JPH10507028A - データ記録デイスク・ドライブ用の集積型ヘッド/電子回路相互接続サスペンション - Google Patents
データ記録デイスク・ドライブ用の集積型ヘッド/電子回路相互接続サスペンションInfo
- Publication number
- JPH10507028A JPH10507028A JP9502748A JP50274897A JPH10507028A JP H10507028 A JPH10507028 A JP H10507028A JP 9502748 A JP9502748 A JP 9502748A JP 50274897 A JP50274897 A JP 50274897A JP H10507028 A JPH10507028 A JP H10507028A
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- 239000000725 suspension Substances 0.000 title claims abstract description 119
- 230000008859 change Effects 0.000 claims abstract description 23
- 238000006880 cross-coupling reaction Methods 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims description 23
- 230000007704 transition Effects 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000010292 electrical insulation Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 2
- 230000009467 reduction Effects 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims 4
- 238000009987 spinning Methods 0.000 claims 2
- 230000005855 radiation Effects 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 230000001965 increasing effect Effects 0.000 description 7
- 239000004952 Polyamide Substances 0.000 description 6
- 229920002647 polyamide Polymers 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002592 echocardiography Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002847 impedance measurement Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09272—Layout details of angles or corners
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Moving Of Heads (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.データ面(8)を備えたディスクと、ディスクのデータ面近くに維持された スライダ(27)に取り付けられ、ディスクにデータを書き込みディスクからデ ータを読み取るための変換器(28)と、ディスクを横切ってスライダを移動さ せるアクチュエータと、変換器に電気的に接続された電子回路モジュールとを有 するタイプのデータ記録ディスク・ドライブ用のサスペンション(12)であっ て、 ベース層(35)と、 ベース層上に複数の導電性トレース(34)として形成され、前記変換器(2 8)とその各端部の近くに変換器および電子回路モジュールへの電気接続のため のボンディング領域(31、32)をそれぞれ有し、前記電子回路モジュールと を相互接続する、第1の導電層(24、36、37、55、60、66、70、 75、80、85、90、96、105)と、 変換器と電子回路モジュールとの間でデータを転送する際に、各トレースの特 性インピーダンスの急激な変化を防止するための積層構造上の手段と を含む積層構造であるサスペンション。 2.トレース(55、60)の一方が狭くなった部分(57、59)を含み、 防止手段が、狭くなった部分の各端部の近くの移行領域 (63)であり、移行領域の幅が、トレースの幅から狭くなった部分の幅へと緩 やかに変化し、それにより、狭くなった部分によって生じるトレースに沿った電 気信号の反射が最小限に抑えられることを特徴とする請求項1に記載のサスペン ション(12)。 3.トレース(66、70、75)のうちの1つが、トレースの幅よりも大きな 幅を有する、電気接続を容易にするためのボンディング領域を有し、 防止手段が、ボンディング領域の近くの移行領域(67、72、77)であり 、移行領域の幅が、トレースの幅からボンディング領域の幅へと緩やかに変化し 、それにより、ボンディング領域によって生じるトレースに沿った電気信号の反 射が最小限に抑えられることを特徴とする請求項1に記載のサスペンション(1 2)。 