JPH07505255A - 集積回路用テストソケット - Google Patents
集積回路用テストソケットInfo
- Publication number
- JPH07505255A JPH07505255A JP5517427A JP51742793A JPH07505255A JP H07505255 A JPH07505255 A JP H07505255A JP 5517427 A JP5517427 A JP 5517427A JP 51742793 A JP51742793 A JP 51742793A JP H07505255 A JPH07505255 A JP H07505255A
- Authority
- JP
- Japan
- Prior art keywords
- base
- platform
- integrated circuit
- test socket
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (6)
- 1.集積回路用テストソケットであって、ベースと、 上記集積回路を支持するプラットホームと、上記集積回路に電気的に接続すると ともに、上記ベースに対して空間を設けて上記プラットホームを支持しかつ上記 ベースに対する上記プラットホームの弾性移動を許容する、弾性コンタクトと、 静止位置において上記ベースに対して上記プラットホームを保持するとともに、 上記静止位置から上記ベース方向への上記プラットホームの回転および平行移動 を許容する手段と、 を備えるテストソケット。
- 2.上記ベースに脱着可能に取り付けられ、上記集積回路を上記コンタクトに接 触させるカバーをさらに備える、請求項1記載のテストソケット。
- 3.上記カバーを上記ベースに取り付けるヒンジをさらに備える、請求項2記載 のテストソケット。
- 4.上記カバーが上記集積回路に接触する状態を保つラッチをさらに備える、請 求項3記載のテストソケット。
- 5.上記プラットホームを保持する上記手段は、上記プラットホームから上記ベ ース方向に垂下する脚を備え、該脚の一端には該脚に対して実質的に垂直方向に 延在する突出部を有し、上記ベースは、上記脚の突出部と相互作用する壁をさら に傭え、上記ベース方向への上記脚の移動は許容するが上記ベースから離れる方 向への上記脚の移動は許容しない、請求項1記載のテストソケット。
- 6.集積回路用テストソケットであって、大略平らな下部面と、該下部面から延 在して上記下部面の上方に内部開口部を形成する直立した壁とを有するベースと 、上記集積回路を支持するプラットホームであって、該プラットホームから上記 ベースの下部面方向に延在する少なくとも2つの垂下する脚を有し、該脚は該脚 の延在方向に対して実質的に直交して突出する端部を有する、プラットホームと 、上記ベースの壁に含まれ、上記プラットホームの上記脚の端部に対応する凹み であって、上記脚の端部と嵌合して、上記プラットホームが上記ベースの下部面 から離れるのを妨げるが、上記プラットホームの任意の部分が上記ベースの下部 面方向に移動することを、上記プラットホームの他の部分の上記ベース方向への 移動とは無関係に許容する、凹みと、 上記ベース下部面と上記プラットホームとの間に配置され、上記プラットホーム 上の上記集積回路と電気的に接続するとともに、上記プラットホームを上記下部 面に対して空間を設けて支持する一方、上記下部面方向への上記プラットホーム の弾性移動を許容する、弾性コンタクトと、カバーおよび、該カバーを上記ベー スの壁の一つに隣接して上記ベースに結合して上記ベースに対する上記カバーの 回転移動を許容するヒンジと、上記ベースに対して上記カバーを解除可能に保持 して、上記集積回路を上記弾性コンタクトと接触する状態に保つ、ラッチと、を 備えるテストソケット。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US859,149 | 1992-03-27 | ||
| US07/859,149 US5247250A (en) | 1992-03-27 | 1992-03-27 | Integrated circuit test socket |
| PCT/US1993/001215 WO1993020675A1 (en) | 1992-03-27 | 1993-02-11 | Integrated circuit test socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07505255A true JPH07505255A (ja) | 1995-06-08 |
| JP3214858B2 JP3214858B2 (ja) | 2001-10-02 |
Family
ID=25330174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51742793A Expired - Fee Related JP3214858B2 (ja) | 1992-03-27 | 1993-02-11 | 集積回路用テストソケット |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5247250A (ja) |
| EP (1) | EP0632950B1 (ja) |
| JP (1) | JP3214858B2 (ja) |
| KR (1) | KR950701186A (ja) |
| DE (1) | DE69301393T2 (ja) |
| ES (1) | ES2082636T3 (ja) |
| WO (1) | WO1993020675A1 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007141869A (ja) * | 2007-02-28 | 2007-06-07 | 3M Co | コンタクト及びそれを用いた集積回路用ソケット |
| JPWO2021100449A1 (ja) * | 2019-11-21 | 2021-05-27 | ||
| KR20230026174A (ko) * | 2021-08-17 | 2023-02-24 | 미르텍알앤디 주식회사 | 반도체 테스트 소켓 및 그 제조 방법 |
Families Citing this family (71)
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|---|---|---|---|---|
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| JPH0677467B2 (ja) * | 1992-12-25 | 1994-09-28 | 山一電機株式会社 | Icソケット |
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| US7073254B2 (en) | 1993-11-16 | 2006-07-11 | Formfactor, Inc. | Method for mounting a plurality of spring contact elements |
| US5596282A (en) * | 1993-12-10 | 1997-01-21 | Texas Instruments Incorporated | Tester for integrated circuits |
| JPH07239363A (ja) * | 1994-01-06 | 1995-09-12 | Hewlett Packard Co <Hp> | 集積回路の試験アセンブリ、導電性ブリッジ装置および集積回路の試験方法 |
