JPH0362671B2 - - Google Patents

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Publication number
JPH0362671B2
JPH0362671B2 JP59027282A JP2728284A JPH0362671B2 JP H0362671 B2 JPH0362671 B2 JP H0362671B2 JP 59027282 A JP59027282 A JP 59027282A JP 2728284 A JP2728284 A JP 2728284A JP H0362671 B2 JPH0362671 B2 JP H0362671B2
Authority
JP
Japan
Prior art keywords
copper
silicon
bonding
silicate glass
ceramics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59027282A
Other languages
English (en)
Other versions
JPS60171277A (ja
Inventor
Shunichiro Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59027282A priority Critical patent/JPS60171277A/ja
Priority to KR1019850000734A priority patent/KR880000654B1/ko
Priority to DE8585300971T priority patent/DE3572647D1/de
Priority to EP85300971A priority patent/EP0153150B1/en
Priority to US06/702,311 priority patent/US4613549A/en
Publication of JPS60171277A publication Critical patent/JPS60171277A/ja
Publication of JPH0362671B2 publication Critical patent/JPH0362671B2/ja
Granted legal-status Critical Current

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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
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    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/025—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of glass or ceramic material
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    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
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    • C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
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  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
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  • Manufacturing & Machinery (AREA)
  • Ceramic Products (AREA)
  • Laminated Bodies (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Joining Of Glass To Other Materials (AREA)

Description

【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明、銅−シリコンセラミツクス接合体に関
する。
（従来の技術） セラミツクスを構造材料として用いる試みが近
年行われている。このような場合、セラミツクス
を他の部材と接合して用いなければならないこと
が多い。このようなセラミツクスと他の部材との
接合手段としては、接着剤による接合、あるいは
セラミツクスをMo−Mn等によりメタライズし
たのちろう付けする接合等が行われていた。
しかしながら、接着剤による接合では、構造体
として使用可能な温度範囲が低く、また、メタラ
イズによる接合は、メタライズできるセラミツク
スがアルミナ等に限られ窒化けい素等の構造材に
適するシリコンセラミツクスにそのまま適用でき
ないという難点があつた。
（発明の目的） 本発明は、前記事情に基づきなされたもので、
接合強度の大なるシリコンセラミツクスと銅との
接合体を提供するものである。
［発明の構成］ （課題を解決するための手段と作用） 本発明の銅−シリコンセラミツクス接合体は、
表面に主としてαクリストバライトおよびY2
O3・2SiO2からなる結晶質相と、主としてシリケ
ートガラスからなる非結晶質相とを有するシリコ
ンセラミツクスと銅とを接合してなる銅−シリコ
ンセラミツクス接合体であつて、主として前記シ
リコンセラミツクス表面の非結晶質相と銅とが接
合してなることを特徴とする。
シリコンセラミツクスは、焼結助剤を含有する
がY2O3等の希土類酸化物を含むものが好ましく
更にAl2O3、遷移金属系酸化物の焼結助剤及びア
ルカリ金属、アルカリ土類金属、遷移金属系の元
素を含んでよい。これらは組合せによつては銅と
の接合状態を改善する効果を奏すると考えられ
る。
このシリコンセラミツクスの表面はαクリスト
バライトおよびY2O3・2SiO2からなる結晶質相
と、主としてシリケートガラスからなる非結晶質
相とを有している。この非結晶質相であるシリケ
ートガラスは、結晶質相であるαクリストバラス
トおよびY2O3・2SiO2と準平衡状態にある。また
この場合、銅は主として非結晶質相と接合してお
り、さらに接合状態は帯状または／および点状の
局部的接合である状態のものが、銅とシリコンセ
ラミツクスの熱膨脹差に基づく応力を緩和するう
えで好ましい。またこの非結晶質相中および結晶
質相中にCa、Mg等の不可避酸化物を含んでいて
もよい。
銅と非結晶質相との接合は、銅および銅酸化物
と非結晶質相間の固溶、化合物生成および拡散に
よると考えられる。この場合銅および銅酸化物は
共晶物であることが望ましい。このような接合状
態を得るには銅としてはカフピツチ電解銅など酸
素を含有するものが好ましい。
次に本発明の銅−シリコンセラミツクス接合体
を得るための方法について説明する。
まずシリコンセラミツクスを大気中で1200〜
1400℃で20分〜20時間加熱して、シリコンセラミ
ツクスの表面に主としてαクリストバライトおよ
びY2O3・2SiO2からなる結晶質相と、主としてシ
リケートガラスからなる非結晶質相とを形成す
る。
このようにして得られたシリコンセラミツクス
の表面に銅を当接して加熱処理する。例えばタフ
ピツチ電解銅であれば、不活性雰囲気中で1065〜
1083℃の範囲で１分〜２時間加熱処理する。この
場合銅としては微量の酸素を含むものがよいが、
そうであい場合は加熱雰囲気に微量の酸素（数
1000ppm）含有させることが有効である。
（実施例） Y2O3 ５％（重量％、以下同様）、Al2O3 ４
％、AlN ３％、TiO2 1.5％を含むSi3N4の常圧
焼結体を大気中で1200〜1400℃で約10時間加熱し
た。得られたSi3N4表面をＸ線回析により分析し
たところ、Si3N4の他に結晶質相としてαクリス
トバライトおよびY2O3・2SiO2、非結晶質相とし
てシリケートガラスが見出された。
第１図に加熱温度によるシリケートガラス相量
の変化を示す（曲線Ａ）。なお、グラス中シリケ
ートガラス相量の任意単位で示すが、この量はシ
リコンセラミツクス表面の接合部の体積に占める
シリケートガラス相量に比例した量である。
こうして得られたSi3N4にタフピツチ電解銅板
体を当接して不活性雰囲気中、1075℃で加熱する
直接接合法で銅板体を接合した。
得られた接合体の接合強度を調べた。この結果
を第１図にあわせて示す（曲線Ｂ）。
以上により明らかなように、接合部にシリケー
トガラス相が存在することにより接合強度は向上
する。なお、加熱温度があまり高くなると、結晶
が粗大化し銅とシリケートガラスとの接合を阻害
するため、強度的には好ましくない。シリコンセ
ラミツクスの加熱処理温度は1250〜1350℃の範囲
でより好ましい接合強度を得ることができる。
第１図は基づきシリケートガラス相量と接合強
度との関係をプロツトしたものを第２図に示す。
第２図からシリケートガラス相量が接合強度に寄
与していることがうかがわれる。
接合強度の高いものについて接合面の観察を行
つた。接合面において、銅は主としてシリケート
ガラス相と接合しており、かつ帯状または点状の
局部的接合を示している。
なお、接合部において、銅側は、銅酸化物と銅
との共晶物で構成されており、これらとシリコン
セラミツクス側のシリケートガラス相との間で固
溶したり化合物を生成したりあるいは拡散するこ
とにより強固な接合がなされていることが確認さ
れた。
［発明の効果］ 以上のように本願発明の銅−シリコンセラミツ
クス接合体は、信頼できる接合状態を有するもの
である。
なお、シリコンセラミツクスとしては、Si3
N4、SiC、サイアロン等が適用できる。
【図面の簡単な説明】
第１図は、加熱温度によるシリケートガラス相
量の変化および銅とシリコンセラミツクスとの接
合強度の変化を示すグラフ、第２図はシリケート
ガラス相量と接合強度との関係を示すグラフであ
る。