4.トレース(80)のうちの1つが、導体層の平面内で内側半径(83)を有 する湾曲部(81)を含み、防止手段が、湾曲部の領域におけるトレースの一般 に一定な幅(82)と、トレースの一般に一定な幅よりも大きな値の湾曲部の内 側半径であり、それにより、湾曲部によって生じるトレースに沿った電気信号の 反射が最小限に抑えられることを特徴とする請求項1に記載のサスペンション( 12)。 5.さらに第2の変換器を含み、各変換器が、データ面からデータを読み取るた めの少なくとも1つの読取りトレース(36)と、データ面にデータを書き込む ための少なくとも 1つの書込みトレース(37)とを備え、読取りトレースが一緒にまとめられ、 書込みトレースが一緒にまとめられ、読取りトレースが、読取りトレースと書込 みトレースの間の信号のクロスカップリングを最小にするのに十分な距離だけ書 込みトレースから離れて配置されることを特徴とする請求項1に記載のサスペン ション(12)。 6.読取りトレース(36)のボンディング領域が一緒にまとめられ、書込みト レース(37)のボンディング領域が一緒にまとめられ、読取りトレースのボン ディング領域が、読取りトレースのボンディング領域と書込みトレースのボンデ ィング領域の間の信号のクロスカップリングを最小にするのに十分な距離だけ書 込みトレースから離れて配置されることを特徴とする請求項5に記載のサスペン ション(12)。 7.防止手段が、 第1の導電層(34)とベース層(35)の間にあって、トレースに沿った電 気信号の反射を最小にするようにパターン形成されたバックプレーンを形成する 第2の導電層(40、86、93、97、107)と、 第1と第2の導電層の間の第1の電気絶縁層(41)と を含むことを特徴とする請求項1に記載のサスペンション(12)。 8.バックプレーン(86)が開口(87)を有し、トレース(85)のうちの 少なくとも1つが開口の周辺部分(88)の上に位置し、開口の前記周辺部分が 、トレースの長手軸に 対して直角でなく、それにより開口によって生じるトレースに沿った電気信号の 反射が最小限に抑えられることを特徴とする請求項7に記載のサスペンション( 12)。 9.バックプレーン(93)が開口(92)を有し、トレース(90)のうちの 少なくとも1つが開口の上に位置し、トレースの幅が開口の上の領域(91)で 広く、それにより開口によって生じるトレースに沿った電気信号の反射が最小限 に抑えられることを特徴とする請求項7に記載のサスペンション(12)。 10.広くなった領域(91)が、各端部の近くに移行領域(94)を含み、各 移行領域の幅が、トレースの幅から広くなった領域の幅へと緩やかに変化し、そ れにより、広くなった領域によって生じるトレースに沿った電気信号の反射が最 小限に抑えられることを特徴とする請求項9に記載のサスペンション(12)。 11.バックプレーン(97)が開口(98)を有し、トレース(96)のうち の少なくとも1つが開口の上に位置し、トレースが、開口の上の領域におけるト レースの特性インピーダンスの減少を補償するために、開口の近くでトレースの 側縁部から延びる横方向の拡張部(99)を含み、それにより、開口によって生 じるトレースに沿った電気信号の反射が最小限に抑えられることを特徴とする請 求項7に記載のサスペンション(12)。 12.トレース(105)のうちの1つが、トレースの幅よ り大きな幅を有し電気接続を容易にするためのボンディング領域(106)を有 し、バックプレーン(107)が、ボンディング領域におけるトレースの特性イ ンピーダンスの減少を補償するために、ボンディング領域の下で部分的に除去さ れ、それにより、ボンディング領域によって生じるトレースに沿った電気信号の 反射が最小限に抑えられることを特徴とする請求項7に記載のサスペンション( 12)。 13.ボンディング領域の近くの領域におけるトレースの特性インピーダンスの 変化を補償するために、ボンディング領域(106)の下にバックプレーン(1 07)のトレース状部分(108)をさらに含み、トレース状部分が、トレース の幅とほぼ同じ幅を有し、トレースの真下にあるバックプレーンの残り部分から 、一般にトレースの長手軸の方向に延び、それにより、部分的に除去されたバッ クプレーンによって生じるトレースにおける電気信号の反射が最小限に抑えられ ることを特徴とする請求項12に記載のサスペンション(12)。 14.ボンディング領域(106)の下のトレース状部分(108)がさらに、 トレース状部分とバックプレーン(107)の残り部分の間に移行領域(110 )を含み、バックプレーンの残り部分近くの領域における移行領域の幅が、トレ ース状部分の幅よりも広く、トレース状部分の幅に向かって徐々に狭くなり、そ れにより、バックプレーンのトレース状部分によって生じるトレースにおける電 気信号の反射が最小限に抑えられることを特徴とする請求項13に記載のサス ぺンション(12)。 15.ベース層(35)が、第2の導電層(47)と、第1(34)と第2の導 電層の間の電気絶縁層(48)とを含むことを特徴とする請求項1に記載のサス ペンション(12)。 16.