JPH0459175U - - Google Patents

Info

Publication number
JPH0459175U
JPH0459175U JP1990101067U JP10106790U JPH0459175U JP H0459175 U JPH0459175 U JP H0459175U JP 1990101067 U JP1990101067 U JP 1990101067U JP 10106790 U JP10106790 U JP 10106790U JP H0459175 U JPH0459175 U JP H0459175U
Authority
JP
Japan
Prior art keywords
chip
recognition means
conductor pattern
recognition
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990101067U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990101067U priority Critical patent/JPH0459175U/ja
Publication of JPH0459175U publication Critical patent/JPH0459175U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例に係るプリント基板の
部分平面図、第２図は本考案の実施例に係るワイ
ヤボンデイングを説明するフローチヤート、第３
Ａ図は視覚センサによる認識機能付のロボツトで
発生する認識点を示す図、第３Ｂ図は第３Ａ図で
ＩＣチツプ搭載のずれがある場合の認識点を示す
図、第４図は従来のプリント基板の部分平面図で
ある。 図において、１……ＩＣチツプ、２……導体パ
ターン、３……チツプパツド、４……認識マーク
、５……ダイボンデイングパツド、６……ワイヤ
、７……プリント基板、Ａ……ボンデイング指示
線、Ｂ……パターン形成等禁止部。

Claims (1)

  1. 【実用新案登録請求の範囲】 ＩＣチツプ１と、該ＩＣチツプ１に近接する導
    体パターン２とを備え、前記ＩＣチツプ１の搭載
    位置を認識する第１の認識手段と該ＩＣチツプ１
    のチツプパツド３とワイヤで接続すべき導体パタ
    ーン２の接続位置を認識するための第２の認識手
    段とを有するプリント基板において、 前記第１および第２の認識手段を一体にして共
    用し前記ＩＣチツプ１をはさんで対向すると共に
    該ＩＣチツプ１に近接する前記導体パターン２の
    端部で形成される領域の外側に配置される認識マ
    ーク４を設けることを特徴とするプリント基板。
JP1990101067U 1990-09-28 1990-09-28 Pending JPH0459175U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990101067U JPH0459175U (ja) 1990-09-28 1990-09-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990101067U JPH0459175U (ja) 1990-09-28 1990-09-28

Publications (1)

Publication Number Publication Date
JPH0459175U true JPH0459175U (ja) 1992-05-21

Family

ID=31844210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990101067U Pending JPH0459175U (ja) 1990-09-28 1990-09-28

Country Status (1)

Country Link
JP (1) JPH0459175U (ja)

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