JPH0438063U - - Google Patents

Info

Publication number
JPH0438063U
JPH0438063U JP8032090U JP8032090U JPH0438063U JP H0438063 U JPH0438063 U JP H0438063U JP 8032090 U JP8032090 U JP 8032090U JP 8032090 U JP8032090 U JP 8032090U JP H0438063 U JPH0438063 U JP H0438063U
Authority
JP
Japan
Prior art keywords
semiconductor element
lead frame
conductive material
view
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8032090U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8032090U priority Critical patent/JPH0438063U/ja
Publication of JPH0438063U publication Critical patent/JPH0438063U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図ａは本考案の一実施例による電力半導体
装置の横平面図、第１図ｂは第１図ａのＢ−Ｂ′
線断面図、第２図ａは本考案の他の実施例による
電力半導体装置の横平面図、第２図ｂは第２図ａ
のＣ−Ｃ′線断面図、第３図ａは従来例による電
力半導体装置の樹脂封止前の横平面図、第３図ｂ
は第３図ａのＡ−Ａ′線断面図、第４図ａ及びｂ
は、それぞれ従来例による電力半導体装置の樹脂
封止後の横平面図及び縦断面図である。 １……リードフレーム、２……導電体（ハンダ
）、３……第１の半導体素子、４……絶縁体（絶
縁ペースト）、５……第２の半導体素子、８……
防壁。

Claims (1)

  1. 【実用新案登録請求の範囲】 リードフレーム上に、該リードフレームに導電
    材料を介してボンデイングされる第１の半導体素
    子と、前記リードフレームに絶縁材料を介してボ
    ンデイングされる第２の半導体素子とを備えてな
    る半導体装置において、 前記リードフレームの前記第１の半導体素子と
    前記第２の半導体素子との間に、前記導電材料の
    流れ止めをする防壁を設けてなることを特徴とす
    る半導体装置。
JP8032090U 1990-07-27 1990-07-27 Pending JPH0438063U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8032090U JPH0438063U (ja) 1990-07-27 1990-07-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8032090U JPH0438063U (ja) 1990-07-27 1990-07-27

Publications (1)

Publication Number Publication Date
JPH0438063U true JPH0438063U (ja) 1992-03-31

Family

ID=31625273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8032090U Pending JPH0438063U (ja) 1990-07-27 1990-07-27

Country Status (1)

Country Link
JP (1) JPH0438063U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009267071A (ja) * 2008-04-25 2009-11-12 Sanyo Electric Co Ltd 半導体装置
JP2013150011A (ja) * 2013-04-23 2013-08-01 Toyota Motor Corp 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009267071A (ja) * 2008-04-25 2009-11-12 Sanyo Electric Co Ltd 半導体装置
JP2013150011A (ja) * 2013-04-23 2013-08-01 Toyota Motor Corp 半導体装置

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