JPH0616524B2 - 半導体ウエハ固定用接着薄板 - Google Patents

半導体ウエハ固定用接着薄板

Info

Publication number
JPH0616524B2
JPH0616524B2 JP4774384A JP4774384A JPH0616524B2 JP H0616524 B2 JPH0616524 B2 JP H0616524B2 JP 4774384 A JP4774384 A JP 4774384A JP 4774384 A JP4774384 A JP 4774384A JP H0616524 B2 JPH0616524 B2 JP H0616524B2
Authority
JP
Japan
Prior art keywords
thin plate
semiconductor wafer
pressure
adhesive
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4774384A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60196956A (ja
Inventor
剛正 植村
良成 里田
栄二 重村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=12783830&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH0616524(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP4774384A priority Critical patent/JPH0616524B2/ja
Priority to DE8585301674T priority patent/DE3586329T2/de
Priority to EP85301674A priority patent/EP0157508B1/de
Publication of JPS60196956A publication Critical patent/JPS60196956A/ja
Priority to US07/817,089 priority patent/US5714029A/en
Priority to US08/195,829 priority patent/US5637395A/en
Publication of JPH0616524B2 publication Critical patent/JPH0616524B2/ja
Priority to US08/934,104 priority patent/US6010782A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/625—Polymers of alpha-beta ethylenically unsaturated carboxylic acids; hydrolyzed polymers of esters of these acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C08G18/673—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen containing two or more acrylate or alkylacrylate ester groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/40—Compositions for pressure-sensitive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
JP4774384A 1984-03-12 1984-03-12 半導体ウエハ固定用接着薄板 Expired - Lifetime JPH0616524B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP4774384A JPH0616524B2 (ja) 1984-03-12 1984-03-12 半導体ウエハ固定用接着薄板
DE8585301674T DE3586329T2 (de) 1984-03-12 1985-03-11 Duenne klebefolie fuer die bearbeitung von halbleiterplaettchen.
EP85301674A EP0157508B1 (de) 1984-03-12 1985-03-11 Dünne Klebefolie für die Bearbeitung von Halbleiterplättchen
US07/817,089 US5714029A (en) 1984-03-12 1992-01-06 Process for working a semiconductor wafer
US08/195,829 US5637395A (en) 1984-03-12 1994-02-14 Thin adhesive sheet for working semiconductor wafers
US08/934,104 US6010782A (en) 1984-03-12 1997-09-19 Thin adhesive sheet for working semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4774384A JPH0616524B2 (ja) 1984-03-12 1984-03-12 半導体ウエハ固定用接着薄板

Publications (2)

Publication Number Publication Date
JPS60196956A JPS60196956A (ja) 1985-10-05
JPH0616524B2 true JPH0616524B2 (ja) 1994-03-02

Family

ID=12783830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4774384A Expired - Lifetime JPH0616524B2 (ja) 1984-03-12 1984-03-12 半導体ウエハ固定用接着薄板

Country Status (3)

Country Link
EP (1) EP0157508B1 (de)
JP (1) JPH0616524B2 (de)
DE (1) DE3586329T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2305763A1 (de) 2009-09-30 2011-04-06 Nitto Denko Corporation Druckempfindliches Klebeblatt für Rückhalteelemente und Verfahren zur Herstellung der Elemente

