JPH04214643A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPH04214643A
JPH04214643A JP2401476A JP40147690A JPH04214643A JP H04214643 A JPH04214643 A JP H04214643A JP 2401476 A JP2401476 A JP 2401476A JP 40147690 A JP40147690 A JP 40147690A JP H04214643 A JPH04214643 A JP H04214643A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
lead
pellet
sealed semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2401476A
Other languages
English (en)
Inventor
Tetsuo Okamura
岡村　哲生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP2401476A priority Critical patent/JPH04214643A/ja
Priority to US07/796,647 priority patent/US5169340A/en
Publication of JPH04214643A publication Critical patent/JPH04214643A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/627—Snap or like fastening
    • H01R13/6271—Latching means integral with the housing
    • H01R13/6272—Latching means integral with the housing comprising a single latching arm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6592—Specific features or arrangements of connection of shield to conductive members the conductive member being a shielded cable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6596—Specific features or arrangements of connection of shield to conductive members the conductive member being a metal grounding panel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/581—Auxiliary members, e.g. flow barriers
    • H10W72/583—Reinforcing structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明は樹脂封止型半導体装置に
関する。
【０００２】
【従来の技術】従来の樹脂封止タイプ半導体装置は、図
２に示すようにペレット１をリードフレームのアイラン
ド２に載置・接着し、リード３とペレット１とを導電線
材４で接続するボンディングが行なわれた上で、全体を
樹脂部６により封止されるという構造になっている。
【０００３】
【発明が解決しようとする課題】従来の樹脂封止型半導
体装置の構造では、樹脂封止後に半導体装置に対し加熱
・冷却が繰り返されるとリード側導電線材部に破断を生
じ接続性能を失うとの問題点があった。
【０００４】
【課題を解決するための手段】本発明の半導体装置は、
アイランドに載置された半導体ペレットとリード内部の
ボンディング部とを接続する導電線を有する樹脂封止型
半導体装置において、前記ボンディング部を覆う導電性
樹脂を設けて構成されている。
【０００５】
【実施例】次に本発明について図面を参照して説明する
。図１は本発明の一実施例の半導体装置の断面図である
。
【０００６】ペレット１をリードフレームのアイランド
２に接着し、ペレット１とリード３の間を導電線４でボ
ンディングして接続する。次に内部リード側のボンディ
ング部を導電性樹脂５で固定し、さらに全体を樹脂部６
で封止する。
【０００７】
【発明の効果】以上説明したように本発明は、リード側
ポンディング部を導電性の樹脂で固定したので、封入後
の温度サイクルが加わった際にも破断が生じにくい又、
破断が生じた場合にも電気的特性を保持できるとの効果
を有する。
【図面の簡単な説明】
【図１】本発明の半導体装置の断面図である。
【図２】従来の半導体装置の一例の断面図である。
【符号の説明】
１　　　　ペレット ２　　　　アイランド ３　　　　リード ４　　　　導電線 ５　　　　導電性樹脂 ６　　　　樹脂部

Claims (1)

    【特許請求の範囲】
  1. 【請求項１】　　アイランドに載置された半導体ペレッ
    トとリード内部のボンディング部とを接続する導電線を
    有する樹脂封止型半導体装置において、前記ボンディン
    グ部を覆う導電性樹脂を設けたことを特徴とする樹脂封
    止型半導体装置。
JP2401476A 1990-12-06 1990-12-12 樹脂封止型半導体装置 Pending JPH04214643A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2401476A JPH04214643A (ja) 1990-12-12 1990-12-12 樹脂封止型半導体装置
US07/796,647 US5169340A (en) 1990-12-06 1991-11-22 Electrical connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2401476A JPH04214643A (ja) 1990-12-12 1990-12-12 樹脂封止型半導体装置

Publications (1)

Publication Number Publication Date
JPH04214643A true JPH04214643A (ja) 1992-08-05

Family

ID=18511301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2401476A Pending JPH04214643A (ja) 1990-12-06 1990-12-12 樹脂封止型半導体装置

Country Status (2)

Country Link
US (1) US5169340A (ja)
JP (1) JPH04214643A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037652A (en) * 1997-05-29 2000-03-14 Nec Corporation Lead frame with each lead having a peel generation preventing means and a semiconductor device using same

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD415106S (en) * 1997-08-08 1999-10-12 Hon Hai Precision Ind. Co., Ltd. Electrical connector
JP3355567B2 (ja) * 1998-02-04 2002-12-09 住友電装株式会社 基板用コネクタ
JP3311997B2 (ja) 1998-07-06 2002-08-05 住友電装株式会社 コネクタ
US6210223B1 (en) 1998-11-19 2001-04-03 Sumitomo Wiring Systems, Ltd. Shielded connector, a set of shielded connectors and method for connecting a shielded connector with a shielded cable
JP3532428B2 (ja) 1998-11-27 2004-05-31 住友電装株式会社 端 子
JP3365549B2 (ja) 1998-11-19 2003-01-14 住友電装株式会社 シールド端子
JP3365550B2 (ja) 1999-05-07 2003-01-14 住友電装株式会社 シールド端子
JP3419709B2 (ja) * 1999-05-10 2003-06-23 住友電装株式会社 同軸ケーブル用端子
JP2001035601A (ja) * 1999-07-21 2001-02-09 Yazaki Corp コネクタ
USD454335S1 (en) 2000-11-24 2002-03-12 Hirose Electric Co., Ltd. Electrical connector
USD454333S1 (en) 2000-11-28 2002-03-12 Hirose Electric Co., Ltd. Electrical connector housing
FR2851084A1 (fr) * 2003-02-06 2004-08-13 Radiall Sa Connecteur comportant un boitier blinde
JP4973907B2 (ja) * 2005-11-15 2012-07-11 日本圧着端子製造株式会社 ディップコネクタ
CN102176559B (zh) * 2010-12-22 2013-07-31 番禺得意精密电子工业有限公司 屏蔽式连接器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4833387A (ja) * 1971-08-30 1973-05-09
JPS5229984U (ja) * 1975-08-11 1977-03-02
JPH0262679U (ja) * 1988-10-31 1990-05-10

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244271U (ja) * 1988-09-21 1990-03-27
JPH02150682U (ja) * 1989-05-22 1990-12-27

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4833387A (ja) * 1971-08-30 1973-05-09
JPS5229984U (ja) * 1975-08-11 1977-03-02
JPH0262679U (ja) * 1988-10-31 1990-05-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037652A (en) * 1997-05-29 2000-03-14 Nec Corporation Lead frame with each lead having a peel generation preventing means and a semiconductor device using same

Also Published As

Publication number Publication date
US5169340A (en) 1992-12-08

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