JPH0525176B2 - - Google Patents

Info

Publication number
JPH0525176B2
JPH0525176B2 JP60192218A JP19221885A JPH0525176B2 JP H0525176 B2 JPH0525176 B2 JP H0525176B2 JP 60192218 A JP60192218 A JP 60192218A JP 19221885 A JP19221885 A JP 19221885A JP H0525176 B2 JPH0525176 B2 JP H0525176B2
Authority
JP
Japan
Prior art keywords
gold
gold electrode
wire
surface roughness
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60192218A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6249640A (ja
Inventor
Yukio Murata
Toshiaki Shoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60192218A priority Critical patent/JPS6249640A/ja
Publication of JPS6249640A publication Critical patent/JPS6249640A/ja
Publication of JPH0525176B2 publication Critical patent/JPH0525176B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Electronic Switches (AREA)
  • Details Of Resistors (AREA)
JP60192218A 1985-08-29 1985-08-29 金電極構造およびその製造方法 Granted JPS6249640A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60192218A JPS6249640A (ja) 1985-08-29 1985-08-29 金電極構造およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60192218A JPS6249640A (ja) 1985-08-29 1985-08-29 金電極構造およびその製造方法

Publications (2)

Publication Number Publication Date
JPS6249640A JPS6249640A (ja) 1987-03-04
JPH0525176B2 true JPH0525176B2 (mo) 1993-04-12

Family

ID=16287625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60192218A Granted JPS6249640A (ja) 1985-08-29 1985-08-29 金電極構造およびその製造方法

Country Status (1)

Country Link
JP (1) JPS6249640A (mo)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4633442B2 (ja) * 2004-11-04 2011-02-16 ローム株式会社 サーマルヘッド
US7697020B2 (en) 2004-11-04 2010-04-13 Rohm Co., Ltd. Thermal print head and method for manufacturing same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS547866A (en) * 1977-06-20 1979-01-20 Mitsubishi Electric Corp Manufacture for semiconductor device
JPS5434678A (en) * 1977-08-22 1979-03-14 Matsushita Electronics Corp Semiconductor device
JPS5739548A (en) * 1980-08-21 1982-03-04 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
JPS6249640A (ja) 1987-03-04

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term