JPH0747868Y2 - チップボンディングまたはワイヤボンディング工程におけるリードフレーム押さえ - Google Patents

チップボンディングまたはワイヤボンディング工程におけるリードフレーム押さえ

Info

Publication number
JPH0747868Y2
JPH0747868Y2 JP1989059337U JP5933789U JPH0747868Y2 JP H0747868 Y2 JPH0747868 Y2 JP H0747868Y2 JP 1989059337 U JP1989059337 U JP 1989059337U JP 5933789 U JP5933789 U JP 5933789U JP H0747868 Y2 JPH0747868 Y2 JP H0747868Y2
Authority
JP
Japan
Prior art keywords
lead frame
bonding
frame
chip
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989059337U
Other languages
English (en)
Japanese (ja)
Other versions
JPH031433U (cs
Inventor
雅夫 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP1989059337U priority Critical patent/JPH0747868Y2/ja
Publication of JPH031433U publication Critical patent/JPH031433U/ja
Application granted granted Critical
Publication of JPH0747868Y2 publication Critical patent/JPH0747868Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1989059337U 1989-05-23 1989-05-23 チップボンディングまたはワイヤボンディング工程におけるリードフレーム押さえ Expired - Lifetime JPH0747868Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989059337U JPH0747868Y2 (ja) 1989-05-23 1989-05-23 チップボンディングまたはワイヤボンディング工程におけるリードフレーム押さえ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989059337U JPH0747868Y2 (ja) 1989-05-23 1989-05-23 チップボンディングまたはワイヤボンディング工程におけるリードフレーム押さえ

Publications (2)

Publication Number Publication Date
JPH031433U JPH031433U (cs) 1991-01-09
JPH0747868Y2 true JPH0747868Y2 (ja) 1995-11-01

Family

ID=31585746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989059337U Expired - Lifetime JPH0747868Y2 (ja) 1989-05-23 1989-05-23 チップボンディングまたはワイヤボンディング工程におけるリードフレーム押さえ

Country Status (1)

Country Link
JP (1) JPH0747868Y2 (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4819755B2 (ja) * 2007-06-27 2011-11-24 通博 大江 温水・蒸気製造装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6279639A (ja) * 1985-10-02 1987-04-13 Toshiba Corp ワイヤボンデイング装置
JPS62188331A (ja) * 1986-02-14 1987-08-17 Hitachi Ltd ボンデイング装置
JPS6387731A (ja) * 1986-09-30 1988-04-19 Mitsubishi Electric Corp ワイヤボンデイング装置

Also Published As

Publication number Publication date
JPH031433U (cs) 1991-01-09

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term