JPH0455337B2 - - Google Patents

Info

Publication number
JPH0455337B2
JPH0455337B2 JP60077229A JP7722985A JPH0455337B2 JP H0455337 B2 JPH0455337 B2 JP H0455337B2 JP 60077229 A JP60077229 A JP 60077229A JP 7722985 A JP7722985 A JP 7722985A JP H0455337 B2 JPH0455337 B2 JP H0455337B2
Authority
JP
Japan
Prior art keywords
cap
semiconductor component
compound
substrate
semiconductor part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60077229A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61234550A (ja
Inventor
Mutsuo Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP60077229A priority Critical patent/JPS61234550A/ja
Priority to FR8513819A priority patent/FR2570383B1/fr
Publication of JPS61234550A publication Critical patent/JPS61234550A/ja
Publication of JPH0455337B2 publication Critical patent/JPH0455337B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60077229A 1984-09-20 1985-04-11 チツプキヤリア Granted JPS61234550A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP60077229A JPS61234550A (ja) 1985-04-11 1985-04-11 チツプキヤリア
FR8513819A FR2570383B1 (fr) 1984-09-20 1985-09-18 Composition stable conductrice de la chaleur et bloc de dispositif semi-conducteur dans lequel cette composition est utilisee

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60077229A JPS61234550A (ja) 1985-04-11 1985-04-11 チツプキヤリア

Publications (2)

Publication Number Publication Date
JPS61234550A JPS61234550A (ja) 1986-10-18
JPH0455337B2 true JPH0455337B2 (fr) 1992-09-03

Family

ID=13628027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60077229A Granted JPS61234550A (ja) 1984-09-20 1985-04-11 チツプキヤリア

Country Status (1)

Country Link
JP (1) JPS61234550A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100334154C (zh) * 2001-12-27 2007-08-29 英特尔公司 热材料的链延长

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738009A (ja) * 1993-06-25 1995-02-07 Matsushita Electric Works Ltd チップキャリア
EP0786806A1 (fr) * 1996-01-23 1997-07-30 Montpellier Technologies Boîtier d'entrées/sorties à haute densité pour des puces de puissance à circuits intégrés avec des fils soudés et procédé de fabrication
KR20020068208A (ko) * 2001-02-20 2002-08-27 에쓰에쓰아이 주식회사 반도체 조립체의 방열판 구조 및 그 제조 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100334154C (zh) * 2001-12-27 2007-08-29 英特尔公司 热材料的链延长

Also Published As

Publication number Publication date
JPS61234550A (ja) 1986-10-18

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