JPH054814B2 - - Google Patents

Info

Publication number
JPH054814B2
JPH054814B2 JP62199039A JP19903987A JPH054814B2 JP H054814 B2 JPH054814 B2 JP H054814B2 JP 62199039 A JP62199039 A JP 62199039A JP 19903987 A JP19903987 A JP 19903987A JP H054814 B2 JPH054814 B2 JP H054814B2
Authority
JP
Japan
Prior art keywords
bonding
wire
wedge
tip
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62199039A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6442830A (en
Inventor
Hideaki Myoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP62199039A priority Critical patent/JPS6442830A/ja
Publication of JPS6442830A publication Critical patent/JPS6442830A/ja
Publication of JPH054814B2 publication Critical patent/JPH054814B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP62199039A 1987-08-11 1987-08-11 Wire bonding Granted JPS6442830A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62199039A JPS6442830A (en) 1987-08-11 1987-08-11 Wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62199039A JPS6442830A (en) 1987-08-11 1987-08-11 Wire bonding

Publications (2)

Publication Number Publication Date
JPS6442830A JPS6442830A (en) 1989-02-15
JPH054814B2 true JPH054814B2 (cs) 1993-01-20

Family

ID=16401103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62199039A Granted JPS6442830A (en) 1987-08-11 1987-08-11 Wire bonding

Country Status (1)

Country Link
JP (1) JPS6442830A (cs)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855665B2 (ja) * 1979-06-21 1983-12-10 株式会社新川 ワイヤボンデイング方法
JPS5889833A (ja) * 1981-11-25 1983-05-28 Shinkawa Ltd ワイヤボンデイング方法

Also Published As

Publication number Publication date
JPS6442830A (en) 1989-02-15

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