JPH0442739U - - Google Patents

Info

Publication number
JPH0442739U
JPH0442739U JP8367890U JP8367890U JPH0442739U JP H0442739 U JPH0442739 U JP H0442739U JP 8367890 U JP8367890 U JP 8367890U JP 8367890 U JP8367890 U JP 8367890U JP H0442739 U JPH0442739 U JP H0442739U
Authority
JP
Japan
Prior art keywords
package
metal layer
brazing material
metallized metal
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8367890U
Other languages
English (en)
Other versions
JP2515051Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8367890U priority Critical patent/JP2515051Y2/ja
Publication of JPH0442739U publication Critical patent/JPH0442739U/ja
Application granted granted Critical
Publication of JP2515051Y2 publication Critical patent/JP2515051Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Ceramic Products (AREA)

Description

【図面の簡単な説明】
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図である。 １……絶縁基体、２……金属製蓋体、５……メ
タライズ金属層、７……外部リード端子、８……
ロウ材。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 窒化アルミニウム質焼結体から成り、半導
    体素子を載置収容するための載置を有する絶縁基
    体にメタライズ金属層を被着形成するとともに該
    メタライズ金属層に金属部材をロウ材を介し取着
    して成る半導体素子収納用パツケージにおいて、
    前記ロウ材のビツカース硬度（Ｈｖ）がＨｖ≦７
    ０であることを特徴とする半導体素子収納用パツ
    ケージ。 (2) 前記ロウ材が主成分としての銀に少なくと
    もインジウムを１．０乃至１５．０重量％含有さ
    せたものから成ることを特徴とする実用新案登録
    請求の範囲第１項記載の半導体素子収納用パツケ
    ージ。
JP8367890U 1990-08-07 1990-08-07 半導体素子収納用パッケージ Expired - Lifetime JP2515051Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8367890U JP2515051Y2 (ja) 1990-08-07 1990-08-07 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8367890U JP2515051Y2 (ja) 1990-08-07 1990-08-07 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0442739U true JPH0442739U (ja) 1992-04-10
JP2515051Y2 JP2515051Y2 (ja) 1996-10-23

Family

ID=31631542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8367890U Expired - Lifetime JP2515051Y2 (ja) 1990-08-07 1990-08-07 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JP2515051Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120363A (ja) * 1992-10-07 1994-04-28 Kyocera Corp 半導体素子収納用パッケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120363A (ja) * 1992-10-07 1994-04-28 Kyocera Corp 半導体素子収納用パッケージ

Also Published As

Publication number Publication date
JP2515051Y2 (ja) 1996-10-23

Similar Documents

Publication Publication Date Title
JPH0442739U (ja)
JPH0485733U (ja)
JPH0442731U (ja)
JPH0363943U (ja)
JPS6331394Y2 (ja)
JPH0412656U (ja)
JPH03120039U (ja)
JPH045648U (ja)
JPH0211344U (ja)
JPH0451141U (ja)
JPH0412637U (ja)
JPH033747U (ja)
JPS58433U (ja) 半導体装置
JPH0363944U (ja)
JPH0412655U (ja)
JPS6450438U (ja)
JPS63127127U (ja)
JPS5822749U (ja) 半導体素子用パツケ−ジ
JPH045651U (ja)
JPH0472639U (ja)
JPH0436250U (ja)
JPH0442740U (ja)
JPH0363942U (ja)
JPH0363945U (ja)
JPH0247049U (ja)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term