JPH0467334U - - Google Patents

Info

Publication number
JPH0467334U
JPH0467334U JP1990110975U JP11097590U JPH0467334U JP H0467334 U JPH0467334 U JP H0467334U JP 1990110975 U JP1990110975 U JP 1990110975U JP 11097590 U JP11097590 U JP 11097590U JP H0467334 U JPH0467334 U JP H0467334U
Authority
JP
Japan
Prior art keywords
conductor film
hole
metal wire
thin metal
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990110975U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990110975U priority Critical patent/JPH0467334U/ja
Publication of JPH0467334U publication Critical patent/JPH0467334U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図ａは本考案の一実施例におけるスルーホ
ール近傍を拡大して示す平面図、第１図ｂは第１
図ａのＸ−Ｘ線断面図、第２図は本考案で実現す
る半導体装置の断面図、第３図ａは、従来例にお
けるスルーホール近傍を拡大して示す平面図、第
３図ｂは第３図ａのＸ−Ｘ線断面図であり、金属
細線９ａの圧着状態を示す。 １……配線基板、２……絶縁基板、３，３ａ…
…導体膜、３ａ１……ボンデイング用導体膜、３
ａ２……連結用導体膜、３ａ３……スルーホール
用導体膜、３ｂ……鍍金層、４……スルーホール
、５……ランド、６……接着対、７……リード、
８……半導体素子、９ａ，９ｂ……金属細線。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板上に形成した導体膜の所定部にスルー
    ホールを設け、前記導体膜上に鍍金層を形成した
    配線基板上に半導体素子をマウントして前記スル
    ーホールに接続した導体膜に金属細線をボンデイ
    ングした半導体装置において、前記スルーホール
    に接続した導体膜はボンデイング用導体膜、スル
    ーホール用導体膜および両者間を結ぶ幅の狭い連
    結用導体膜からなることを特徴とする半導体装置
    。
JP1990110975U 1990-10-23 1990-10-23 Pending JPH0467334U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990110975U JPH0467334U (ja) 1990-10-23 1990-10-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990110975U JPH0467334U (ja) 1990-10-23 1990-10-23

Publications (1)

Publication Number Publication Date
JPH0467334U true JPH0467334U (ja) 1992-06-15

Family

ID=31858384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990110975U Pending JPH0467334U (ja) 1990-10-23 1990-10-23

Country Status (1)

Country Link
JP (1) JPH0467334U (ja)

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