JPH0345653U - - Google Patents

Info

Publication number
JPH0345653U
JPH0345653U JP1989107297U JP10729789U JPH0345653U JP H0345653 U JPH0345653 U JP H0345653U JP 1989107297 U JP1989107297 U JP 1989107297U JP 10729789 U JP10729789 U JP 10729789U JP H0345653 U JPH0345653 U JP H0345653U
Authority
JP
Japan
Prior art keywords
circuit board
outer frame
taking out
terminal
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989107297U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989107297U priority Critical patent/JPH0345653U/ja
Publication of JPH0345653U publication Critical patent/JPH0345653U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の半導体装置に利用
される電極取り出し用端子の平面図、第２図は同
じくその断面図、第３図は同じく半導体装置の断
面図、第４図ａ，ｂは電極取り出し用の端子の材
料である金属板を示す図、第５図ａ，ｂは第４図
ａ，ｂの金属板をプレスした状態を示す図、第６
図は他の実施例の電極取り出し用端子の断面図、
第７図ａは従来のＳ字形の電極取り出し用端子の
平面図、第７図ｂは同じくその断面図、第８図ａ
は従来のＵ字形の電極取り出し用端子の平面図、
第８図ｂは同じくその断面図である。 １０……半導体素子、１１……電極取り出し用
端子、１３……回路基板、１４……外枠、１５，
１６……樹脂、１１Ａ……リード部、Ｄ……厚み
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子および電極取り出し用の端子が搭載
    された回路基板と、該回路基板が装着される外枠
    とを備え、該外枠内に互いに熱膨張係数の異なる
    樹脂が上下二層に注入されて成る半導体装置にお
    いて、前記電極取り出し用の端子は、下層の樹脂
    で封止されるリード部が、他のリード部よりも薄
    く形成されたことを特徴とする半導体装置。
JP1989107297U 1989-09-12 1989-09-12 Pending JPH0345653U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989107297U JPH0345653U (ja) 1989-09-12 1989-09-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989107297U JPH0345653U (ja) 1989-09-12 1989-09-12

Publications (1)

Publication Number Publication Date
JPH0345653U true JPH0345653U (ja) 1991-04-26

Family

ID=31655990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989107297U Pending JPH0345653U (ja) 1989-09-12 1989-09-12

Country Status (1)

Country Link
JP (1) JPH0345653U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245362A (ja) * 2005-03-04 2006-09-14 Mitsubishi Electric Corp 半導体装置およびこれに用いられる電極端子
JP2015142018A (ja) * 2014-01-29 2015-08-03 三菱電機株式会社 電力用半導体装置
WO2018020729A1 (ja) * 2016-07-27 2018-02-01 株式会社日立製作所 半導体モジュールおよび半導体モジュールの製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245362A (ja) * 2005-03-04 2006-09-14 Mitsubishi Electric Corp 半導体装置およびこれに用いられる電極端子
JP2015142018A (ja) * 2014-01-29 2015-08-03 三菱電機株式会社 電力用半導体装置
WO2018020729A1 (ja) * 2016-07-27 2018-02-01 株式会社日立製作所 半導体モジュールおよび半導体モジュールの製造方法
JPWO2018020729A1 (ja) * 2016-07-27 2019-03-07 株式会社日立製作所 半導体モジュールおよび半導体モジュールの製造方法

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