JPH0442946Y2 - - Google Patents

Info

Publication number
JPH0442946Y2
JPH0442946Y2 JP1983064655U JP6465583U JPH0442946Y2 JP H0442946 Y2 JPH0442946 Y2 JP H0442946Y2 JP 1983064655 U JP1983064655 U JP 1983064655U JP 6465583 U JP6465583 U JP 6465583U JP H0442946 Y2 JPH0442946 Y2 JP H0442946Y2
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
lead
lead wire
lead wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983064655U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59171360U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983064655U priority Critical patent/JPS59171360U/ja
Publication of JPS59171360U publication Critical patent/JPS59171360U/ja
Application granted granted Critical
Publication of JPH0442946Y2 publication Critical patent/JPH0442946Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1983064655U 1983-04-28 1983-04-28 自動插入用発光ダイオ−ドランプ Granted JPS59171360U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983064655U JPS59171360U (ja) 1983-04-28 1983-04-28 自動插入用発光ダイオ−ドランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983064655U JPS59171360U (ja) 1983-04-28 1983-04-28 自動插入用発光ダイオ−ドランプ

Publications (2)

Publication Number Publication Date
JPS59171360U JPS59171360U (ja) 1984-11-16
JPH0442946Y2 true JPH0442946Y2 (fr) 1992-10-12

Family

ID=30194840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983064655U Granted JPS59171360U (ja) 1983-04-28 1983-04-28 自動插入用発光ダイオ−ドランプ

Country Status (1)

Country Link
JP (1) JPS59171360U (fr)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5163952U (fr) * 1974-11-14 1976-05-20
JPS56137466U (fr) * 1980-03-18 1981-10-17

Also Published As

Publication number Publication date
JPS59171360U (ja) 1984-11-16

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