JPH0345640U - - Google Patents
Info
- Publication number
- JPH0345640U JPH0345640U JP1989106806U JP10680689U JPH0345640U JP H0345640 U JPH0345640 U JP H0345640U JP 1989106806 U JP1989106806 U JP 1989106806U JP 10680689 U JP10680689 U JP 10680689U JP H0345640 U JPH0345640 U JP H0345640U
- Authority
- JP
- Japan
- Prior art keywords
- element mounting
- size
- mounting member
- mounting area
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/381—Auxiliary members
- H10W72/387—Flow barriers
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは、本考案の一実施例を示す上面
図と断面図、第２図ａ，ｂは、従来例を示す上面
図と断面図である。 １……素子載置部材、２……接合金属材、３…
…半導体素子、４……素子載置エリア、５……凹
部。
図と断面図、第２図ａ，ｂは、従来例を示す上面
図と断面図である。 １……素子載置部材、２……接合金属材、３…
…半導体素子、４……素子載置エリア、５……凹
部。
Claims (1)
- 半導体素子を接合金属材により接続するリード
フレーム及びステムの素子載置部材において、素
子載置エリアの形状が素子サイズと同サイズ又は
素子に適したサイズの凸状の形状を有することを
特徴とする素子載置部材。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989106806U JPH0345640U (ja) | 1989-09-11 | 1989-09-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989106806U JPH0345640U (ja) | 1989-09-11 | 1989-09-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0345640U true JPH0345640U (ja) | 1991-04-26 |
Family
ID=31655528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989106806U Pending JPH0345640U (ja) | 1989-09-11 | 1989-09-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0345640U (ja) |
-
1989
- 1989-09-11 JP JP1989106806U patent/JPH0345640U/ja active Pending