JPS5459877A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5459877A
JPS5459877A JP12659577A JP12659577A JPS5459877A JP S5459877 A JPS5459877 A JP S5459877A JP 12659577 A JP12659577 A JP 12659577A JP 12659577 A JP12659577 A JP 12659577A JP S5459877 A JPS5459877 A JP S5459877A
Authority
JP
Japan
Prior art keywords
resin
chip
bonding
suction hole
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12659577A
Other languages
Japanese (ja)
Inventor
Masanobu Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12659577A priority Critical patent/JPS5459877A/en
Publication of JPS5459877A publication Critical patent/JPS5459877A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To increase bonding strength by providing a suction hole pernetrating to both front and back sides at the central part of a semiconductor chip mounting face and removing excess bonding solder or resin etc. through a suction pipe from the back of said suction hole at the time of bonding a semiconductor chip.
CONSTITUTION: A suction hole 6 penetrating to both front and back sides of a case or circuit plate 3 for mounting a semiconductor chip 1 is formed to the central part thereof. At the time of bonding the chip 1 to the circuit plate 3 by using solder, resin 2 with such constitution, a suction pipe 7 is connected to the suction hole 6 and the resin is sucked with a vacuum pump. Then, the air bubbles 4 or excess resins 8 are removed from the solder, resin 2, etc. and therefore the thickness (t) of the resin layer do not become thicker than required and the air bubbles are eliminated, thereby improving the bonding strength. Further, creeping up of the resin 2 to the side face of the chip 1 is obviated and cracking and short-circuiting of the chip will not occur
COPYRIGHT: (C)1979,JPO&Japio
JP12659577A 1977-10-20 1977-10-20 Production of semiconductor device Pending JPS5459877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12659577A JPS5459877A (en) 1977-10-20 1977-10-20 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12659577A JPS5459877A (en) 1977-10-20 1977-10-20 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5459877A true JPS5459877A (en) 1979-05-14

Family

ID=14939066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12659577A Pending JPS5459877A (en) 1977-10-20 1977-10-20 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5459877A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3300463A1 (en) * 2016-09-26 2018-03-28 Hitachi Power Semiconductor Device, Ltd. Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5015481A (en) * 1973-06-08 1975-02-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5015481A (en) * 1973-06-08 1975-02-18

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3300463A1 (en) * 2016-09-26 2018-03-28 Hitachi Power Semiconductor Device, Ltd. Semiconductor device

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