Families Citing this family (119)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60223139A (ja) * 1984-04-18 1985-11-07 Nitto Electric Ind Co Ltd 半導体ウエハ固定用接着薄板
JPH0635569B2 (ja) * 1985-09-04 1994-05-11 バンドー化学株式会社 感圧接着性シート
GB2221468B (en) * 1985-12-27 1990-09-05 Fsk Kk Adhesive sheet suitable for use in dicing semiconductor wafers into chips
JPS62153375A (ja) * 1985-12-27 1987-07-08 F S K Kk ウエハダイシング用粘着シート
JPS6317980A (ja) * 1986-07-09 1988-01-25 F S K Kk ウエハ貼着用粘着シ−ト
DE3639266A1 (de) * 1985-12-27 1987-07-02 Fsk K K Haftfolie
NL193617C (nl) * 1985-12-27 2000-04-04 Lintec Corp Kleefvel voor halfgeleiders.
JPH0613681B2 (ja) * 1986-08-08 1994-02-23 バンドー化学株式会社 感圧接着性シ−ト
JP2510416B2 (ja) * 1986-08-08 1996-06-26 バンドー化学株式会社 半導体ウエハ−のダイシング方法
EP0298448B1 (de) * 1987-07-08 1994-06-29 The Furukawa Electric Co., Ltd. Strahlungsvernetzbare Klebestreifen
US5281473A (en) * 1987-07-08 1994-01-25 Furakawa Electric Co., Ltd. Radiation-curable adhesive tape
US5149586A (en) * 1987-07-08 1992-09-22 Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
JPS6464772A (en) * 1987-09-01 1989-03-10 Fsk Kk Tacky sheet for polishing
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
US5284091A (en) * 1990-04-12 1994-02-08 Lintec Corporation Plate roll and an adhesive sheet therefor
JPH03278444A (ja) * 1990-09-07 1991-12-10 Bando Chem Ind Ltd 半導体ウエハーのダイシング方法
JP2601956B2 (ja) * 1991-07-31 1997-04-23 リンテック株式会社 再剥離型粘着性ポリマー
JPH05179211A (ja) * 1991-12-30 1993-07-20 Nitto Denko Corp ダイシング・ダイボンドフイルム
EP0571649A1 (de) * 1992-05-26 1993-12-01 Nitto Denko Corporation Unterstützungsfilm zum Schneiden und Befestigen von Halbleiterplättchen und dessen Verwendung in einem Verfahren zur Chipherstellung
DE4230784A1 (de) * 1992-09-15 1994-03-17 Beiersdorf Ag Durch Strahlung partiell entklebendes Selbstklebeband (Dicing Tape)
US5268065A (en) * 1992-12-21 1993-12-07 Motorola, Inc. Method for thinning a semiconductor wafer
DE4415132C2 (de) * 1994-04-29 1997-03-20 Siemens Ag Verfahren zur formgebenden Bearbeitung von dünnen Wafern und Solarzellen aus kristallinem Silizium
US5501785A (en) * 1994-07-13 1996-03-26 Tefco International Co., Ltd. Process for manufacturing electroformed patterns
JP3521099B2 (ja) * 1994-11-29 2004-04-19 リンテック株式会社 ダイシング用リングフレームへの接着剤の付着防止用粘着シートおよび該粘着シートを備えたウェハ加工用シート
TW311927B (de) * 1995-07-11 1997-08-01 Minnesota Mining & Mfg
US5648136A (en) * 1995-07-11 1997-07-15 Minnesota Mining And Manufacturing Co. Component carrier tape
CN1157310A (zh) 1995-11-22 1997-08-20 琳得科株式会社 粘合剂组合物和粘合片
JP3388674B2 (ja) * 1996-04-19 2003-03-24 リンテック株式会社 エネルギー線硬化型感圧接着剤組成物およびその利用方法
US5891285A (en) * 1996-05-10 1999-04-06 Tefco International Co., Ltd. Process for manufacturing electroformed patterns
GB2320615B (en) 1996-12-19 2001-06-20 Lintec Corp Process for producing a chip and pressure sensitive adhesive sheet for said process
US6312800B1 (en) * 1997-02-10 2001-11-06 Lintec Corporation Pressure sensitive adhesive sheet for producing a chip
