JPH0644099Y2 - 半導体素子用樹脂封止装置 - Google Patents

半導体素子用樹脂封止装置

Info

Publication number
JPH0644099Y2
JPH0644099Y2 JP1988083229U JP8322988U JPH0644099Y2 JP H0644099 Y2 JPH0644099 Y2 JP H0644099Y2 JP 1988083229 U JP1988083229 U JP 1988083229U JP 8322988 U JP8322988 U JP 8322988U JP H0644099 Y2 JPH0644099 Y2 JP H0644099Y2
Authority
JP
Japan
Prior art keywords
temperature
mold
target temperature
pid control
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988083229U
Other languages
English (en)
Japanese (ja)
Other versions
JPH024242U (da
Inventor
至 松尾
潔 武末
勝徳 甲斐
光高 松尾
伸貴 入口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1988083229U priority Critical patent/JPH0644099Y2/ja
Publication of JPH024242U publication Critical patent/JPH024242U/ja
Application granted granted Critical
Publication of JPH0644099Y2 publication Critical patent/JPH0644099Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Control Of Temperature (AREA)
JP1988083229U 1988-06-22 1988-06-22 半導体素子用樹脂封止装置 Expired - Lifetime JPH0644099Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988083229U JPH0644099Y2 (ja) 1988-06-22 1988-06-22 半導体素子用樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988083229U JPH0644099Y2 (ja) 1988-06-22 1988-06-22 半導体素子用樹脂封止装置

Publications (2)

Publication Number Publication Date
JPH024242U JPH024242U (da) 1990-01-11
JPH0644099Y2 true JPH0644099Y2 (ja) 1994-11-14

Family

ID=31307955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988083229U Expired - Lifetime JPH0644099Y2 (ja) 1988-06-22 1988-06-22 半導体素子用樹脂封止装置

Country Status (1)

Country Link
JP (1) JPH0644099Y2 (da)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2537200Y2 (ja) * 1990-11-28 1997-05-28 エスエムシー 株式会社 ラックピニオン形揺動アクチュエータ

Also Published As

Publication number Publication date
JPH024242U (da) 1990-01-11

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