JPH02129738U - - Google Patents

Info

Publication number
JPH02129738U
JPH02129738U JP1989037553U JP3755389U JPH02129738U JP H02129738 U JPH02129738 U JP H02129738U JP 1989037553 U JP1989037553 U JP 1989037553U JP 3755389 U JP3755389 U JP 3755389U JP H02129738 U JPH02129738 U JP H02129738U
Authority
JP
Japan
Prior art keywords
semiconductor pellet
conductive metal
integrated circuit
metal layer
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989037553U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989037553U priority Critical patent/JPH02129738U/ja
Publication of JPH02129738U publication Critical patent/JPH02129738U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は、本考案の実施例になる集積回路装置
の構造を示す斜視図、第２図ａ，ｂ及びｃは上記
の集積回路装置の製造過程を説明するための図、
第３図ａ，ｂ及びｃは、本考案の他の実施例につ
いて、その製造過程を説明するための図、第４図
は、上記集積回路装置の他の実施例を示す斜視図
、そして、第５図ａ，ｂ及びｃは本考案の実施例
になる集積回路装置に採用される種々のリード端
子構造を示す側面図、第６図は、上記集積回路装
置の従来例を示す斜視図、第７図ａ及びｂは、同
従来例について、その製造過程を説明するための
図である。 １０……集積回路装置、１１……パツケージ、
１２，１２……リード端子、１３……絶縁層、１
４，１５……金属層、１６……ダイランド、１７
……半導体ペレツト、１８……ボンデイングワイ
ヤ、１９……支持リード、２０……フレーム、２
１……フレーム枠、２３，２３……インナーリー
ド。

Claims (1)

    【実用新案登録請求の範囲】
  1. 表面に集積回路を形成した半導体ペレツトと、
    上記半導体ペレツトの周辺部に複数配置され、上
    記半導体ペレツトと電気的に接続されたリード端
    子と、上記半導体ペレツト及び上記リード端子を
    包設するパツケージとから成るパツケージ形集積
    回路装置において、リード端子は、それぞれが上
    記リード端子を形成する複数層の導電金属層を、
    その間に絶縁層を挾んで積層したインナーリード
    から形成され、かつ、上記インナーリードの導電
    金属層は、その端部において露出され、上記導電
    金属層の露出部を介して上記半導体ペレツトとの
    間が電気的接続されていることを特徴とする集積
    回路装置。
JP1989037553U 1989-03-31 1989-03-31 Pending JPH02129738U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989037553U JPH02129738U (ja) 1989-03-31 1989-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989037553U JPH02129738U (ja) 1989-03-31 1989-03-31

Publications (1)

Publication Number Publication Date
JPH02129738U true JPH02129738U (ja) 1990-10-25

Family

ID=31544772

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989037553U Pending JPH02129738U (ja) 1989-03-31 1989-03-31

Country Status (1)

Country Link
JP (1) JPH02129738U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017055031A (ja) * 2015-09-11 2017-03-16 トヨタ自動車株式会社 ワイヤ接続方法と端子

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017055031A (ja) * 2015-09-11 2017-03-16 トヨタ自動車株式会社 ワイヤ接続方法と端子
CN106971950A (zh) * 2015-09-11 2017-07-21 丰田自动车株式会社 电线连接方法与端子
CN106971950B (zh) * 2015-09-11 2019-11-26 丰田自动车株式会社 电线连接方法与端子

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