JP3955659B2 (ja) * 1997-06-12 2007-08-08 リンテック株式会社 電子部品のダイボンディング方法およびそれに使用されるダイボンディング装置
JPH1161065A (ja) * 1997-08-25 1999-03-05 Sumitomo Bakelite Co Ltd 半導体ウエハ加工用粘着シート
JP4072927B2 (ja) * 1997-08-28 2008-04-09 リンテック株式会社 エネルギー線硬化型親水性粘着剤組成物およびその利用方法
JP3903447B2 (ja) * 1998-01-21 2007-04-11 リンテック株式会社 粘着シート
US6235387B1 (en) 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
JP4053656B2 (ja) 1998-05-22 2008-02-27 リンテック株式会社 エネルギー線硬化型親水性粘着剤組成物およびその利用方法
JP4275221B2 (ja) 1998-07-06 2009-06-10 リンテック株式会社 粘接着剤組成物および粘接着シート
JP3410371B2 (ja) 1998-08-18 2003-05-26 リンテック株式会社 ウエハ裏面研削時の表面保護シートおよびその利用方法
US7105226B2 (en) 1998-08-26 2006-09-12 Lintec Corporation Pressure sensitive adhesive double coated sheet and method of use thereof
JP3784202B2 (ja) 1998-08-26 2006-06-07 リンテック株式会社 両面粘着シートおよびその使用方法
CN1137028C (zh) 1998-11-20 2004-02-04 琳得科株式会社 压敏粘合片及其使用方法
JP2000331962A (ja) 1999-05-18 2000-11-30 Lintec Corp 半導体ウエハの加工方法および半導体ウエハ支持部材
JP4392732B2 (ja) 2000-02-07 2010-01-06 リンテック株式会社 半導体チップの製造方法
JP4230080B2 (ja) 2000-02-18 2009-02-25 リンテック株式会社 ウエハ貼着用粘着シート
JP2001240842A (ja) * 2000-02-28 2001-09-04 Nitto Denko Corp 紫外線硬化型粘着剤組成物とその粘着シ―ト類
ATE424040T1 (de) * 2000-03-30 2009-03-15 Nitto Denko Corp Wasserdurchlässiges klebeband für die verarbeitung von halbleitern
JP4597323B2 (ja) 2000-07-07 2010-12-15 リンテック株式会社 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート
JP3906962B2 (ja) 2000-08-31 2007-04-18 リンテック株式会社 半導体装置の製造方法
JP3544362B2 (ja) 2001-03-21 2004-07-21 リンテック株式会社 半導体チップの製造方法
JP2002285134A (ja) * 2001-03-26 2002-10-03 Sumitomo Bakelite Co Ltd 半導体加工用粘着シート
JP2002348554A (ja) * 2001-05-24 2002-12-04 Lintec Corp ワーク固定用シートおよびワーク加工方法
JP4869517B2 (ja) 2001-08-21 2012-02-08 リンテック株式会社 粘接着テープ
JP2003147300A (ja) * 2001-11-12 2003-05-21 Lintec Corp ウエハ裏面研削時の表面保護シートおよび半導体チップの製造方法
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KR100635053B1 (ko) 2005-06-21 2006-10-16 도레이새한 주식회사 전자부품용 접착테이프
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WO2008032367A1 (en) 2006-09-12 2008-03-20 Nitto Denko Corporation Dicing/die bonding film
JP5244603B2 (ja) * 2006-10-03 2013-07-24 株式会社イーテック 粘着剤組成物及び粘着シート
US8114520B2 (en) 2006-12-05 2012-02-14 Lintec Corporation Laser dicing sheet and process for producing chip body
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KR100844383B1 (ko) 2007-03-13 2008-07-07 도레이새한 주식회사 반도체 칩 적층용 접착 필름
JP2008302616A (ja) 2007-06-08 2008-12-18 Tefuko Aomori Kk 微小金属パターンおよびその製造方法
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JP2009064975A (ja) * 2007-09-06 2009-03-26 Nitto Denko Corp ダイシング用粘着シート及びダイシング方法
JP4717052B2 (ja) 2007-11-08 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
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JP4717085B2 (ja) 2008-01-18 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
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KR101040478B1 (ko) 2009-05-20 2011-06-09 도레이첨단소재 주식회사 고효율의 광확산 고분자 필름 및 이의 제조방법