データ面を備えた回転ディスク(6)と、ディスクの回転中にデータ面か らデータを読み取りあるいはデータ面にデータを書き込むために、変換器をディ スクに対して一般に半径方向に移動させるアクチュエータ(5)と、データ面か ら読み取ったデータおよびデータ面に書き込んだデータを処理するための電子回 路モジュールとを有するタイプのデータ記録ディスク・ドライブ用の変換器/ス ライダ/サスペンション/アーム・アセンブリであって、 ディスクが回転しているときにデータ面に対して動作可能な位置関係に維持さ れるスライダ(10)と、 スライダに取り付けられた、データ面からデータを読み取りデータを書き込む ための変換器(9)と、 2つの端部を有し、その第1の端部が前記スライダに取り付けられた請求項1 ないし15のいずれか一項に記載の積層サスペンション(12)と、 2つの端部を有し、その第1の端部がサスペンションの第2の端部に取り付け られ、第2の端部がアクチュエータに取り付けられた一般に剛性の支持アーム( 11)と を含む変換器/スライダ/サスペンション/アーム・アセンブリ。 17.同心円データ・トラックのデータ面を有するディスク(16)と、 ディスクに取り付けられ、ディスクに対して一般に直角な軸の周りでディスク を回転させる手段(4、7)と、 ディスクが回転しているときにディスク表面に対して動作可能な位置関係に維 持されるスライダ(10)と、 スライダに取り付けられた、データ面からデータを読み取りデータ面にデータ を書き込むための変換器(9)と、 変換器がデータ・トラックにアクセスできるようにディスクに対して一般に半 径方向にスライダを移動させるアクチュエータ(5)と、 データ面から読み取ったデータおよびデータ面に書き込んだデータを処理する ための電子回路モジュールと、 2つの端部を有し、その第1の端部が前記スライダに取り付けられた請求項1 ないし15のいずれか一項に記載の積層サスペンション(12)と、 2つの端部を有し、その第1の端部がサスペンションの第2の端部に取り付け られ、第2の端部がアクチュエータに取り付けられた一般に剛性の支持アーム( 11)と を含むデータ記録ディスク・ドライブ。
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/489,310 US5608591A (en) | 1995-06-09 | 1995-06-09 | Integrated head-electronics interconnection suspension for a data recording disk drive |
| US489,310 | 1995-06-09 | ||
| US08/489,310 | 1995-06-09 | ||
| PCT/GB1996/000290 WO1996042080A1 (en) | 1995-06-09 | 1996-02-09 | Integrated head-electronics interconnection suspension for a data recording disk drive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10507028A true JPH10507028A (ja) | 1998-07-07 |
| JP3124777B2 JP3124777B2 (ja) | 2001-01-15 |
Family
ID=23943314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09502748A Expired - Lifetime JP3124777B2 (ja) | 1995-06-09 | 1996-02-09 | データ記録デイスク・ドライブ用の集積型ヘッド/電子回路相互接続サスペンション |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US5608591A (ja) |
| EP (1) | EP0830671B1 (ja) |
| JP (1) | JP3124777B2 (ja) |
| KR (1) | KR100288806B1 (ja) |
| CN (1) | CN1143273C (ja) |
| CA (1) | CA2217733A1 (ja) |
| DE (1) | DE69613696T2 (ja) |
| MY (1) | MY112511A (ja) |
| TW (1) | TW276333B (ja) |
| WO (1) | WO1996042080A1 (ja) |
| ZA (1) | ZA963195B (ja) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006278734A (ja) * | 2005-03-29 | 2006-10-12 | Nitto Denko Corp | 配線回路基板 |
| JP2007019261A (ja) * | 2005-07-07 | 2007-01-25 | Nitto Denko Corp | 配線回路基板 |
| JP2007035868A (ja) * | 2005-07-26 | 2007-02-08 | Nitto Denko Corp | 配線回路基板の製造方法 |
| JP2007088056A (ja) * | 2005-09-20 | 2007-04-05 | Nitto Denko Corp | 配線回路基板 |
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- 1996-02-09 JP JP09502748A patent/JP3124777B2/ja not_active Expired - Lifetime
- 1996-02-09 CN CNB961946717A patent/CN1143273C/zh not_active Expired - Lifetime
- 1996-02-09 KR KR1019970706570A patent/KR100288806B1/ko not_active Expired - Fee Related
- 1996-02-09 WO PCT/GB1996/000290 patent/WO1996042080A1/en not_active Ceased
- 1996-02-09 DE DE69613696T patent/DE69613696T2/de not_active Expired - Lifetime
- 1996-02-09 CA CA002217733A patent/CA2217733A1/en not_active Abandoned
- 1996-04-22 ZA ZA963195A patent/ZA963195B/xx unknown
- 1996-05-15 MY MYPI96001827A patent/MY112511A/en unknown
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006278734A (ja) * | 2005-03-29 | 2006-10-12 | Nitto Denko Corp | 配線回路基板 |
| US8134080B2 (en) | 2005-07-07 | 2012-03-13 | Nitto Denko Corporation | Wired circuit board |
| JP2007019261A (ja) * | 2005-07-07 | 2007-01-25 | Nitto Denko Corp | 配線回路基板 |
| JP2007035868A (ja) * | 2005-07-26 | 2007-02-08 | Nitto Denko Corp | 配線回路基板の製造方法 |
| JP2007088056A (ja) * | 2005-09-20 | 2007-04-05 | Nitto Denko Corp | 配線回路基板 |
| US8266794B2 (en) | 2006-08-30 | 2012-09-18 | Nitto Denko Corporation | Method of producing a wired circuit board |
| JP2008276927A (ja) * | 2007-05-04 | 2008-11-13 | Hutchinson Technol Inc | トレース間隔が漸減する集積導線ヘッドサスペンション |
| US8760815B2 (en) | 2007-05-10 | 2014-06-24 | Nitto Denko Corporation | Wired circuit board |
| JP2008109147A (ja) * | 2007-11-12 | 2008-05-08 | Nitto Denko Corp | 配線回路基板 |
| JP2008103745A (ja) * | 2007-11-12 | 2008-05-01 | Nitto Denko Corp | 配線回路基板の製造方法 |
| JP2010135754A (ja) * | 2008-11-10 | 2010-06-17 | Nitto Denko Corp | 配線回路基板およびその製造方法 |
| US7923644B2 (en) | 2008-11-10 | 2011-04-12 | Nitto Denko Corporation | Printed circuit board and method of manufacturing the same |
| JP2012099182A (ja) * | 2010-11-02 | 2012-05-24 | Dainippon Printing Co Ltd | サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ、並びにサスペンション用基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1187897A (zh) | 1998-07-15 |
| JP3124777B2 (ja) | 2001-01-15 |
| MY112511A (en) | 2001-06-30 |
| CA2217733A1 (en) | 1996-12-27 |
| TW276333B (en) | 1996-05-21 |
| EP0830671B1 (en) | 2001-07-04 |
| CN1143273C (zh) | 2004-03-24 |
| WO1996042080A1 (en) | 1996-12-27 |
| DE69613696T2 (de) | 2002-05-08 |
| HK1008606A1 (en) | 1999-05-14 |
| EP0830671A1 (en) | 1998-03-25 |
| KR19980703167A (ko) | 1998-10-15 |
| ZA963195B (en) | 1996-12-09 |
| US5608591A (en) | 1997-03-04 |
| DE69613696D1 (de) | 2001-08-09 |
| KR100288806B1 (ko) | 2001-05-02 |
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