Claims (1)

  1. 【特許請求の範囲】 １ 表面に主としてαクリストバライトおよび
    Y2O3・2SiO2からなる結晶質相と、主としてシリ
    ケートガラスからなる非結晶質相とを有するシリ
    コンセラミツクスと銅とを接合してなる銅−シリ
    コンセラミツクス接合体であつて、主として前記
    シリコンセラミツクス表面の非結晶質相と銅とが
    接合してなることを特徴とする銅−シリコンセラ
    ミツクス接合体。 ２ 銅とシリコンセラミツクス表面との接合は帯
    状または／および点状の局部的接合である特許請
    求の範囲第１項に記載の銅−シリコンセラミツク
    ス接合体。
JP59027282A 1984-02-17 1984-02-17 金属−セラミツクス接合体 Granted JPS60171277A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP59027282A JPS60171277A (ja) 1984-02-17 1984-02-17 金属−セラミツクス接合体
KR1019850000734A KR880000654B1 (ko) 1984-02-17 1985-02-04 금속-세라믹접합체
DE8585300971T DE3572647D1 (en) 1984-02-17 1985-02-14 Bonded metal-ceramics composite
EP85300971A EP0153150B1 (en) 1984-02-17 1985-02-14 Bonded metal-ceramics composite
US06/702,311 US4613549A (en) 1984-02-17 1985-02-15 Bonded metal-ceramics composite

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59027282A JPS60171277A (ja) 1984-02-17 1984-02-17 金属−セラミツクス接合体

Publications (2)

Publication Number Publication Date
JPS60171277A JPS60171277A (ja) 1985-09-04
JPH0362671B2 true JPH0362671B2 (ja) 1991-09-26

Family

ID=12216711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59027282A Granted JPS60171277A (ja) 1984-02-17 1984-02-17 金属−セラミツクス接合体

Country Status (5)

Country Link
US (1) US4613549A (ja)
EP (1) EP0153150B1 (ja)
JP (1) JPS60171277A (ja)
KR (1) KR880000654B1 (ja)
DE (1) DE3572647D1 (ja)

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US5098494A (en) * 1989-05-23 1992-03-24 Mcnc Bonding of ceramic parts
US5096769A (en) * 1989-07-07 1992-03-17 Alsimag Technical Ceramics, Inc. Strengthened ceramic
US5500279A (en) * 1994-08-26 1996-03-19 Eastman Kodak Company Laminated metal structure and metod of making same
JPH0891951A (ja) * 1994-09-22 1996-04-09 Sumitomo Electric Ind Ltd アルミニウムと窒化ケイ素の接合体およびその製造方法
US5912066A (en) * 1996-03-27 1999-06-15 Kabushiki Kaisha Toshiba Silicon nitride circuit board and producing method therefor
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Also Published As

Publication number Publication date
JPS60171277A (ja) 1985-09-04
EP0153150B1 (en) 1989-08-30
KR880000654B1 (ko) 1988-04-20
KR850005994A (ko) 1985-09-28
DE3572647D1 (en) 1989-10-05
EP0153150A2 (en) 1985-08-28
US4613549A (en) 1986-09-23
EP0153150A3 (en) 1986-10-29

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