JPH11261074A5 - - Google Patents

Info

Publication number
JPH11261074A5
JPH11261074A5 JP1998082947A JP8294798A JPH11261074A5 JP H11261074 A5 JPH11261074 A5 JP H11261074A5 JP 1998082947 A JP1998082947 A JP 1998082947A JP 8294798 A JP8294798 A JP 8294798A JP H11261074 A5 JPH11261074 A5 JP H11261074A5
Authority
JP
Japan
Prior art keywords
film
wiring
valve metal
semiconductor device
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1998082947A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11261074A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP10082947A priority Critical patent/JPH11261074A/ja
Priority claimed from JP10082947A external-priority patent/JPH11261074A/ja
Priority to US09/210,781 priority patent/US6369410B1/en
Publication of JPH11261074A publication Critical patent/JPH11261074A/ja
Priority to US10/101,830 priority patent/US6613614B2/en
Publication of JPH11261074A5 publication Critical patent/JPH11261074A5/ja
Withdrawn legal-status Critical Current

Links

JP10082947A 1997-12-15 1998-03-13 半導体装置およびその作製方法 Withdrawn JPH11261074A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP10082947A JPH11261074A (ja) 1998-03-13 1998-03-13 半導体装置およびその作製方法
US09/210,781 US6369410B1 (en) 1997-12-15 1998-12-15 Semiconductor device and method of manufacturing the semiconductor device
US10/101,830 US6613614B2 (en) 1997-12-15 2002-03-21 Semiconductor device and method of manufacturing the semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10082947A JPH11261074A (ja) 1998-03-13 1998-03-13 半導体装置およびその作製方法

Publications (2)

Publication Number Publication Date
JPH11261074A JPH11261074A (ja) 1999-09-24
JPH11261074A5 true JPH11261074A5 (th) 2005-07-21

Family

ID=13788423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10082947A Withdrawn JPH11261074A (ja) 1997-12-15 1998-03-13 半導体装置およびその作製方法

Country Status (1)

Country Link
JP (1) JPH11261074A (th)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6580094B1 (en) * 1999-10-29 2003-06-17 Semiconductor Energy Laboratory Co., Ltd. Electro luminescence display device
CA2779602A1 (en) * 2009-11-11 2011-05-19 Kaz, Incorporated Cuff for arterial blood pressure monitor
US9290695B2 (en) 2013-04-19 2016-03-22 Joled Inc Method for manufacturing a thin-film semiconductor device using an etching solution for an aluminum oxide film

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