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| JP3256796B2 (ja) * | 1994-08-23 | 2002-02-12 | 日本テキサス・インスツルメンツ株式会社 | ソケット及びソケットを用いた電気部品の試験方法 |
| NL9401657A (nl) * | 1994-10-07 | 1996-05-01 | Framatome Connectors Belgium | Connector voor een substraat met een elektronische schakeling. |
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| US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
| US5923179A (en) * | 1996-03-29 | 1999-07-13 | Intel Corporation | Thermal enhancing test/burn in socket for C4 and tab packaging |
| JP3572795B2 (ja) * | 1996-04-22 | 2004-10-06 | 株式会社エンプラス | Icソケット |
| US5788526A (en) * | 1996-07-17 | 1998-08-04 | Minnesota Mining And Manufacturing Company | Integrated circuit test socket having compliant lid and mechanical advantage latch |
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| JP3761997B2 (ja) * | 1996-11-15 | 2006-03-29 | 株式会社アドバンテスト | Bgaパッケージ用icソケット |
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| JPH11162601A (ja) * | 1997-11-27 | 1999-06-18 | Texas Instr Japan Ltd | ソケット |
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| JP2001326046A (ja) * | 2000-05-17 | 2001-11-22 | Enplas Corp | コンタクトピン集合体、コンタクトピン組立体及び電気部品用ソケット |
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| JP4439151B2 (ja) * | 2001-10-31 | 2010-03-24 | 株式会社リコー | Icソケット |
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| JP4658081B2 (ja) * | 2007-03-06 | 2011-03-23 | 新科實業有限公司 | プローブ組立体、バーの研磨装置、およびバーの研磨方法 |
| TWM324868U (en) * | 2007-05-07 | 2008-01-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
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| RU2674582C1 (ru) * | 2017-10-20 | 2018-12-11 | Акционерное общество "Ангстрем" (АО "Ангстрем") | Контактное устройство |
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| CN115436675B (zh) * | 2021-06-04 | 2026-03-17 | 芯卓科技(浙江)有限公司 | 测试装置及其探针组件 |
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- 1992-03-27 US US07/859,149 patent/US5247250A/en not_active Expired - Lifetime
-
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- 1993-02-11 ES ES93905875T patent/ES2082636T3/es not_active Expired - Lifetime
- 1993-02-11 WO PCT/US1993/001215 patent/WO1993020675A1/en not_active Ceased
- 1993-02-11 JP JP51742793A patent/JP3214858B2/ja not_active Expired - Fee Related
- 1993-02-11 EP EP93905875A patent/EP0632950B1/en not_active Expired - Lifetime
- 1993-02-11 DE DE69301393T patent/DE69301393T2/de not_active Expired - Fee Related
-
1994
- 1994-09-22 KR KR1019940703284A patent/KR950701186A/ko not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007141869A (ja) * | 2007-02-28 | 2007-06-07 | 3M Co | コンタクト及びそれを用いた集積回路用ソケット |
| JPWO2021100449A1 (ja) * | 2019-11-21 | 2021-05-27 | ||
| WO2021100449A1 (ja) * | 2019-11-21 | 2021-05-27 | 株式会社ヨコオ | ソケットおよび工具 |
| CN114731019A (zh) * | 2019-11-21 | 2022-07-08 | 株式会社友华 | 插座及工具 |
| KR20230026174A (ko) * | 2021-08-17 | 2023-02-24 | 미르텍알앤디 주식회사 | 반도체 테스트 소켓 및 그 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO1993020675A1 (en) | 1993-10-14 |
| EP0632950B1 (en) | 1996-01-24 |
| DE69301393D1 (de) | 1996-03-07 |
| US5247250A (en) | 1993-09-21 |
| JP3214858B2 (ja) | 2001-10-02 |
| KR950701186A (ko) | 1995-02-20 |
| EP0632950A1 (en) | 1995-01-11 |
| ES2082636T3 (es) | 1996-03-16 |
| DE69301393T2 (de) | 1996-05-30 |
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