03-18 Pending JPH01140834U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988036481U JPH01140834U (ja) 1988-03-18 1988-03-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988036481U JPH01140834U (ja) 1988-03-18 1988-03-18

Publications (1)

Publication Number Publication Date
JPH01140834U true JPH01140834U (ja) 1989-09-27

Family

ID=31263083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988036481U Pending JPH01140834U (ja) 1988-03-18 1988-03-18

Country Status (1)

Country Link
JP (1) JPH01140834U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0289321A (ja) * 1988-09-27 1990-03-29 Sony Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0289321A (ja) * 1988-09-27 1990-03-29 Sony Corp 半導体装置

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