JPH0935927A - 複合磁性体及びそれを用いた電磁干渉抑制体 - Google Patents

複合磁性体及びそれを用いた電磁干渉抑制体

Info

Publication number
JPH0935927A
JPH0935927A JP7183911A JP18391195A JPH0935927A JP H0935927 A JPH0935927 A JP H0935927A JP 7183911 A JP7183911 A JP 7183911A JP 18391195 A JP18391195 A JP 18391195A JP H0935927 A JPH0935927 A JP H0935927A
Authority
JP
Japan
Prior art keywords
magnetic
electromagnetic interference
composite magnetic
composite
interference suppressor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7183911A
Other languages
English (en)
Japanese (ja)
Inventor
栄▲吉▼ ▲吉▼田
Eikichi Yoshida
Mitsuharu Sato
光晴 佐藤
Hidekuni Sugawara
英州 菅原
Hiroshi Shimada
島田　　寛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Priority to JP7183911A priority Critical patent/JPH0935927A/ja
Priority to TW085108847A priority patent/TW305048B/zh
Priority to KR1019970701959A priority patent/KR100267358B1/ko
Priority to HK98100186.7A priority patent/HK1001438B/en
Priority to EP96924176A priority patent/EP0785557B1/en
Priority to CNB961910607A priority patent/CN1135574C/zh
Priority to PCT/JP1996/002040 priority patent/WO1997004469A1/ja
Priority to DE69604771T priority patent/DE69604771T2/de
Publication of JPH0935927A publication Critical patent/JPH0935927A/ja
Priority to US10/660,875 priority patent/US6972097B2/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
    • H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/281—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials
    • H10W42/287—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials materials for magnetic shielding, e.g. ferromagnetic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Soft Magnetic Materials (AREA)
  • Aerials With Secondary Devices (AREA)
JP7183911A 1995-07-20 1995-07-20 複合磁性体及びそれを用いた電磁干渉抑制体 Pending JPH0935927A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP7183911A JPH0935927A (ja) 1995-07-20 1995-07-20 複合磁性体及びそれを用いた電磁干渉抑制体
TW085108847A TW305048B (2) 1995-07-20 1996-07-20
KR1019970701959A KR100267358B1 (ko) 1995-07-20 1996-07-22 복합자성체,이복합자성체를이용하는전자파간섭억제체,인쇄배선기판및전자장치와복합자성체를제조하기위한방법
HK98100186.7A HK1001438B (en) 1995-07-20 1996-07-22 Composite magnetic material and product for eliminating electromagnetic interference
EP96924176A EP0785557B1 (en) 1995-07-20 1996-07-22 Composite magnetic material and product for eliminating electromagnetic interference
CNB961910607A CN1135574C (zh) 1995-07-20 1996-07-22 复合磁性材料及其制造方法和应用
PCT/JP1996/002040 WO1997004469A1 (en) 1995-07-20 1996-07-22 Composite magnetic material and product for eliminating electromagnetic interference
DE69604771T DE69604771T2 (de) 1995-07-20 1996-07-22 Magnetisches kompositartikel und produkt zur unterdrückung von elektromagnetischen interferenzen
US10/660,875 US6972097B2 (en) 1995-07-20 2003-09-12 Composite magnetic material and electromagnetic interference suppressor member using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7183911A JPH0935927A (ja) 1995-07-20 1995-07-20 複合磁性体及びそれを用いた電磁干渉抑制体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006198083A Division JP3979541B2 (ja) 2006-07-20 2006-07-20 複合磁性体及びそれを用いた電磁干渉抑制体

Publications (1)

Publication Number Publication Date
JPH0935927A true JPH0935927A (ja) 1997-02-07

Family

ID=16143978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7183911A Pending JPH0935927A (ja) 1995-07-20 1995-07-20 複合磁性体及びそれを用いた電磁干渉抑制体

Country Status (7)

