JPH0546086B2 - - Google Patents

Info

Publication number
JPH0546086B2
JPH0546086B2 JP58159275A JP15927583A JPH0546086B2 JP H0546086 B2 JPH0546086 B2 JP H0546086B2 JP 58159275 A JP58159275 A JP 58159275A JP 15927583 A JP15927583 A JP 15927583A JP H0546086 B2 JPH0546086 B2 JP H0546086B2
Authority
JP
Japan
Prior art keywords
pressure
bonding
oxide film
semiconductor
mirror
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58159275A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6050970A (ja
Inventor
Masaru Shinho
Kyoshi Fukuda
Katsujiro Tanzawa
Shunji Shiromizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58159275A priority Critical patent/JPS6050970A/ja
Publication of JPS6050970A publication Critical patent/JPS6050970A/ja
Publication of JPH0546086B2 publication Critical patent/JPH0546086B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
JP58159275A 1983-08-31 1983-08-31 半導体圧力変換器 Granted JPS6050970A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58159275A JPS6050970A (ja) 1983-08-31 1983-08-31 半導体圧力変換器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58159275A JPS6050970A (ja) 1983-08-31 1983-08-31 半導体圧力変換器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP40481290A Division JPH0673383B2 (ja) 1990-12-21 1990-12-21 半導体圧力変換器の製造方法

Publications (2)

Publication Number Publication Date
JPS6050970A JPS6050970A (ja) 1985-03-22
JPH0546086B2 true JPH0546086B2 (ko) 1993-07-13

Family

ID=15690219

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58159275A Granted JPS6050970A (ja) 1983-08-31 1983-08-31 半導体圧力変換器

Country Status (1)

Country Link
JP (1) JPS6050970A (ko)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085648A (ja) * 1999-07-15 2001-03-30 Shin Etsu Handotai Co Ltd 貼り合わせウエーハの製造方法および貼り合わせウエーハ
JP2001345435A (ja) * 2000-03-29 2001-12-14 Shin Etsu Handotai Co Ltd シリコンウェーハ及び貼り合わせウェーハの製造方法、並びにその貼り合わせウェーハ
US6461939B1 (en) 1999-04-09 2002-10-08 Shin-Etsu Handotai Co., Ltd. SOI wafers and methods for producing SOI wafer
US6797632B1 (en) 1999-10-14 2004-09-28 Shin-Etsu Handotai Co., Ltd. Bonded wafer producing method and bonded wafer
WO2004102668A1 (ja) 2003-05-15 2004-11-25 Shin-Etsu Handotai Co. Ltd. Ｓｏｉウェーハおよびその製造方法
US8918278B2 (en) 2000-08-28 2014-12-23 Inrix Global Services Limited Method and system for modeling and processing vehicular traffic data and information and applying thereof
US9026114B2 (en) 2004-07-09 2015-05-05 INRX Global Services Limited System and method for geographically locating a cellular phone

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122148A (ja) * 1985-11-21 1987-06-03 Toshiba Corp 半導体基板
JPH0795505B2 (ja) * 1990-02-28 1995-10-11 信越半導体株式会社 接合ウエーハの製造方法
JPH10223497A (ja) * 1997-01-31 1998-08-21 Shin Etsu Handotai Co Ltd 貼り合わせ基板の作製方法
JP3635200B2 (ja) 1998-06-04 2005-04-06 信越半導体株式会社 Ｓｏｉウェーハの製造方法
JP3385972B2 (ja) 1998-07-10 2003-03-10 信越半導体株式会社 貼り合わせウェーハの製造方法および貼り合わせウェーハ
WO2001048825A1 (en) 1999-12-24 2001-07-05 Shin-Etsu Handotai Co., Ltd. Method for manufacturing bonded wafer
KR100741541B1 (ko) 2000-05-30 2007-07-20 신에쯔 한도타이 가부시키가이샤 접합웨이퍼의 제조방법 및 접합웨이퍼
KR20030072954A (ko) * 2002-03-07 2003-09-19 주식회사 케이이씨 반도체 압력 센서 및 그 제조 방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710980A (en) * 1980-06-23 1982-01-20 Mitsubishi Electric Corp Semiconductor pressure detecting device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6461939B1 (en) 1999-04-09 2002-10-08 Shin-Etsu Handotai Co., Ltd. SOI wafers and methods for producing SOI wafer
EP2413352A2 (en) 1999-04-09 2012-02-01 Shin-Etsu Handotai Co., Ltd. Soi wafer and method for producing soi wafer
JP2001085648A (ja) * 1999-07-15 2001-03-30 Shin Etsu Handotai Co Ltd 貼り合わせウエーハの製造方法および貼り合わせウエーハ
US6797632B1 (en) 1999-10-14 2004-09-28 Shin-Etsu Handotai Co., Ltd. Bonded wafer producing method and bonded wafer
JP2001345435A (ja) * 2000-03-29 2001-12-14 Shin Etsu Handotai Co Ltd シリコンウェーハ及び貼り合わせウェーハの製造方法、並びにその貼り合わせウェーハ
US8918278B2 (en) 2000-08-28 2014-12-23 Inrix Global Services Limited Method and system for modeling and processing vehicular traffic data and information and applying thereof
US9324232B2 (en) 2000-08-28 2016-04-26 INRX Gloabal Services Limited Method and system for modeling and processing vehicular traffic data and information and applying thereof
WO2004102668A1 (ja) 2003-05-15 2004-11-25 Shin-Etsu Handotai Co. Ltd. Ｓｏｉウェーハおよびその製造方法
US9026114B2 (en) 2004-07-09 2015-05-05 INRX Global Services Limited System and method for geographically locating a cellular phone

Also Published As

Publication number Publication date
JPS6050970A (ja) 1985-03-22

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