JPH0442739U - - Google Patents
Info
- Publication number
- JPH0442739U JPH0442739U JP8367890U JP8367890U JPH0442739U JP H0442739 U JPH0442739 U JP H0442739U JP 8367890 U JP8367890 U JP 8367890U JP 8367890 U JP8367890 U JP 8367890U JP H0442739 U JPH0442739 U JP H0442739U
- Authority
- JP
- Japan
- Prior art keywords
- package
- metal layer
- brazing material
- metallized metal
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005219 brazing Methods 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Ceramic Products (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図である。
１……絶縁基体、２……金属製蓋体、５……メ
タライズ金属層、７……外部リード端子、８……
ロウ材。
FIG. 1 is a sectional view showing an embodiment of a package for housing semiconductor elements of the present invention. DESCRIPTION OF SYMBOLS 1...Insulating base, 2...Metal lid, 5...Metallized metal layer, 7...External lead terminal, 8...
wax wood.
Claims (1)
体素子を載置収容するための載置を有する絶縁基
体にメタライズ金属層を被着形成するとともに該
メタライズ金属層に金属部材をロウ材を介し取着
して成る半導体素子収納用パツケージにおいて、
前記ロウ材のビツカース硬度（Ｈｖ）がＨｖ≦７
０であることを特徴とする半導体素子収納用パツ
ケージ。 (2) 前記ロウ材が主成分としての銀に少なくと
もインジウムを１．０乃至１５．０重量％含有さ
せたものから成ることを特徴とする実用新案登録
請求の範囲第１項記載の半導体素子収納用パツケ
ージ。[Claims for Utility Model Registration] (1) Forming a metallized metal layer on an insulating substrate made of an aluminum nitride sintered body and having a mounting for mounting and accommodating a semiconductor element, and forming the metallized metal layer on the metallized metal layer. In a package for storing semiconductor elements, which is made by attaching metal members through brazing material,
The Vickers hardness (Hv) of the brazing material is Hv≦7.
1. A package for storing semiconductor elements, characterized in that: 0. (2) The semiconductor device storage according to claim 1, wherein the brazing material is made of silver containing at least 1.0 to 15.0% by weight of indium. Package cage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8367890U JP2515051Y2 (en) | 1990-08-07 | 1990-08-07 | Package for storing semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8367890U JP2515051Y2 (en) | 1990-08-07 | 1990-08-07 | Package for storing semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0442739U true JPH0442739U (en) | 1992-04-10 |
| JP2515051Y2 JP2515051Y2 (en) | 1996-10-23 |
Family
ID=31631542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8367890U Expired - Lifetime JP2515051Y2 (en) | 1990-08-07 | 1990-08-07 | Package for storing semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2515051Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06120363A (en) * | 1992-10-07 | 1994-04-28 | Kyocera Corp | Package for storing semiconductor devices |
-
1990
- 1990-08-07 JP JP8367890U patent/JP2515051Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06120363A (en) * | 1992-10-07 | 1994-04-28 | Kyocera Corp | Package for storing semiconductor devices |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2515051Y2 (en) | 1996-10-23 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |