JPH0351847U - - Google Patents
Info
- Publication number
- JPH0351847U JPH0351847U JP1989113901U JP11390189U JPH0351847U JP H0351847 U JPH0351847 U JP H0351847U JP 1989113901 U JP1989113901 U JP 1989113901U JP 11390189 U JP11390189 U JP 11390189U JP H0351847 U JPH0351847 U JP H0351847U
- Authority
- JP
- Japan
- Prior art keywords
- package
- back surface
- lead
- protrusion
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案のＤＩＰパツケージの外形図、
第２図はＸ−Ｘ′線断面図、第３図は従来のＤＩ
Ｐパツケージの外形図、第４図はＹ−Ｙ′線の断
面図である。 １，３，７，９……パツケージ、２，５，８，
１１……リード、４，１０……半導体素子、６，
１２……プリント基板。
第２図はＸ−Ｘ′線断面図、第３図は従来のＤＩ
Ｐパツケージの外形図、第４図はＹ−Ｙ′線の断
面図である。 １，３，７，９……パツケージ、２，５，８，
１１……リード、４，１０……半導体素子、６，
１２……プリント基板。
Claims (1)
- 各リードをパツケージの裏面から突出させ、さ
らに、パツケージの裏面の各リード列の間に突起
を設けたことを特徴とするＩＣパツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989113901U JPH0351847U (ja) | 1989-09-27 | 1989-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989113901U JPH0351847U (ja) | 1989-09-27 | 1989-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0351847U true JPH0351847U (ja) | 1991-05-20 |
Family
ID=31662295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989113901U Pending JPH0351847U (ja) | 1989-09-27 | 1989-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351847U (ja) |
-
1989
- 1989-09-27 JP JP1989113901U patent/JPH0351847U/ja active Pending