Country Link
EP (1) EP0785557B1 (2)
JP (1) JPH0935927A (2)
KR (1) KR100267358B1 (2)
CN (1) CN1135574C (2)
DE (1) DE69604771T2 (2)
TW (1) TW305048B (2)
WO (1) WO1997004469A1 (2)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187972A (ja) * 1997-09-01 1999-03-30 Tokin Corp 電磁干渉抑制体
JP2003178909A (ja) * 2001-12-10 2003-06-27 Mitsubishi Materials Corp 広い周波数帯域の高周波に対して優れた電波吸収特性を示す電波吸収体用混合粉末および電波吸収体
US6695985B2 (en) * 2001-06-12 2004-02-24 Nitto Denko Corporation Electromagnetic wave suppressor sheet
WO2004061876A1 (ja) * 2002-12-27 2004-07-22 Tdk Corporation グラ二ュラー物質、磁性薄膜、磁気素子
US6887412B1 (en) 1999-09-28 2005-05-03 Nec Tokin Corporation Composite magnetic sheet and method of producing the same
KR100712836B1 (ko) * 2005-11-02 2007-05-04 한국과학기술연구원 전자기파 간섭 차폐용 다층 필름 및 이를 포함하는회로기판
KR100716679B1 (ko) * 2005-10-27 2007-05-09 한국과학기술연구원 노이즈 감쇄층, 노이즈 감쇄 회로기판 및 이들의 제조방법
JP2008546169A (ja) * 2005-05-14 2008-12-18 フォルシュングスツェントルム カールスルーエ ゲゼルシャフト ミット ベシュレンクテル ハフツング 電磁波の反射を減衰するための装置、該装置の製造方法、ならびに該装置の使用
US7625640B2 (en) 2004-02-24 2009-12-01 Shin-Etsu Polymer Co., Ltd. Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function, and method of manufacturing the same
US7625633B2 (en) 2003-03-25 2009-12-01 Shin-Etsu Polymer., Ltd. Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods
WO2010004996A1 (ja) * 2008-07-10 2010-01-14 アルプス電気株式会社 熱伝導性ノイズ抑制シート
JP2010114407A (ja) * 2008-10-10 2010-05-20 Dowa Electronics Materials Co Ltd 混合フェライト粉およびその製造方法、並びに、電波吸収体
JP2012222076A (ja) * 2011-04-06 2012-11-12 Nec Tokin Corp 電磁干渉抑制体
US9595381B2 (en) 2011-10-24 2017-03-14 Lg Innotek Co., Ltd. Shielding apparatus and wireless power transmission apparatus
JP2017174949A (ja) * 2016-03-23 2017-09-28 Tdk株式会社 電子回路パッケージ
WO2019235539A1 (ja) * 2018-06-08 2019-12-12 マクセルホールディングス株式会社 電磁波吸収体、および、電磁波吸収体用組成物
US12090746B2 (en) 2018-03-30 2024-09-17 Daikin Industries, Ltd. Radio wave absorbing material and radio wave absorbing sheet

