JPH0434741U - - Google Patents

Info

Publication number
JPH0434741U
JPH0434741U JP1990076378U JP7637890U JPH0434741U JP H0434741 U JPH0434741 U JP H0434741U JP 1990076378 U JP1990076378 U JP 1990076378U JP 7637890 U JP7637890 U JP 7637890U JP H0434741 U JPH0434741 U JP H0434741U
Authority
JP
Japan
Prior art keywords
semiconductor device
mounting board
mounting
metallized part
pattern portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990076378U
Other languages
English (en)
Other versions
JP2526566Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990076378U priority Critical patent/JP2526566Y2/ja
Publication of JPH0434741U publication Critical patent/JPH0434741U/ja
Application granted granted Critical
Publication of JP2526566Y2 publication Critical patent/JP2526566Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実装基板を用いて構成した半
導体装置の一実施例の平面図、第２図は従来の実
装基板を用いて構成した半導体装置の平面図であ
る。 １，１１……セラミツク基板、２，１２……搭
載用メタライズ部、３，１３……端子用メタライ
ズ部、４，１４……中継用メタライズ部、５……
抜きパターン部、６，１６……半導体素子、７，
１７……ボンデイングワイヤ、８，１８……ろー
材、１５……アルミナコート部。

Claims (1)

  1. 【実用新案登録請求の範囲】 １ 絶縁基板の表面に半導体素子を搭載するため
    のメタライズ部を有する実装基板において、この
    メタライズ部には、半導体素子搭載領域とボンデ
    イングワイヤ接続領域との間に、メタライズを一
    部除去した抜きパターン部を形成したことを特徴
    とする半導体装置の実装基板。 ２ 抜きパターン部は、長円形状または長方形状
    をした複数個の抜きパターンを、その長さ方向に
    配列してなる実用新案登録請求の範囲第１項記載
    の半導体装置の実装基板。
JP1990076378U 1990-07-18 1990-07-18 半導体装置の実装基板 Expired - Lifetime JP2526566Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990076378U JP2526566Y2 (ja) 1990-07-18 1990-07-18 半導体装置の実装基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990076378U JP2526566Y2 (ja) 1990-07-18 1990-07-18 半導体装置の実装基板

Publications (2)

Publication Number Publication Date
JPH0434741U true JPH0434741U (ja) 1992-03-23
JP2526566Y2 JP2526566Y2 (ja) 1997-02-19

Family

ID=31617794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990076378U Expired - Lifetime JP2526566Y2 (ja) 1990-07-18 1990-07-18 半導体装置の実装基板

Country Status (1)

Country Link
JP (1) JP2526566Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007329502A (ja) * 2007-08-16 2007-12-20 Toshiba Corp 発光装置
JP2009065199A (ja) * 2008-11-17 2009-03-26 Toshiba Corp 発光装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63198341A (ja) * 1987-02-13 1988-08-17 Nec Corp 半導体装置
JPH0260237U (ja) * 1988-10-26 1990-05-02

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63198341A (ja) * 1987-02-13 1988-08-17 Nec Corp 半導体装置
JPH0260237U (ja) * 1988-10-26 1990-05-02

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007329502A (ja) * 2007-08-16 2007-12-20 Toshiba Corp 発光装置
JP2009065199A (ja) * 2008-11-17 2009-03-26 Toshiba Corp 発光装置

Also Published As

Publication number Publication date
JP2526566Y2 (ja) 1997-02-19

Similar Documents

Publication Publication Date Title
JPS6389251U (ja)
JPH0448624U (ja)
JPS633153U (ja)
JPS6384959U (ja)
JPH0356146U (ja)
JPS63201330U (ja)
JPH0440562U (ja)
JPS64332U (ja)
JPS62201972U (ja)
JPS5989576U (ja) 配線用チツプ
JPS6355576U (ja)
JPH03122536U (ja)
JPH0241474U (ja)
JPH0351861U (ja)
JPH01125577U (ja)
JPS61171275U (ja)
JPH0362U (ja)
JPH0213731U (ja)
JPH02106808U (ja)
JPS62140775U (ja)
JPH02127041U (ja)
JPS6338367U (ja)
JPS63100801U (ja)
JPH0351868U (ja)
JPH02114942U (ja)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term