JPH0451153U - - Google Patents

Info

Publication number
JPH0451153U
JPH0451153U JP1990092849U JP9284990U JPH0451153U JP H0451153 U JPH0451153 U JP H0451153U JP 1990092849 U JP1990092849 U JP 1990092849U JP 9284990 U JP9284990 U JP 9284990U JP H0451153 U JPH0451153 U JP H0451153U
Authority
JP
Japan
Prior art keywords
chips
chip
semiconductor device
same
packaged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990092849U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990092849U priority Critical patent/JPH0451153U/ja
Publication of JPH0451153U publication Critical patent/JPH0451153U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例による半導体装置
の断面図、第２図は第１図の上面図、第３図は従
来の半導体装置の断面図である。 図において、１，２は第１、第２のＩＣチツプ
、３は金属ワイヤ、４は内部リード、５は外部リ
ード、６はモールドパツケージ、７は接続部分、
７ａ，７ｂは接続部、８はパツド、１０はダイパ
ツドである。なお図中同一符号は同一又は相当部
分を示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 所定の機能を有する第１のＩＣチツプをフレー
    ム上にアセンブリし、 該第１のＩＣチツプ上に、これと同一あるいは
    異なる機能を有する第２のＩＣチツプを両チツプ
    間で相互に信号の入出力可能に搭載し、 上記両ＩＣチツプ全体をパツケージングしてな
    ることを特徴とする半導体装置。
JP1990092849U 1990-09-03 1990-09-03 Pending JPH0451153U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990092849U JPH0451153U (ja) 1990-09-03 1990-09-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990092849U JPH0451153U (ja) 1990-09-03 1990-09-03

Publications (1)

Publication Number Publication Date
JPH0451153U true JPH0451153U (ja) 1992-04-30

Family

ID=31829620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990092849U Pending JPH0451153U (ja) 1990-09-03 1990-09-03

Country Status (1)

Country Link
JP (1) JPH0451153U (ja)

Similar Documents

Publication Publication Date Title
JPH0451153U (ja)
JPH01171047U (ja)
JPS6422046U (ja)
JPH03128947U (ja)
JPS6444646U (ja)
JPH0313754U (ja)
JPH024258U (ja)
JPH0474455U (ja)
JPH0254248U (ja)
JPH0472627U (ja)
JPH048433U (ja)
JPH0474463U (ja)
JPH03117847U (ja)
JPH01139441U (ja)
JPS5856446U (ja) 樹脂封止半導体装置
JPH0345656U (ja)
JPH01104720U (ja)
JPS6373951U (ja)
JPH0420234U (ja)
JPH044767U (ja)
JPH0332425U (ja)
JPH02739U (ja)
JPS6312844U (ja)
JPH0463157U (ja)
JPH02138435U (ja)