JPH048432U - - Google Patents
Info
- Publication number
- JPH048432U JPH048432U JP1990048734U JP4873490U JPH048432U JP H048432 U JPH048432 U JP H048432U JP 1990048734 U JP1990048734 U JP 1990048734U JP 4873490 U JP4873490 U JP 4873490U JP H048432 U JPH048432 U JP H048432U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- bonding
- range
- chip
- effective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Description
第１図〜第３図は本考案を表わしたＢパターン
の一部の拡大平面図、第４図は従来例を模式的に
表わした従来例の一部平面図、第５図は従来例の
欠陥を表わした一部拡大平面図、第６図はエツチ
ング工程の説明図である。
２０……回路基板、２１……ＩＣ、Ｐｎ（Ｐ１
３〜Ｐ２５）……ＩＣ外部電極、Ｂｎ（Ｂ１３〜
Ｂ２５）……ボンデイングパターン、２５……狭
小部、２６……広幅部。
Figures 1 to 3 are enlarged plan views of a part of the B pattern representing the present invention, Figure 4 is a partial plan view of a conventional example schematically representing the conventional example, and Figure 5 is a partial plan view of the conventional example. FIG. 6 is a partially enlarged plan view showing defects and is an explanatory diagram of the etching process. 20...Circuit board, 21...IC, Pn (P1
3~P25)...IC external electrode, Bn (B13~
B25)... Bonding pattern, 25... Narrow part, 26... Wide part.
Claims (1)
により電気的接続を行うことのできるボンデイン
グパターンを有する回路基板において、隣接する
ボンデイングパターンのボンデイング有効範囲周
辺が均一な隙間で構成されていることを特徴とす
る回路基板。 (2) 上記隙間が０．１２５mmで構成されている
ことを特徴とする請求項１記載の回路基板。 (3) 上記ボンデイング有効範囲が、ＩＣチツプ
のパツド中心から０．８〜１．５mmの範囲に配設
されていることを特徴とする請求項１記載の回路
基板。[Scope of Claim for Utility Model Registration] (1) In a circuit board on which an IC chip is mounted and has a bonding pattern capable of electrically connecting with a conductive material such as Au wire, the periphery of the bonding effective range of adjacent bonding patterns is A circuit board characterized by being composed of uniform gaps. (2) The circuit board according to claim 1, wherein the gap is 0.125 mm. (3) The circuit board according to claim 1, wherein the effective bonding range is located within a range of 0.8 to 1.5 mm from the center of the pad of the IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990048734U JPH048432U (en) | 1990-05-10 | 1990-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990048734U JPH048432U (en) | 1990-05-10 | 1990-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH048432U true JPH048432U (en) | 1992-01-27 |
Family
ID=31565816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990048734U Pending JPH048432U (en) | 1990-05-10 | 1990-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH048432U (en) |
-
1990
- 1990-05-10 JP JP1990048734U patent/JPH048432U/ja active Pending