JPH0339843U - - Google Patents

Info

Publication number
JPH0339843U
JPH0339843U JP1990000237U JP23790U JPH0339843U JP H0339843 U JPH0339843 U JP H0339843U JP 1990000237 U JP1990000237 U JP 1990000237U JP 23790 U JP23790 U JP 23790U JP H0339843 U JPH0339843 U JP H0339843U
Authority
JP
Japan
Prior art keywords
periphery
plan
view
semiconductor
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990000237U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990000237U priority Critical patent/JPH0339843U/ja
Publication of JPH0339843U publication Critical patent/JPH0339843U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第１の実施例の平面図、第２
図は本考案の第２の実施例の平面図、第３図は本
考案の第３の実施例の平面図、第４図は本考案の
第４の実施例の平面図、第５図は本考案の第５の
実施例の平面図、第６図は本考案の第３の実施例
の実装例を示す平面図、第７図は従来の半導体チ
ツプの平面図、第８図は従来の半導体パツケージ
の平面図である。 １……半導体チツプ、２……周辺、３……ボン
デイングパツド、４……内部リード、５……ボン
デイングワイヤ、６ａ……開口部、６ｂ……切り
欠き部、１１……半導体パツケージ、１２……周
辺、１３……外部リード。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チツプまたは半導体パツケージの周辺に
    囲まれた内面に開口部を設けるか、または周辺の
    一部に凹状の切り欠き部を設けることを特徴とす
    る半導体装置。
JP1990000237U 1989-01-10 1990-01-06 Pending JPH0339843U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990000237U JPH0339843U (ja) 1989-01-10 1990-01-06

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP89589 1989-01-10
JP1990000237U JPH0339843U (ja) 1989-01-10 1990-01-06

Publications (1)

Publication Number Publication Date
JPH0339843U true JPH0339843U (ja) 1991-04-17

Family

ID=31716960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990000237U Pending JPH0339843U (ja) 1989-01-10 1990-01-06

Country Status (1)

Country Link
JP (1) JPH0339843U (ja)

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