JPH0482853U - - Google Patents

Info

Publication number
JPH0482853U
JPH0482853U JP1990127591U JP12759190U JPH0482853U JP H0482853 U JPH0482853 U JP H0482853U JP 1990127591 U JP1990127591 U JP 1990127591U JP 12759190 U JP12759190 U JP 12759190U JP H0482853 U JPH0482853 U JP H0482853U
Authority
JP
Japan
Prior art keywords
frame
insulating base
metal layer
shaped metallized
metallized metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990127591U
Other languages
Japanese (ja)
Other versions
JP2514910Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990127591U priority Critical patent/JP2514910Y2/en
Publication of JPH0482853U publication Critical patent/JPH0482853U/ja
Application granted granted Critical
Publication of JP2514910Y2 publication Critical patent/JP2514910Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第２図は第１図の丸部
拡大断面図、第３図は従来の半導体素子収納用パ
ツケージの断面図である。 １……絶縁基体、２……金属製蓋体、３……容
器、８……メタライズ金属層、９……封止材、１
０……被覆部材。 Fig. 1 is a cross-sectional view showing an embodiment of the package for storing semiconductor elements of the present invention, Fig. 2 is an enlarged cross-sectional view of the circle part of Fig. 1, and Fig. 3 is a cross-sectional view of a conventional package for storing semiconductor elements. be. DESCRIPTION OF SYMBOLS 1... Insulating base, 2... Metal lid, 3... Container, 8... Metallized metal layer, 9... Sealing material, 1
0...Covering member.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上面に枠状のメタライズ金属層が被着された絶
縁基体と金属製蓋体とから成り、絶縁基体の枠状
メタライズ金属層に金属製蓋体を取着することに
よつて内部に半導体素子を収容するようになした
半導体素子収納用パツケージにおいて、前記枠状
メタライズ金属層の上面外周部が絶縁基体と焼結
一体化した被覆部材で覆われていることを特徴と
する半導体素子収納用パツケージ。 It consists of an insulating base with a frame-shaped metallized metal layer adhered to the top surface and a metal lid. By attaching the metal lid to the frame-shaped metallized metal layer of the insulating base, a semiconductor element can be installed inside. What is claimed is: 1. A package for accommodating a semiconductor device, characterized in that an outer periphery of the upper surface of the frame-shaped metallized metal layer is covered with a covering member sintered and integrated with an insulating base.
JP1990127591U 1990-11-28 1990-11-28 Package for storing semiconductor devices Expired - Lifetime JP2514910Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990127591U JP2514910Y2 (en) 1990-11-28 1990-11-28 Package for storing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990127591U JP2514910Y2 (en) 1990-11-28 1990-11-28 Package for storing semiconductor devices

Publications (2)

Publication Number Publication Date
JPH0482853U true JPH0482853U (en) 1992-07-20
JP2514910Y2 JP2514910Y2 (en) 1996-10-23

Family

ID=31875085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990127591U Expired - Lifetime JP2514910Y2 (en) 1990-11-28 1990-11-28 Package for storing semiconductor devices

Country Status (1)

Country Link
JP (1) JP2514910Y2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5591844A (en) * 1978-12-28 1980-07-11 Fujitsu Ltd Electronic parts package
JPS5868951A (en) * 1981-10-21 1983-04-25 Hitachi Ltd Semiconductor device
JPS61236148A (en) * 1985-04-11 1986-10-21 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Solding on metalization pattern
JPH01166547A (en) * 1987-12-23 1989-06-30 Hitachi Ltd Ceramic substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5591844A (en) * 1978-12-28 1980-07-11 Fujitsu Ltd Electronic parts package
JPS5868951A (en) * 1981-10-21 1983-04-25 Hitachi Ltd Semiconductor device
JPS61236148A (en) * 1985-04-11 1986-10-21 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Solding on metalization pattern
JPH01166547A (en) * 1987-12-23 1989-06-30 Hitachi Ltd Ceramic substrate

Also Published As

Publication number Publication date
JP2514910Y2 (en) 1996-10-23

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term