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3404618B2 (ja) * 1996-09-02 2003-05-12 エヌイーシートーキン株式会社 電磁干渉抑制体
US6284363B1 (en) 1998-03-23 2001-09-04 Fuji Polymer Industries Co., Ltd. Electromagnetic wave absorbing thermoconductive silicone gel molded sheet and method for producing the same
DK1097463T3 (da) * 1998-07-10 2003-02-17 Epcos Ag Magnetiserbart produkt, brugen af samme såvel som en fremgangsmåde til fremstilling af samme
JP2000058691A (ja) 1998-08-07 2000-02-25 Sharp Corp ミリ波半導体装置
JP2000133986A (ja) * 1998-10-27 2000-05-12 Murata Mfg Co Ltd 放射ノイズ抑制部品の取付構造
US6103134A (en) * 1998-12-31 2000-08-15 Motorola, Inc. Circuit board features with reduced parasitic capacitance and method therefor
DE19947130C1 (de) * 1999-09-30 2000-11-02 Siemens Ag Elektrisches Gerät mit in einem Gehäuse angeordneten und nach außen elektromagnetisch abgeschirmten Komponenten
JP2001126910A (ja) * 1999-10-25 2001-05-11 Tokin Corp 複合磁性体、複合磁性体シートおよびそれらの製造方法
DE10000523A1 (de) * 2000-01-08 2001-07-26 Inst Maschinen Antriebe Und El Ferrit-Compound-Material mit hoher elektromagnetischer Absorption im Frequenzbereich von 20 MHz bis 40 GHz
DE10016380C2 (de) * 2000-03-29 2002-01-24 Infineon Technologies Ag Gehäuse für ein elektrisches Bauteil
CN1288753C (zh) 2000-04-04 2006-12-06 Nec东金株式会社 电磁噪声抑制器、使用该抑制器的半导体器件及其制造方法
JP4623244B2 (ja) * 2000-04-11 2011-02-02 信越化学工業株式会社 電磁波吸収性熱伝導性シリコーンゴム組成物
DE10024439A1 (de) * 2000-05-19 2001-12-06 Koppe Franz Verguss- oder Einbettmasse mit elektromagnetischen Abschirmeigenschaften zur Herstellung elektronischer Bauteile
JP3723927B2 (ja) 2000-07-11 2005-12-07 日本ライナー株式会社 エポキシ樹脂を短時間で硬化する方法及び、該硬化方法によって得られたエポキシ樹脂硬化物による電磁波吸収方法
JP2002064189A (ja) * 2000-08-21 2002-02-28 Tokin Corp マグネティック・ランダム・アクセス・メモリ
JP2002374092A (ja) * 2001-06-15 2002-12-26 Polymatech Co Ltd 放熱性電波吸収体
DE10162637C1 (de) * 2001-12-20 2003-08-21 Eupec Gmbh & Co Kg Schaltungsanordnung mit elektronischen Bauelementen auf einem isolierenden Trägersubstrat
DE10229542B4 (de) * 2002-07-01 2004-05-19 Infineon Technologies Ag Elektronisches Bauteil mit mehrschichtiger Umverdrahtungsplatte und Verfahren zur Herstellung desselben
JP2004266784A (ja) * 2003-01-10 2004-09-24 Murata Mfg Co Ltd ノイズフィルタ
TW200628062A (en) * 2004-12-03 2006-08-01 Nitta Corp Electromagnetic interference suppressor, antenna device, and electron information transfer device
US8466764B2 (en) 2006-09-12 2013-06-18 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US9589716B2 (en) 2006-09-12 2017-03-07 Cooper Technologies Company Laminated magnetic component and manufacture with soft magnetic powder polymer composite sheets
US8941457B2 (en) 2006-09-12 2015-01-27 Cooper Technologies Company Miniature power inductor and methods of manufacture
US8378777B2 (en) 2008-07-29 2013-02-19 Cooper Technologies Company Magnetic electrical device
US8659379B2 (en) 2008-07-11 2014-02-25 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US9859043B2 (en) 2008-07-11 2018-01-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
DE102011087263A1 (de) * 2011-11-28 2013-05-29 Lenze Drives Gmbh Abschirmvorrichtung für elektrische Einheiten
CN103377787B (zh) * 2012-04-25 2016-06-01 比亚迪股份有限公司 一种nfc磁片用浆料及其制备方法和一种nfc磁片
CN102892279B (zh) * 2012-09-06 2015-09-02 刘伟德 一种电磁屏蔽材料、应用及其制造方法
US9418780B2 (en) 2012-12-06 2016-08-16 Samsung Electronics Co., Ltd. Magnetic composite material
CN104134513A (zh) * 2013-05-02 2014-11-05 杨立章 软磁复合薄膜和制造方法及其在电子设备中的应用
WO2015173196A1 (en) * 2014-05-14 2015-11-19 Dsm Ip Assets B.V. Soft magnetic material composition and component made from the material
CN108476604B (zh) 2015-10-27 2020-11-03 汉高股份有限及两合公司 用于低频emi屏蔽的导电组合物
WO2017078404A1 (ko) * 2015-11-02 2017-05-11 주식회사 아모그린텍 형상 이방성 자성 입자, 이를 포함하는 전자파 흡수시트 및 이를 포함하는 안테나 모듈
CN106229104A (zh) * 2016-08-31 2016-12-14 北京康普锡威科技有限公司 一种软磁复合粉末及其磁粉芯制备方法
JP6934660B2 (ja) * 2017-07-31 2021-09-15 北川工業株式会社 電磁波抑制シート
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KR100267358B1 (ko) 2000-10-16
KR970706588A (ko) 1997-11-03
EP0785557A4 (2) 1997-07-30
DE69604771T2 (de) 2000-03-09
EP0785557B1 (en) 1999-10-20
WO1997004469A1 (en) 1997-02-06
HK1001438A1 (en) 1998-06-19
EP0785557A1 (en) 1997-07-23
DE69604771D1 (de) 1999-11-25
CN1135574C (zh) 2004-01-21
TW305048B (2) 1997-05-11

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