JPH0446549U - - Google Patents
Info
- Publication number
- JPH0446549U JPH0446549U JP8822990U JP8822990U JPH0446549U JP H0446549 U JPH0446549 U JP H0446549U JP 8822990 U JP8822990 U JP 8822990U JP 8822990 U JP8822990 U JP 8822990U JP H0446549 U JPH0446549 U JP H0446549U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- resin
- heat radiator
- resin coating
- fixing portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１、第２、第３図は従来装置の説明図、第４
、第５図、第６図及び第７図は本考案装置である
。１は樹脂被覆体、２は樹脂注入部、３はリード
、４は板上放熱体、５はチツプ、６はワイヤー線
、７はエアベント、８は表側樹脂流れ、９は裏側
樹脂流れ、１０は最終充填部、１１は板上放熱体
変形部。
Figures 1, 2, and 3 are explanatory diagrams of the conventional device;
, FIG. 5, FIG. 6, and FIG. 7 show the device of the present invention. 1 is a resin coating, 2 is a resin injection part, 3 is a lead, 4 is a heat sink on a plate, 5 is a chip, 6 is a wire line, 7 is an air vent, 8 is a front side resin flow, 9 is a back side resin flow, 10 is a The final filling part, 11, is a deformed part of the heat sink on the plate.
Claims (1)
た半導体チツプと前記チツプに接続されたリード
と、前記放熱体、前記チツプ、前記リードの一部
を、被覆する樹脂被覆体とからなり、且つ前記放
熱体のチツプ固着部の反対側の樹脂被覆部がチツ
プ固着部側の樹脂被覆部よりも薄く形成された半
導体装置において前記板上放熱体の一部を変形さ
せる事により、樹脂流れを調整し樹脂封止時の成
形性を向上させたことを特徴とする樹脂封止型半
導体装置。 It consists of a plate-shaped heat radiator, a semiconductor chip fixed on the surface of the heat radiator, a lead connected to the chip, and a resin coating covering a part of the heat radiator, the chip, and the leads. In a semiconductor device in which the resin coating on the side opposite to the chip fixing portion of the heat sink is formed thinner than the resin coating on the chip fixing portion side, by deforming a part of the plate heat sink, the resin flow is reduced. A resin-sealed semiconductor device characterized by improved moldability during resin-sealing by adjusting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8822990U JPH0446549U (en) | 1990-08-23 | 1990-08-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8822990U JPH0446549U (en) | 1990-08-23 | 1990-08-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0446549U true JPH0446549U (en) | 1992-04-21 |
Family
ID=31821286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8822990U Pending JPH0446549U (en) | 1990-08-23 | 1990-08-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446549U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63300545A (en) * | 1987-05-29 | 1988-12-07 | Fujitsu Ltd | Manufacture of semiconductor device |
| JPH01268159A (en) * | 1988-04-20 | 1989-10-25 | Nec Corp | Resin-sealed semiconductor device and injection metal mold |
-
1990
- 1990-08-23 JP JP8822990U patent/JPH0446549U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63300545A (en) * | 1987-05-29 | 1988-12-07 | Fujitsu Ltd | Manufacture of semiconductor device |
| JPH01268159A (en) * | 1988-04-20 | 1989-10-25 | Nec Corp | Resin-sealed semiconductor device and injection metal mold |
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