JP5550371B2 (ja) * 2010-02-05 2014-07-16 リンテック株式会社 接着剤組成物および接着シート
JP2012177084A (ja) * 2011-01-31 2012-09-13 Dainippon Printing Co Ltd 耐熱仮着用の粘着剤組成物及び粘着テープ
JP5762781B2 (ja) 2011-03-22 2015-08-12 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート
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KR101295705B1 (ko) 2011-04-25 2013-08-16 도레이첨단소재 주식회사 투명 플라스틱기판용 페녹시수지 조성물 및 이를 이용한 투명 플라스틱 기판소재
EP2733728A1 (de) 2011-07-15 2014-05-21 Nitto Denko Corporation Verfahren zur herstellung eines elektronischen bauteils und in dem verfahren zur herstellung eines elektronischen bauteils verwendete klebefolie
JP5930625B2 (ja) * 2011-08-03 2016-06-08 日東電工株式会社 ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置
WO2013105455A1 (ja) 2012-01-12 2013-07-18 電気化学工業株式会社 粘着シートおよび電子部品の製造方法
JP5950669B2 (ja) * 2012-04-16 2016-07-13 日東電工株式会社 粘着シート及び粘着剤組成物
JP2013237732A (ja) * 2012-05-11 2013-11-28 Dainippon Printing Co Ltd エネルギー線易剥離型粘着剤組成物及び粘着テープ
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JP2014189620A (ja) * 2013-03-27 2014-10-06 Nippon Carbide Ind Co Inc 粘着剤組成物、粘着剤付き光学部材、および表示装置
MY179367A (en) 2014-08-29 2020-11-05 Furukawa Electric Co Ltd Adhesive film and semiconductor package using adhesive film
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JP7503383B2 (ja) 2017-11-13 2024-06-20 日東電工株式会社 焼結接合用組成物、焼結接合用シート、および焼結接合用シート付きダイシングテープ
WO2019092959A1 (ja) 2017-11-13 2019-05-16 日東電工株式会社 焼結接合用組成物、焼結接合用シート、および焼結接合用シート付きダイシングテープ
JP6350845B1 (ja) * 2018-01-29 2018-07-04 サイデン化学株式会社 粘着剤組成物、粘着シート、及び粘着剤の製造方法
JP7210421B2 (ja) 2019-11-08 2023-01-23 日東電工株式会社 熱硬化性シート及びダイシングダイボンドフィルム
JP7190418B2 (ja) 2019-11-08 2022-12-15 日東電工株式会社 熱硬化性シート及びダイシングダイボンドフィルム
JP7095713B2 (ja) * 2020-03-05 2022-07-05 王子ホールディングス株式会社 粘着シート、積層体の製造方法および積層体
CN113831865B (zh) 2020-06-24 2026-02-10 日东电工株式会社 热固性片及切割芯片接合薄膜
JP7570885B2 (ja) 2020-10-26 2024-10-22 日東電工株式会社 熱硬化性シート、ダイシングダイボンドフィルム、及び、半導体装置
JP7577594B2 (ja) 2021-03-31 2024-11-05 日東電工株式会社 熱硬化性シート及びダイシングダイボンドフィルム
JP7705934B2 (ja) * 2021-05-28 2025-07-10 三井化学Ictマテリア株式会社 電子装置の製造方法
TWI790849B (zh) * 2021-12-09 2023-01-21 財團法人工業技術研究院 黏著組成物、液晶顯示器與其拆解方法
TWI824484B (zh) * 2022-04-15 2023-12-01 國精化學股份有限公司 液態黏結劑及螢石塊

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151057A (en) * 1978-08-14 1979-04-24 Shell Oil Company High temperature adhesive made by exposure to radiation
GB2102011B (en) * 1981-06-17 1984-12-19 Smith & Nephew Ass Electron beam cured acrylic adhesive layer
JPS5850164A (ja) * 1981-09-19 1983-03-24 Nippon Steel Corp 連続鋳造設備
DE3271275D1 (en) * 1981-12-09 1986-06-26 Lingner & Fischer Gmbh Curing compositions
JPS5921038A (ja) * 1982-07-27 1984-02-02 Nec Home Electronics Ltd ペレツト剥離方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2305763A1 (de) 2009-09-30 2011-04-06 Nitto Denko Corporation Druckempfindliches Klebeblatt für Rückhalteelemente und Verfahren zur Herstellung der Elemente

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